CN211959845U - Electronic prototype packaging structure - Google Patents
Electronic prototype packaging structure Download PDFInfo
- Publication number
- CN211959845U CN211959845U CN202020846708.XU CN202020846708U CN211959845U CN 211959845 U CN211959845 U CN 211959845U CN 202020846708 U CN202020846708 U CN 202020846708U CN 211959845 U CN211959845 U CN 211959845U
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- upper cover
- packaging structure
- handle
- shell
- core assembly
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Abstract
The embodiment of the utility model provides an electron model machine packaging structure, it includes encapsulation and mold core assembly; the encapsulation is located the outside of core assembly, through the screw connection, and the core assembly is with heat transfer to the casing on the pcb circuit board. Furthermore, the package comprises an upper cover, a handle and a shell, wherein the handle is positioned in a groove on the inner side of the upper cover, the upper cover is positioned at the front end of the shell, and two lugs of the upper cover are positioned on the inner wall of the shell and are connected through screws; the mold core subassembly includes fin and pcb circuit board, and the radiator is located the top layer of pcb circuit board, through bolted connection. The utility model provides a pair of electron model machine packaging structure, it has good heat dissipation function, and it is convenient to dismantle, and interchangeability is good, practices thrift the cost, for the modularized design provides the structural support, has good marketing power and market value.
Description
Technical Field
The utility model belongs to the technical field of electron model machine equipment, concretely relates to electron model machine packaging structure.
Background
On one hand, due to the fact that the traditional electronic prototype structural design does not adopt a modular structural design, inconvenience is brought to maintenance and repair; on the other hand, as the uniform standard design is not adopted, the interchangeability is not high; therefore, it is very important to design an electronic prototype packaging structure to meet the modular design.
SUMMERY OF THE UTILITY MODEL
In order to solve prior art, electron model machine structure maintenance is inconvenient, and does not have the technical problem of unified design standard, the embodiment of the utility model provides an electron model machine packaging structure. The specific technical scheme is as follows:
the embodiment of the utility model provides an electron model machine packaging structure, include: packaging and mold core components;
the package includes: the handle is hinged to the outer side of the upper cover, the upper cover is positioned at the top of the machine shell, and the upper cover is detachably connected with the machine shell;
the mold core assembly comprises: the heat sink is positioned on the top layer of the pcb, and the heat sink is detachably connected with the pcb through a screw;
the top of the radiating fin is coated with heat conducting glue, and the radiating fin is adhered to the inner side wall of the machine shell.
Optionally, the upper cover is detachably connected with the casing through a bolt.
Optionally, a groove is formed in the outer surface of the upper cover, the size of the groove is matched with that of the handle, and when the handle is attached to the upper cover, the handle is located in the groove.
Optionally, the casing is made of metal.
Optionally, a double lug is arranged on the wide edge of the upper cover, and the bolt fixes the upper cover on the top of the casing through the double lugs.
Optionally, the material of the heat sink is any one of aluminum alloy, brass and bronze.
Optionally, the shape of the heat sink is any one of a plate shape, a sheet shape, and a multi-sheet shape.
The embodiment of the utility model provides a pair of electron model machine packaging structure, include: packaging and mold core components; the package includes: the handle is hinged outside the upper cover, the upper cover is positioned at the top of the machine shell, and the upper cover is detachably connected with the machine shell; the mold core assembly includes: the heat radiating fin is positioned at the top layer of the pcb, and the heat radiating fin is detachably connected with the pcb through a screw; the top of the radiating fin is coated with heat conducting glue, and the radiating fin is bonded on the inner side wall of the machine shell.
