CN207021277U - A kind of remote fluorescence LED component - Google Patents
A kind of remote fluorescence LED component Download PDFInfo
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- CN207021277U CN207021277U CN201720997592.8U CN201720997592U CN207021277U CN 207021277 U CN207021277 U CN 207021277U CN 201720997592 U CN201720997592 U CN 201720997592U CN 207021277 U CN207021277 U CN 207021277U
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- package substrate
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- heating column
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Abstract
A kind of LED component is the utility model is related to, more particularly to a kind of remote fluorescence LED component.Remote fluorescence LED component of the present utility model includes package substrate, blocks of solid fluorescent material, the radiator with heating column, blue-light LED chip and transparent filling substance；Wherein, the package substrate is provided with functional area, and through hole is further set in the functional area；The functional areas are used to fix the blue-light LED chip, and the electrode of the blue-light LED chip and package substrate, which is realized, to be electrically connected with；The quantity of the through hole is at least 2；The blocks of solid fluorescent material is affixed on the surface of LED package substrate functional areas, and forms cavity with the functional areas of package substrate；The transparent filling substance fills up the cavity；The through hole of heating column insertion package substrate functional areas on the radiator, makes radiator be completely attached to package substrate.
Description
Technical field
A kind of LED component is the utility model is related to, more particularly to a kind of remote fluorescence LED component.
Background technology
With technological progress and the expansion of application field, high-power LED light source is increasingly valued by people.Tradition
LED light source is usually to be packaged using fluorescent material mixing organic colloid, and such packaged type causes fluorescent material to be close to LED core
Piece.When power is smaller, the packing forms are effective and feasible, but as power density increases, in particular by integration packaging
Mode when, two high-power thermals source can be mutually superimposed.This can cause the very fast rise of the junction temperature of LED chip, and fluorescent material can go out
Now decaying, even carbonization occurs in organic colloid simultaneously for aging, so as to cause light source light-emitting efficiency to reduce life-span reduction.
In order to solve the heat-resisting and heat dissipation problem of high-power LED light source fluorescent material, blocks of solid fluorescent material combines remote
The mode of excitation of journey fluorescence is used more and more widely.Although patent of invention 201310493235.4 has used remote fluorescence
Mode of excitation, but do not use silicone filler between LED chip and block fluorescent material.Its not beneficial effect is to add
The total reflection of chip interface, reduce the external quantum efficiency of chip.The hanging design of remote fluorescence material simultaneously is also unfavorable for very much
The radiating of fluorescent material itself.
Conventional long-range blocks of solid fluorescent material high power LED integration packaging is (also including encapsulating on plate or being sealed for COB
Dress) mode is：(the generally material of high reflectance) fixed LED chip, usually plurality of LEDs in the functional areas of package substrate
Chip carries out orderly array and put, and (is closed with the operation being electrically connected using the requirement of electric current according still further to cut-in voltage
The connection in series-parallel quantity of reason), the functional areas of heat-radiating substrate are filled up with silica gel or the silica gel for being mixed with fluorescent material, then by block fluorescence
Material is affixed on the top of functional areas, finally toasted to solidify silica gel.This high-power LED light source structure and method for packing are easy
Producing the dislocation of block fluorescent material, (because drying glue process will undergo the process that a silica gel viscosity diminishes, this stage bulk is glimmering
Luminescent material is easily slided) and functional areas air bubble problem (bubble may be enclosed during the fitting of block fluorescent material, during silica gel baking
Microbubble, which merges to become, can not discharge greatly).
Patent of invention 201510602713.X is also provided that a kind of packaged type of remote fluorescence, i.e., on heat-radiating substrate
An injection through hole is provided with, and fluid media (medium) is injected toward injection through hole is interior.The viscosity of the fluid media (medium) is 30-1000mm2/ s, its
Purpose is for serving as coolant.Dislocation caused by not solving block fluorescent material application silicone filler and bonding is asked with bubble
Topic.Current silica gel used in great power LED on the market simultaneously, its viscosity is all in 3000mm2/ more than s, therefore its simple one
The design of injection through hole can not solve problem above well.
