CN216673640U - Heat dissipation device for phased array radar digital acquisition printed board - Google Patents
Heat dissipation device for phased array radar digital acquisition printed board Download PDFInfo
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- CN216673640U CN216673640U CN202122896531.1U CN202122896531U CN216673640U CN 216673640 U CN216673640 U CN 216673640U CN 202122896531 U CN202122896531 U CN 202122896531U CN 216673640 U CN216673640 U CN 216673640U
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Abstract
The utility model relates to a heat dissipation device for a phased array radar digital acquisition printed board, which comprises: the digital acquisition printed board is provided with at least one heating chip, a radio frequency interface is arranged on the digital acquisition printed board, and a radio frequency cable is connected with the radio frequency interface to realize the transmission of radio frequency signals; the digital acquisition printed board is connected with the shell through a plurality of first fixing devices, so that the freedom degree of the digital acquisition printed board in the vertical direction is in a limited movable state; the radiator is connected with the digital acquisition printed board through a plurality of second fixing devices, and the digital acquisition printed board moves towards the direction of the radiator by adjusting the second fixing devices, so that the digital acquisition printed board is tightly attached to the radiator. The heat dissipation device provided by the utility model ensures the heat dissipation effect and prevents the radio frequency cable from being excessively folded or bent.
Description
Technical Field
The utility model belongs to the technical field of printed board heat dissipation design, and particularly relates to a heat dissipation device for a phased array radar digital acquisition printed board.
Background
In order to realize the functions of high gain, multi-beam tracking and the like of the phased array radar, higher requirements are put forward on the digital processing of the phased array. The heat consumption of a processing chip is increased sharply by multi-channel digital acquisition, and the number of Printed Circuit Boards (PCBs) for digital acquisition and processing is increased, which puts more rigorous requirements on the integrated heat dissipation of the PCBs.
The heat dissipation mode that the present stage adopted mostly is from inside to outside installation step by step. Firstly, fixing a PCB with a heating chip on a shell through a screw, secondly, stacking a heat-conducting silica gel pad with a certain compression amount above the heating chip, and thirdly, connecting a radiator with the shell. The heat of the heat-generating chip is transferred to the heat sink through the heat-conducting rubber pad, so as to achieve the purpose of heat dissipation, as shown in fig. 1.
When a plurality of PCBs are arranged in the case, the number of heating cores on the PCBs is correspondingly increased, so that the number of structural bosses on the required radiator is correspondingly increased. Since the overall dimension and height of the heat-generating chip are different, the heights of the structural bosses of the corresponding heat sinks are different, as shown in fig. 2. However, when one heat sink is required to dissipate heat of a plurality of PCBs, the heat dissipation bosses with excessive number inevitably have processing tolerance, and when the boss with a certain structure is out of tolerance, some chips are better attached to the heat-conducting rubber pad, and some chips are not attached to the heat-conducting rubber pad, so that heat dissipation is affected. As shown in fig. 3.
To avoid the above risk, each PCB needs to be separately mounted to a heat sink, which is then connected to the chassis, as shown in fig. 4. The mode avoids the risk of poor heat dissipation caused by the tolerance of the heat radiator. However, in practical applications, the PCB has a certain number of radio frequency interfaces, which need to be externally connected with a plurality of radio frequency cables, and if the radio frequency cables are connected with the radio frequency interfaces of the PCB in advance and then assembled to the heat sink, when the heat sink is assembled with the housing, the radio frequency cables are randomly pressed into the chassis, so that the radio frequency cables are bent or folded too much, which not only affects the service life of the radio frequency cables, but also greatly affects the quality of radio frequency signals.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems in the prior art, the utility model provides a heat dissipation device for a phased array radar digital acquisition printed board. The technical problem to be solved by the utility model is realized by the following technical scheme:
the utility model provides a heat dissipation device for a phased array radar digital acquisition printed board, which comprises: at least one digital acquisition printed board, a chassis, and a heat sink, wherein,
the digital acquisition printed board is provided with at least one heating chip, a radio frequency interface is arranged on the digital acquisition printed board, and a radio frequency cable is connected with the radio frequency interface to realize the transmission of radio frequency signals;
the digital acquisition printed board is connected with the shell through a plurality of first fixing devices, so that the degree of freedom of the digital acquisition printed board in the vertical direction is in a limited movable state;
the radiator is connected with the digital acquisition printed board through a plurality of second fixing devices, and the digital acquisition printed board moves towards the direction of the radiator by adjusting the second fixing devices, so that the digital acquisition printed board is tightly attached to the radiator.
In one embodiment of the present invention, a plurality of the first fixing devices are respectively disposed at four vertex positions of the digital acquisition printed board.