The embodiment of the utility model provides an electron model machine packaging structure, it includes encapsulation and mold core assembly; the encapsulation is located the outside of core assembly, through the screw connection, and the core assembly is with heat transfer to the casing on the pcb circuit board. Furthermore, the package comprises an upper cover, a handle and a shell, wherein the handle is positioned in a groove on the inner side of the upper cover, the upper cover is positioned at the front end of the shell, and two lugs of the upper cover are positioned on the inner wall of the shell and are connected through screws; the mold core subassembly includes fin and pcb circuit board, and the fin is located the top layer of pcb circuit board, through bolted connection. The utility model provides a pair of electron model machine packaging structure, it has good heat dissipation function, and it is convenient to dismantle, and interchangeability is good, practices thrift the cost, for the modularized design provides the structural support, has good marketing power and market value.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an electronic prototype packaging structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a package according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a mold core assembly according to an embodiment of the present invention.
Reference numerals:
1 package, 2 mold core components, 3 upper covers, 4 handles, 5 machine cases, 6 heat sinks, 7pcb circuit boards.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The embodiment of the utility model provides a professional term explanation that relates to:
pcb circuit board: pcb (pr i ted Ci rc it board), which is called printed circuit board (pcb) and is also called printed circuit board (pcb), is an important electronic component, which is a support for electronic components and a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.
In order to solve prior art, electron model machine structure maintenance is inconvenient, and does not have the technical problem of unified design standard, the embodiment of the utility model provides an electron model machine packaging structure, concrete scheme is as follows:
please refer to fig. 1-3, an embodiment of the present invention provides an electronic prototype packaging structure, which includes: packaging 1 and a mold core component 2;
the package 1 includes: the handle 4 is hinged outside the upper cover 3, the upper cover 3 is positioned at the top of the machine shell 5, and the upper cover 3 is detachably connected with the machine shell 5;
the core assembly 2 includes: the heat sink comprises a heat sink 6 and a pcb circuit board 7, wherein the heat sink is positioned on the top layer of the pcb circuit board 7, and the heat sink 6 is detachably connected with the pcb circuit board 7 through a screw;
the top of the radiating fin 6 is coated with heat conducting glue, and the radiating fin 6 is adhered to the inner side wall of the machine shell 5.
Specifically, the embodiment of the utility model provides an electronic prototype packaging structure, it includes encapsulation 1 and mold core assembly 2; the package 1 is located outside the core assembly 2, and the core assembly 2 transfers heat from the pcb circuit board 7 to the chassis 5 by means of the screw connection. Furthermore, the package 1 comprises an upper cover 3, a handle 4 and a shell 5, wherein the handle 4 is positioned in a groove on the inner side of the upper cover 3, the upper cover 3 is positioned at the front end of the shell 5, and two lugs of the upper cover 3 are positioned on the inner wall of the shell 5 and connected through screws; the core assembly 2 comprises a heat sink 6 and a pcb 7, the heat sink being located on the top layer of the pcb 7 and being attached by screws. The utility model provides a pair of electron model machine packaging structure, it has good heat dissipation function, and it is convenient to dismantle, and interchangeability is good, practices thrift the cost, for the modularized design provides the structural support, has good marketing power and market value. Compared with the prior art, the utility model has the advantages that: the utility model provides a pair of electron model machine packaging structure, it has good heat dissipation function, and it is convenient to dismantle, and interchangeability is good, practices thrift the cost, for the modularized design provides the structural support, has certain marketing power and market value.
Further, the upper cover 3 is detachably connected with the casing 5 through bolts. When the die assembly 2 or the package 1 needs to be replaced or maintained, the upper cover 3 can be detached only by screwing the bolt.
Furthermore, a groove is formed in the outer surface of the upper cover 3, the size of the groove is matched with that of the handle, and when the handle is attached to the upper cover 3, the handle is located in the groove. When need not to use the handle, put the handle in the recess, make electronic model machine encapsulation 1 structure possess good wholeness, place and use all convenient. When the handle is needed, the handle is taken out of the groove, the electronic prototype packaging structure 1 can be carried by the handle, and the carrying is convenient.
Further, the housing 5 is made of metal. In a preferred embodiment, the chassis 5 made of metal is adopted, so that the heat dissipation effect of the structure of the electronic prototype package 1 is further improved.