This method is not radiated effectively effectively to blocks of solid fluorophor simultaneously, easily makes blocks of solid fluorescence
The temperature rise of material, quantum efficiency reduce.Larger temperature ladder is produced at the center of blocks of solid fluorophor and edge simultaneously
Degree, the thermal stress of fluorescent material is added, greatly enhance its possibility being broken.
Patent of invention 201510965435.4 and the LED component for applying the mode of remote fluorescence to realize, while the invention
Patent it is also proposed to radiate using heating column to solid fluorescent material.But its technical spirit invented is on package substrate
Heating column is installed again, and the connected mode of heating column and package substrate connects for colloid.Such structure is in solid fluorescent material
With device using when radiator between have the hot interface at three hot interfaces, respectively solid state fluorescent material and heating column；Heat conduction
The hot interface between hot interface and package substrate and radiator between post and package substrate.Because its technical spirit is by heating column
It is adhered to organic colloid on heat-radiating substrate, and the thermal conductivity of organic colloid is generally below 0.2W ˙ m-1˙K-1, this boundary
Face will substantially reduce the radiating effect to solid state fluorescence body by as the maximum restraining factors in this passage of heat.And if made
It is more than 1W ˙ m with thermal conductivity-1˙K-1Above organic binding agent, the usual reflectivity of such binding agent is relatively low, and this will be largely effected on
The light extraction efficiency of LED chip.So the presence at the hot interface will influence the radiating effect of solid state fluorescent material.
Utility model content
The utility model provides a kind of remote fluorescence LED component, improves the system of remote fluorescence LED component described above
Problem that is standby and effectively radiating.
The technical solution of the utility model is：
A kind of remote fluorescence LED component, include package substrate, blocks of solid fluorescent material, the radiator with heating column, indigo plant
Light LED chip and transparent filling substance；
Wherein, the package substrate is provided with functional area, and through hole is further set in the functional area；
The functional areas are used to fix the blue-light LED chip, and the electrode of the blue-light LED chip and package substrate is realized
It is electrically connected with；
The quantity of the through hole is at least 2；
The blocks of solid fluorescent material is affixed on the surface of LED package substrate functional areas, and with the function of package substrate
Area forms cavity；
The transparent filling substance fills up the cavity；
The through hole of heating column insertion package substrate functional areas on the radiator, makes radiator be connect completely with package substrate
Touch.
Wherein, do not limited for the shape of the through hole, to can be inserted into the shape of the heating column of any model radiator,
It is for example, circular, rectangle, arc or all shapes that can be machined such as fan-shaped.
According to the utility model, the blocks of solid fluorescent material can be the ceramic material with fluorescent functional, monocrystalline
Material, vitreum material or organic material.
According to the utility model, it is not particularly limited for the shapes and sizes of the blocks of solid fluorescent material, with envelope
The functional areas for filling substrate form a cavity, such as can be sheet, hemispherical of the diameter slightly larger than the functional area
Or dome shape.
According to the utility model, it is not particularly limited for the transparent filling substance, for for filling package substrate and block
Shape solid fluorescent material, such as can be packaging silicon rubber.
According to the utility model, heating column on the radiator for high heat conduction not the aluminium post of extinction, electroplate copper post,
Sapphire rods or aluminium oxide ceramics post.
The distance of the heating column and the blocks of solid fluorescent material is 0-3mm, preferably 0-2mm, is most preferably led
The lower surface of plume and blocks of solid fluorescent material completely attaches to.
The diameter of the heating column is not more than the diameter of the through hole.
The beneficial effects of the utility model：
1) LED light source described in the utility model is by the way of blue-light LED chip remote excitation blocks of solid fluorescent material
White light is obtained, blocks of solid fluorescent material is positioned over the top of LED package substrate light-emitting area, and complete with package substrate composition one
The cavity of whole closing, while described package substrate is provided with through hole in functional areas, the heating column on described radiator runs through
Through hole and close or full contact blocks of solid fluorescent material in the functional areas of package substrate, are carried for blocks of solid fluorescent material
For passage of heat.