In one embodiment of the present invention, the first fixing device includes a first screw and an elastic member, the elastic member is sleeved on the first screw;
the digital acquisition printed board is provided with a first through hole, the shell is provided with a threaded connecting hole, and the first screw penetrates through the first through hole and then is connected with the threaded connecting hole in a matched mode, so that the digital acquisition printed board is connected with the shell.
In one embodiment of the utility model, the resilient member is a spring.
In one embodiment of the present invention, a plurality of the second fixing devices are respectively disposed at four vertex positions of the heat generating chip.
In an embodiment of the present invention, the second fixing device includes a second screw, and the heat sink and the digital acquisition printed board are respectively provided with a second through hole and a third through hole;
and the second screw penetrates through the second through hole and the third through hole in sequence and then is connected with the nut in a matched mode, so that the radiator is connected with the digital acquisition printed board.
Compared with the prior art, the utility model has the beneficial effects that:
according to the heat dissipation device for the phased array radar digital acquisition printed board, the digital acquisition printed board (PCB) is pre-fixed on the casing through the first fixing device, after the radiator is connected with the casing, the digital acquisition printed board is pulled to the radiator through adjusting the second fixing device, so that the digital acquisition printed board is tightly attached to the radiator.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic diagram of a conventional single PCB heat dissipation method according to an embodiment of the present invention;
FIG. 2 is a schematic view of a multi-structure boss configuration of a heat sink according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating a comparison of heat dissipation states according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a conventional multi-PCB independent mounting to a heat sink according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a PCB pre-fixing structure provided in an embodiment of the present invention;
FIG. 6 is a detail cross-sectional view of a first fastening device provided in accordance with an embodiment of the present invention;
fig. 7 is a schematic diagram of a PCB-attached rf cable according to an embodiment of the present invention;
fig. 8 is an exploded view of the overall assembly of a heat dissipation device for a phased array radar digital acquisition printed board according to an embodiment of the present invention;
fig. 9 is a detailed schematic diagram of a PCB and a heat sink according to an embodiment of the present invention.
Icon: 1-digital acquisition printed board; 2-a housing; 3-a radiator; 101-a heat-generating chip; 102-a radio frequency interface; 4-a first screw; 5-an elastic member; 6-threaded connection hole; 7-a second screw; 8-nut.
Detailed Description
In order to further illustrate the technical means and effects of the present invention adopted to achieve the predetermined purpose of the utility model, a heat dissipation device for a phased array radar digital acquisition printed board according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
The foregoing and other technical matters, features and effects of the present invention will be apparent from the following detailed description of the embodiments, which is to be read in connection with the accompanying drawings. The technical means and effects of the present invention adopted to achieve the predetermined purpose can be more deeply and specifically understood through the description of the specific embodiments, however, the attached drawings are provided for reference and description only and are not used for limiting the technical scheme of the present invention.
Example one
Referring to fig. 5-9, fig. 5 is a schematic diagram of a PCB pre-fixing according to an embodiment of the present invention; FIG. 6 is a detail cross-sectional view of a first fastening device provided in accordance with an embodiment of the present invention; fig. 7 is a schematic diagram of a PCB-attached rf cable according to an embodiment of the present invention; fig. 8 is an exploded view of the overall assembly of a heat dissipation device for a phased array radar digital acquisition printed board according to an embodiment of the present invention, and fig. 9 is a detailed schematic view of the cooperation of a PCB and a heat sink according to an embodiment of the present invention. As shown in the figure, the heat abstractor for phased array radar digital acquisition printed board of this embodiment includes: the digital collecting printed circuit board comprises at least one digital collecting Printed Circuit Board (PCB)1, a shell 2 and a radiator 3, wherein at least one heating chip 101 is installed on the digital collecting printed circuit board 1, a radio frequency interface 102 is arranged on the digital collecting printed circuit board 1, and a radio frequency cable is connected with the radio frequency interface 102 to realize transmission of radio frequency signals; the digital acquisition printed board 1 is connected with the shell 2 through a plurality of first fixing devices, so that the degree of freedom of the digital acquisition printed board 1 in the vertical direction is in a limited movable state; the radiator 3 is connected with the digital acquisition printed board 1 through a plurality of second fixing devices, and the digital acquisition printed board 1 moves towards the radiator 3 by adjusting the second fixing devices, so that the digital acquisition printed board 1 is tightly attached to the radiator 3.
In the present embodiment, a plurality of the first fixing means are respectively provided at four vertex positions of the digital collecting printed board 1.
It should be noted that, if the heat dissipation device includes a plurality of digital acquisition printed boards 1, each digital acquisition printed board 1 is connected to the casing 2 through the first fixing devices disposed at the four vertex positions thereof.