Furthermore, a double lug is arranged on the wide edge of the upper cover 3, and the bolt fixes the upper cover 3 on the top of the casing 5 through the double lug. Through the fixed mode of ears, fix upper cover 3 at the top of casing 5, the structure is accomplished, and it is convenient to dismantle, the maintenance of being convenient for.
Further, the material of the heat sink 6 is any one of aluminum alloy, brass, and bronze.
Specifically, as for the material of the heat sink 6, each material has different heat conductivity, and is arranged from high to low according to the heat conductivity, and is silver, copper, aluminum, and steel. However, silver is too expensive for the heat sink 6, so copper is the best option.
Further, the shape of the heat radiating fin 6 is any one of a plate shape, a sheet shape, and a multi-sheet shape.
The embodiment of the utility model provides a pair of electron model machine packaging structure, include: packaging 1 and a mold core component 2; the package 1 includes: the handle 4 is hinged outside the upper cover 3, the upper cover 3 is positioned at the top of the machine shell 5, and the upper cover 3 is detachably connected with the machine shell 5; the core assembly 2 includes: the heat sink 6 is detachably connected with the pcb circuit board 7 through a screw; the top of the radiating fin 6 is coated with heat conducting glue, and the radiating fin 6 is adhered to the inner side wall of the machine shell 5.
The embodiment of the utility model provides an electron model machine packaging structure, it includes encapsulation 1 and mold core assembly 2; the package 1 is located outside the core assembly 2, and the core assembly 2 transfers heat from the pcb circuit board 7 to the chassis 5 by means of the screw connection. Furthermore, the package 1 comprises an upper cover 3, a handle 4 and a shell 5, wherein the handle 4 is positioned in a groove on the inner side of the upper cover 3, the upper cover 3 is positioned at the front end of the shell 5, and two lugs of the upper cover 3 are positioned on the inner wall of the shell 5 and connected through screws; the core assembly 2 comprises a heat sink 6 and a pcb 7, the heat sink being located on the top layer of the pcb 7 and being attached by screws. The utility model provides a pair of electron model machine packaging structure, it has good heat dissipation function, and it is convenient to dismantle, and interchangeability is good, practices thrift the cost, for the modularized design provides the structural support, has good marketing power and market value.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (7)
1. An electronic prototype packaging structure, comprising: packaging and mold core components;
the package includes: the handle is hinged to the outer side of the upper cover, the upper cover is positioned at the top of the machine shell, and the upper cover is detachably connected with the machine shell;
the mold core assembly comprises: the heat sink is positioned on the top layer of the pcb, and the heat sink is detachably connected with the pcb through a screw;
the top of the radiating fin is coated with heat conducting glue, and the radiating fin is adhered to the inner side wall of the machine shell.
2. The electronic prototype packaging structure of claim 1, wherein the upper cover is detachably connected with the casing by bolts.
3. The electronic prototype packaging structure of claim 1, wherein a groove is formed on the outer face of the upper cover, the size of the groove is matched with that of the pull handle, and when the pull handle is attached to the upper cover, the pull handle is positioned in the groove.
4. The electronic prototype packaging structure of claim 1, wherein the casing is made of metal.
5. The electronic prototype packaging structure of claim 2, wherein two lugs are arranged on the wide edge of the upper cover, and the bolt fixes the upper cover on the top of the casing through the two lugs.
6. The electronic prototype packaging structure of claim 1, wherein the heat sink is made of any one of aluminum alloy, brass and bronze.
7. The electronic prototype packaging structure of claim 1, wherein the heat sink is in the shape of any one of a plate, a sheet, and a plurality of sheets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020846708.XU CN211959845U (en) | 2020-05-20 | 2020-05-20 | Electronic prototype packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020846708.XU CN211959845U (en) | 2020-05-20 | 2020-05-20 | Electronic prototype packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211959845U true CN211959845U (en) | 2020-11-17 |
Family
ID=73170822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020846708.XU Expired - Fee Related CN211959845U (en) | 2020-05-20 | 2020-05-20 | Electronic prototype packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211959845U (en) |
-
2020
- 2020-05-20 CN CN202020846708.XU patent/CN211959845U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201117 |