2) remote fluorescence LED device structure described in the utility model, the LED devices of solid fluorescent material base are efficiently solved
Encapsulating problem of the part in preparation process；In addition, the heating column of LED package substrate is directly penetrated simultaneously, and directly and heat conduction
The radiator of post connection, directly eliminates the hot interface between heating column and package substrate, and the heat between heating column and radiator
Interface, alloing the blocks of solid fluorescent material, caused heat is directly directed on radiator in use, is carried significantly
The high capacity of heat transmission, while the light extraction of LED chip will not be caused damage, effectively improve the radiating of remote fluorescence LED component
The problem of.
Brief description of the drawings
The schematic diagram of Fig. 1 embodiment 1LED device architectures.
The side view of Fig. 2 embodiment 1LED device architectures.
The schematic diagram of Fig. 3 embodiment 2LED device architectures.
The schematic diagram of Fig. 4 embodiment 3LED device architectures.
Wherein, each reference implication is as follows in Fig. 1-4：Package substrate 10, functional areas 12, blue-light LED chip 20, through hole
11st, blocks of solid fluorescent material 30, cavity 40, heating column 51, radiator 50.
Embodiment
Remote fluorescence LED component of the present utility model is done below in conjunction with specific embodiment further specifically
It is bright.The following example is merely illustrative ground description and interpretation the utility model, and is not necessarily to be construed as protecting the utility model
The limitation of scope.All technologies realized based on the utility model the above are encompassed by the model that the utility model is intended to protection
In enclosing.
Unless otherwise indicated, the parts used in following examples are commercial goods, or can pass through known method
Prepare.
Embodiment 1 is as shown in figure 1, the LED package substrate 10 that the present embodiment uses is aluminium oxide ceramics package substrate, its work(
Energy area 12 is circular, blue-light LED chip 20 of uniformly being arranged in its circular functional areas, in the center of functional areas and edge
Provided with multiple manholes 11.Blocks of solid fluorescent material 30 is Ce:YAG ceramics, its profile is disc, and its diameter is slightly larger than
Functional areas diameter of a circle.Will in the circumferential edges smearing industry of blocks of solid fluorescent material commonly use LED packaging silicon rubbers, after should
Blocks of solid fluorescent material 30 is affixed on the package substrate 10 for being mounted with LED chip.Blocks of solid fluorescent material 30 and LED
The center of circle of the functional areas 12 of package substrate 10 is coaxial.LED component is put into oven cooking cycle after installation, so that silica gel solidifies.
After silica gel solidifies, a cavity 40 is formed between blocks of solid fluorescent material 30 and package substrate 10, as shown in Figure 2.Again will envelope
Dress silica gel is injected in the cavity 40 by the manhole 11 at package substrate center.Packaging silicon rubber during cavity 40 is injected,
Gradually the air in cavity is discharged by other through holes at package substrate edge, the effect finally reached is that silica gel takes completely
Cavity 40, the air bubble of noresidue.Again by the heating column on the radiator 50 with heating column 51 in Fig. 1 and Fig. 2 according to contraposition
Requirement, insert in the through hole of package substrate corresponding size, heating column 51 be solid copper pin, electroplate, heating column 51 for
What the surface of copper radiator 50 milled out.The lower surface of heating column is concordant with the upper surface of package substrate, upper surface and blocks of solid
The distance of fluorophor is less than 0.2mm.The LED component for inserting silver-plated copper heating column is put into oven cooking cycle, so as to fill up cavity 40
Silica gel solidification, so as to complete the manufacturing process of whole device.
