CN211786977U

CN211786977U - Frame structure of digital processing part

Info

Publication number: CN211786977U
Application number: CN202020809087.8U
Authority: CN
Inventors: 陈光日
Original assignee: Wuxi Zhihongda Electronic Technology Co ltd
Current assignee: Wuxi Zhihongda Electronic Technology Co ltd
Priority date: 2020-05-15
Filing date: 2020-05-15
Publication date: 2020-10-27
Anticipated expiration: 2030-05-15

Abstract

The utility model provides a frame structure of digital processing part, including bottom plate, apron, first panel, second panel, an airtight space is injectd to bottom plate, apron, first panel, second panel, bottom plate, apron, first panel, second panel joint seam department paint waterproof glue and through screw fixed connection of each other, apron external surface is provided with a plurality of heat conduction slots. Through the utility model discloses to solve the problem that the quick-witted case leakproofness that prior art exists is poor, the radiating effect is poor, occupation space is big.

Description

Frame structure of digital processing part

Technical Field

The utility model relates to a meteorological radar equips technical field, and specifically speaking relates to a digital processing part frame structure.

Background

In the original millimeter wave radar system, a digital signal processing board card and an interface board card are inserted into slots of a PCI (peripheral component interconnect) case. The original PCI case has poor sealing performance, poor adaptability in high-temperature and high-humidity environments, large volume, high cost and high occupation of precious cabinet installation space resources.

SUMMERY OF THE UTILITY MODEL

The utility model provides a frame structure of a digital processing part to solve the problems of poor sealing performance of a case, poor heat dissipation effect and large occupied space existing in the prior art.

In order to solve the technical problem, the utility model provides a frame structure of digital processing part, including bottom plate, apron, first panel, second panel, an airtight space is injectd to bottom plate, apron, first panel, second panel, bottom plate, apron, first panel, second panel joint seam department paint waterproof glue and through the fixed connection of screw each other, apron external surface is provided with a plurality of heat conduction slots.

Preferably, the bottom plate is provided with a processing board card, the inner surface of the cover plate is provided with a radiator boss, the radiator boss is in contact with the processing board card to conduct heat, the heat is conducted to the cover plate, and the heat is dissipated through the heat conduction groove.

Preferably, the first panel and the second panel are provided with a plurality of holes for installing the expansion interfaces.

The utility model discloses the beneficial effect who brings: compared with the prior art, the utility model discloses a digital processing part frame structure is not increasing the fan, does not add under the condition of louvre, is handling the integrated circuit board operation in-process, makes the heat of its production can accomplish independently thermal giving off. Both satisfied radiating purpose, realized the leakproofness requirement of frame again for whole digital processing integrated circuit board can satisfy outdoor, high fever, high humid service environment, has replaced original PCI machine case design, has reduced equipment cost simultaneously.

Drawings

Fig. 1 is an exploded schematic view of a digital processing section frame structure according to an embodiment of the present invention.

FIG. 2 is a partial enlarged view of the point A in FIG. 1

Wherein, 1-bottom plate, 2-cover plate, 3-first panel, 4-second panel, 5-heat conduction groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1-2, the utility model provides a pair of frame structure of digital processing part, including bottom plate 1, apron 2, first panel 3, second panel 4, an airtight space is injectd to bottom plate 1, apron 2, first panel 3, second panel 4, bottom plate 1, apron 2, first panel 3, second panel 4 joint seam department paint waterproof glue and through the fixed connection of screw each other, 2 external surfaces of apron are provided with a plurality of heat conduction slot 5.

Further, a processing board card is installed on the bottom plate 1, a radiator boss is installed on the inner surface of the cover plate 2, the radiator boss is in contact with the processing board card to conduct heat, the heat is conducted to the cover plate 2, and heat is dissipated through the heat conduction groove 5.

Further, the first panel 3 and the second panel 4 are provided with a plurality of holes for installing the expansion interfaces.

Except for necessary panel connectors, unnecessary holes are removed, and the sealing performance of a digital board card machine frame is improved. Through the mode of daubing waterproof glue, make the digital frame satisfy waterproof, dampproofing performance, improve the environmental suitability of digital integrated circuit board.

Compared with the traditional scheme, the sealing performance and the heat dissipation performance of the digital signal processing system are improved, the occupied space volume of the digital signal processing system is reduced by 50%, and the equipment cost is reduced by 80%.

To sum up, the utility model discloses a digital processing part frame structure is not increasing the fan, does not add under the condition of louvre, is handling the integrated circuit board operation in-process, makes the heat of its production can accomplish independently thermal giving off. Both satisfied radiating purpose, realized the leakproofness requirement of frame again for whole digital processing integrated circuit board can satisfy outdoor, high fever, high humid service environment, has replaced original PCI machine case design, has reduced equipment cost simultaneously.

The above description is only an example of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A digital processing section frame structure, characterized in that: including bottom plate (1), apron (2), first panel (3), second panel (4), an airtight space is injectd to bottom plate (1), apron (2), first panel (3), second panel (4), bottom plate (1), apron (2), first panel (3), second panel (4) joint seam department paint waterproof glue and through the fixed connection of screw each other, apron (2) external surface is provided with a plurality of heat conduction slot (5).

2. The digital processing part frame structure of claim 1, wherein the base plate (1) is mounted with a processing board, and the cover plate (2) is internally surface-mounted with a heat sink boss, which is in contact with the processing board to conduct heat to the cover plate (2) and dissipate the heat through the heat conducting groove (5).

3. The digital processing section subrack of claim 1, wherein said first panel (3) and said second panel (4) have holes for mounting expansion interfaces.