CN210275001U

CN210275001U - Mute heat dissipation gateway

Info

Publication number: CN210275001U
Application number: CN201921176433.7U
Authority: CN
Inventors: 邵尤先; 侯贵斌; 梁晓东
Original assignee: Shenzhen Zhilu Technology Co ltd
Current assignee: Xu Liyong
Priority date: 2019-07-25
Filing date: 2019-07-25
Publication date: 2020-04-07
Anticipated expiration: 2029-07-25

Abstract

The utility model discloses a silence heat dissipation gateway, a serial communication port, including bottom plate 1, front bezel 5, back plate 6, PCBA board 2, heat dissipation aluminium pig 3 and heat dissipation lid 4, be fixed with PCBA board 2 on the bottom plate 1, be equipped with the chip on the PCBA board 2, heat dissipation aluminium pig 3 covers the chip and fixes on PCBA, heat dissipation aluminium pig 3 is used for heat conduction, heat dissipation lid 4 trilateral an organic whole is the C type, 4 back-ups of heat dissipation lid are in the PCBA top, heat dissipation lid 4 and 1 fixed connection of bottom plate, heat dissipation lid 4 and aluminium pig in close contact with, a plurality of cusp conducting strips of 4 surface evenly distributed of heat dissipation lid, both sides around heat dissipation lid 4 can be dismantled respectively to front bezel 5 and back plate 6, front bezel 5 and back plate 6 are equipped with the through-hole, the through-hole corresponds with the interface on the PCBA board 2.

Description

Mute heat dissipation gateway

Technical Field

The utility model relates to a gateway field specifically is a silence heat dissipation gateway.

Background

The gateway is also called an internetwork connector and a protocol converter. The gateway realizes network interconnection above a network layer, is the most complex network interconnection equipment and is only used for interconnection of two networks with different high-level protocols. The gateway can be used for interconnection of both wide area networks and local area networks. A gateway is a computer system or device that acts as a switch-operative. The gateway is a translator used between two systems that differ in communication protocol, data format or language, or even in an entirely different architecture.

The existing small gateway adopts two materials of a metal plate and an aluminum sheet. The five-face integrated structure is adopted, only one face can be detached, the installation is inconvenient, and the thickness of the shell material is very thin. The holes are punched at the upper, lower, left and right sides for ventilation and heat dissipation, and a fan is required for heat dissipation. The disadvantages of this approach are:

1. the installation and the disassembly are troublesome;

2. after punching, the mechanical strength of the box is reduced and the box is easy to deform;

3. the dust-proof and moisture-proof capability of the through holes is low;

4. there is fan operating noise.

SUMMERY OF THE UTILITY MODEL

The invention aims to provide a mute heat dissipation gateway.

The utility model provides a technical scheme as follows that above-mentioned technical problem took:

the utility model provides a silence heat dissipation gateway, includes bottom plate 1, PCBA board 2, heat dissipation aluminium pig 3 and heat dissipation lid 4, front bezel 5, back plate 6, be fixed with PCBA board 2 on the bottom plate 1, be equipped with the chip on PCBA board 2, heat dissipation aluminium pig 3 covers the chip and fixes on PCBA, heat dissipation aluminium pig 3 is used for the heat conduction, 4 trilateral an organic whole of heat dissipation lid is the C type, 4 back-offs of heat dissipation lid are in the PCBA top,

heat dissipation lid

4 and 1 fixed connection of bottom plate, heat dissipation lid 4 and aluminium pig in close contact with, a plurality of cusp heat conduction pieces of 4 surface evenly distributed of heat dissipation lid, both sides around heat dissipation lid 4 can be dismantled respectively to front bezel 5 and back plate 6 and fix, front bezel 5 and back plate 6 are equipped with the through-hole, the through-hole corresponds with the interface on the PCBA board 2.

Preferably, a heat conducting paste is arranged between the heat dissipation aluminum block 3 and the chip.

Preferably, the heat radiating cover 4 is integrally formed.

The utility model relates to a silence heat dissipation gateway, cooling cover 4 adopt trilateral integrated into one piece structure, and front bezel 5, back plate 6 all can be dismantled, simple to operate. The surface of the heat dissipation cover 4 is free of through holes for heat dissipation, the mechanical strength of the through holes is high, the heavy pressure is not easy to deform, the dustproof and moistureproof capacity of the through holes is improved, and the noise of the fan is low. The internal heat dissipation aluminum block 3 is placed on the chip through heat conduction paste for heat conduction and is fixed by screws, the heat dissipation aluminum block 3 is tightly attached to the heat dissipation cover 4, and the tooth-shaped heat conduction sheet is made on the surface of the external aluminum shell, so that the heat dissipation area is increased.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

The present invention will be described in detail with reference to the accompanying drawings so that the above advantages of the present invention can be more clearly understood.

Fig. 1 is an exploded view of a mute heat dissipation gateway of the present invention;

fig. 2 is a schematic view of a mute heat dissipation gateway of the present invention.

Detailed Description

The present invention will be described in detail with reference to the following specific embodiments.

As shown in fig. 1-2, a mute heat dissipation gateway includes a bottom plate 1, a PCBA board 2, a heat dissipation aluminum block 3, a heat dissipation cover 4, a front plate 5, and a back plate 6, the PCBA board 2 is fixed on the bottom plate 1, a chip is arranged on the PCBA board 2, the heat dissipation aluminum block 3 covers the chip and is fixed on the PCBA, the heat dissipation aluminum block 3 is used for heat conduction, three sides of the heat dissipation cover 4 are integrally C-shaped, the heat dissipation cover 4 is reversely buckled above the PCBA, the heat dissipation cover 4 is fixedly connected with the bottom plate 1, the heat dissipation cover 4 is in close contact with the aluminum block, a plurality of dentate heat-conducting fins are uniformly distributed on the surface of the heat dissipation cover 4, the front plate 5 and the back plate 6 are respectively detachably fixed on the front and back sides of the heat dissipation cover 4, the front plate 5 and the back plate 6 are provided with through holes, and the.

Preferably, the heat radiating cover 4 is integrally formed.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A silent heat dissipation gateway is characterized by comprising a bottom plate (1), a PCBA (printed circuit board assembly) plate (2), a heat dissipation aluminum block (3), a heat dissipation cover (4), a front plate (5) and a rear plate (6), wherein the PCBA plate (2) is fixed on the bottom plate (1), a chip is arranged on the PCBA plate (2), the heat dissipation aluminum block (3) covers the chip and is fixed on the PCBA, the heat dissipation aluminum block (3) is used for conducting heat, the heat dissipation cover (4) is C-shaped in three sides, the heat dissipation cover (4) is buckled upside down above the PCBA, the heat dissipation cover (4) is fixedly connected with the bottom plate (1), the heat dissipation cover (4) is in close contact with the aluminum block, a plurality of dentate heat conduction fins are uniformly distributed on the surface of the heat dissipation cover (4), the front plate (5) and the rear plate (6) are detachably fixed on the front side and the rear side of the heat dissipation cover (4) respectively, and through holes are formed in the front plate, the through holes correspond to interfaces on the PCBA board (2).

2. The mute heat dissipation gateway according to claim 1, wherein a heat conducting paste is arranged between the heat dissipation aluminum block (3) and the chip.

3. The mute heat dissipation gateway according to claim 1, wherein the heat dissipation cover (4) is integrally formed.