Embodiment 2 as shown in figure 3, the LED package substrate 10 that uses of the present embodiment is the copper base of the electrosilvering of functional areas 12,
Its functional areas 12 is circle, blue-light LED chip 20 of uniformly being arranged in its circular functional areas, circular arc is distributed with functional areas 12
The through hole 11 of shape, the through hole of circular arc is all using the circle of functional areas 12 as the center of circle.Similar with the method for embodiment 1, blocks of solid is glimmering
Luminescent material 30 is fluorescent material vitreum, and its profile is disc, and its diameter is slightly larger than functional areas diameter of a circle.Blocks of solid is glimmering
In the circumferential edges smearing industry of luminescent material 30 commonly use LED packaging silicon rubbers, after the blocks of solid fluorescent material is affixed on
It is mounted with the substrate 10 of LED chip 20.Blocks of solid fluorescent material 30 and the center of circle of the functional areas 12 of LED package substrate 10 are total to
Axle.Light source is put into oven cooking cycle after installation, so that silica gel solidifies.After silica gel solidifies, blocks of solid fluorescent material 30
A cavity 40 is formed between package substrate 10.Packaging silicon rubber is injected into the sky by the circular arc through hole 11 of a functional areas part again
In chamber 40.Packaging silicon rubber is during cavity 40 is injected, gradually by the air in cavity by the row of another part arc-shaped through-hole 11
Go out, the effect finally reached is, silica gel takes cavity 40 completely, and the air bubble of noresidue.Again will be similar with via hole profile, but
Heating column 51 on the radiator 50 of undersized inserts through hole, and the material of heating column 51 is aluminium, and surface is by polishing.Heating column
51 lower surface is concordant with the lower surface of package substrate 10, and upper surface and the distance of blocks of solid fluorescent material are less than 3mm.It will insert
The LED component for entering heating column is put into oven cooking cycle, so as to the silica gel solidification of cavity 40 be filled up, so as to complete the making of whole device
Process.
As shown in figure 3, the LED package substrate 10 that the present embodiment uses is mirror-surface aluminum base board, its functional areas 12 is embodiment 3
Circle, while there is the effect of minute surface, blue-light LED chip 20 of uniformly being arranged in its circular functional areas, divide in functional areas 12
It is furnished with the through hole 11 of strip.Similar with the method for embodiment 1, blocks of solid fluorescent material 30 is Ce:YAG monocrystalline, its profile
For disc, its diameter is slightly larger than functional areas diameter of a circle.After the circumferential edges plating metal of blocks of solid fluorescent material 30,
The blocks of solid fluorescent material 30 is affixed on the substrate 10 for being mounted with LED chip 20.Blocks of solid fluorescent material 30 with
The center of circle of the functional areas 12 of LED package substrate 10 is coaxial.By blocks of solid fluorescence by way of metal welding after installation
Material 30 bonds with package substrate 10, forms a cavity 40 therebetween.Through hole 11 by packaging silicon rubber by a functional areas part again
Inject in the cavity 40.Packaging silicon rubber is during cavity 40 is injected, gradually by the air in cavity by another part through hole
11 discharges, the effect finally reached is, silica gel takes cavity 40 completely, and the air bubble of noresidue.Again will be with via hole profile class
Seemingly, the heating column 51 but on the radiator 50 of undersized inserts through hole, and heating column 51 is to be milled out on the surface of aluminium radiator 50
Profile.The lower surface of heating column 51 is concordant with the lower surface of package substrate 10, and upper surface connects with blocks of solid fluorescent material
Touch.The LED component for inserting heating column is put into oven cooking cycle, so as to the silica gel solidification of cavity 40 be filled up, so as to complete whole device
The manufacturing process of part.
More than, embodiment of the present utility model is illustrated.But the utility model is not limited to above-mentioned implementation
Mode.All any modification, equivalent substitution and improvements within the spirit and principles of the utility model, done etc., should be included in
Within the scope of protection of the utility model.
Claims (10)
1. a kind of remote fluorescence LED component, it is characterised in that comprising package substrate, blocks of solid fluorescent material, with heating column
Radiator, blue-light LED chip and transparent filling substance；The package substrate is provided with functional area, enters one in the functional area
Step sets through hole；
The functional areas are used to fix the blue-light LED chip, and the electrode of the blue-light LED chip and package substrate is realized electrically
Connection；
The quantity of the through hole is at least 2；
The blocks of solid fluorescent material is affixed on the surface of LED package substrate functional areas, and with the functional areas shape of package substrate
Into cavity；
The transparent filling substance fills up the cavity；
The through hole of heating column insertion package substrate functional areas on the radiator, makes radiator be completely attached to package substrate.
2. remote fluorescence LED component as claimed in claim 1, it is characterised in that do not limited for the shape of the through hole,
To can be inserted into the circle of the heating column of any model radiator, rectangle, arc or sector.
3. remote fluorescence LED component as claimed in claim 1, it is characterised in that the blocks of solid fluorescent material be with
The ceramic material of fluorescent functional, monocrystal material, vitreum material or organic material.
4. remote fluorescence LED component as claimed in claim 1, it is characterised in that for the blocks of solid fluorescent material
Shapes and sizes are not particularly limited, and a cavity is formed with the functional areas of package substrate.
5. remote fluorescence LED component as claimed in claim 4, it is characterised in that the blocks of solid fluorescent material is diameter
Sheet, hemispherical or dome shape slightly larger than the functional area.
6. remote fluorescence LED component as claimed in claim 1, it is characterised in that not special for the transparent filling substance
Limitation, it is usually used in filling package substrate and blocks of solid fluorescent material.
7. remote fluorescence LED component as claimed in claim 1, it is characterised in that the heating column on the radiator is led for height
Hot not the aluminium post of extinction, electroplate copper post, sapphire rods or aluminium oxide ceramics post.
8. remote fluorescence LED component as claimed in claim 1, it is characterised in that the heating column and the blocks of solid are glimmering
The distance of luminescent material is 0-3mm.
9. remote fluorescence LED component as claimed in claim 8, it is characterised in that the heating column and blocks of solid phosphor
The lower surface of material completely attaches to.
10. remote fluorescence LED component as claimed in claim 1, it is characterised in that the diameter of the heating column is no more than described
The diameter of through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720997592.8U CN207021277U (en) | 2017-08-10 | 2017-08-10 | A kind of remote fluorescence LED component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720997592.8U CN207021277U (en) | 2017-08-10 | 2017-08-10 | A kind of remote fluorescence LED component |
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| Publication Number | Publication Date |
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| CN207021277U true CN207021277U (en) | 2018-02-16 |
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| CN201720997592.8U Active CN207021277U (en) | 2017-08-10 | 2017-08-10 | A kind of remote fluorescence LED component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107369743A (en) * | 2017-08-10 | 2017-11-21 | 中国科学院福建物质结构研究所 | A kind of remote fluorescence LED component and preparation method and application |
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2017
- 2017-08-10 CN CN201720997592.8U patent/CN207021277U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107369743A (en) * | 2017-08-10 | 2017-11-21 | 中国科学院福建物质结构研究所 | A kind of remote fluorescence LED component and preparation method and application |
| CN107369743B (en) * | 2017-08-10 | 2023-09-08 | 中国科学院福建物质结构研究所 | Remote fluorescent LED device and preparation method and application thereof |
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Legal Events
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Guo Wang Inventor after: Deng Zhonghua Inventor after: Liu Zhuguang Inventor after: Chen Jian Inventor after: Huang Jiquan Inventor after: Huang Qiufeng Inventor after: Zhang Weifeng Inventor after: Hong Maochun Inventor before: Guo Wang Inventor before: Deng Zhonghua Inventor before: Liu Zhuguang Inventor before: Chen Jian Inventor before: Huang Jiquan Inventor before: Huang Qiufeng Inventor before: Zhang Weifeng Inventor before: Hong Maochun |
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| CB03 | Change of inventor or designer information |