Specifically, the first fixing device comprises a first screw 4 and an elastic piece 5, and the elastic piece 5 is sleeved on the first screw 4; the digital acquisition printed board 1 is provided with a first through hole, the casing 2 is provided with a threaded connecting hole 6, and the first screw 4 is connected with the threaded connecting hole 6 in a matching manner after penetrating through the first through hole so as to realize the connection of the digital acquisition printed board 1 and the casing 2.
In this embodiment, since the elastic member 5 is sleeved on the first screw 4, when the first screw 4 is connected to the threaded connection hole 6 formed in the housing 2 after passing through the first through hole in a matching manner, the degree of freedom of the digital acquisition printed board 1 in the vertical direction is in a limited movable state by controlling the degree of compression of the elastic member 5, and meanwhile, the degree of freedom of the digital acquisition printed board 1 in the translation direction is also guaranteed to be limited.
Optionally, the elastic member 5 is a spring.
Specifically, in the present embodiment, assuming that the elastic coefficient of the spring is K, when the digital acquisition printed board 1 is fixed to the chassis 2, when the first screw 4 is screwed into a certain depth, the spring is controlled to have a compression amount of L1(L1< L, L being the limit compression amount of the spring), and then the remaining compression amount of the spring is L2(L2 ═ L-L1), by which the digital acquisition printed board 1 is pre-fixed, and by this and fixing manner, on the one hand, it is ensured that the degree of freedom of the digital acquisition printed board 1 in the translational direction is limited, and on the other hand, it is ensured that the degree of freedom of the digital acquisition printed board 1 in the vertical direction is in the limited release state, as shown in fig. 5 and 6.
Further, a plurality of second fixing means are provided at four vertex positions of the heat generating chip 101, respectively.
It should be noted that, if a plurality of heat generating chips 101 are mounted on the digital acquisition printed board 1, each heat generating chip 101 is connected to the heat sink 3 through the second fixing devices disposed at the four vertex positions thereof.
Specifically, the second fixing device comprises a second screw 7, and the radiator 3 and the digital acquisition printed board 1 are respectively provided with a second through hole and a third through hole; and the second screw 7 is matched and connected with the nut 8 after sequentially penetrating through the second through hole and the third through hole so as to realize the connection of the radiator 3 and the digital acquisition printed board 1.
In this embodiment, after passing through the second through hole in the heat sink 3 and the third through hole in the digital acquisition printed board 1, the second screw 7 is connected to the nut 8 located on the back surface of the digital acquisition printed board 1, and by screwing the nut 8, the digital acquisition printed board 1 is pulled up to the heat sink 3, so that the digital acquisition printed board 1 and the heat sink 3 are tightly attached to each other, wherein the upward movement distance of the digital acquisition printed board 1 does not exceed L2, as shown in fig. 8 and 9.
Further, explaining an assembling process of the heat dissipating apparatus for the phased array radar digital acquisition printed board of the present embodiment, first, the digital acquisition printed board 1 is pre-fixed to the casing 2, specifically, the first screw 4 is screwed into the screw connection hole 6 on the casing 2 after passing through the first through hole on the digital acquisition printed board 1, and when the first screw 4 is screwed into a certain depth, it is stopped, and the compression amount of the spring is controlled to be L1(L1< L). Next, the radio frequency cable to be connected is connected to the radio frequency interface 102 on the digital acquisition printed board 1, as shown in fig. 7. Finally, after the heat sink 3 is connected to the chassis 2, the second screw 7 is connected to the nut 8 located on the back of the digital acquisition printed board 1 after passing through the second through hole of the heat sink 3 and the third through hole of the digital acquisition printed board 1, and the digital acquisition printed board 1 is pulled up to the heat sink 3 by screwing the nut 8, wherein the upward moving distance of the digital acquisition printed board 1 is L2.
According to the heat dissipation device for the phased array radar digital acquisition printed board, the digital acquisition printed board (PCB) is pre-fixed on the casing through the first fixing device, and after the radiator is connected with the casing, the digital acquisition printed board is pulled to the radiator through adjusting the second fixing device, so that the digital acquisition printed board is tightly attached to the radiator.
The heat dissipation device of the utility model pre-fixes the PCB on the shell, connects the radio frequency cable with the radio frequency interface on the PCB, and pulls the PCB pre-fixed on the shell to the radiator from the back of the radiator to be fixed after the radiator is installed, thereby ensuring the heat dissipation effect and preventing the radio frequency cable from being over-folded or over-bent. And each PCB can be independently mounted to the radiator without influencing the transmission of the internal radio frequency cable.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or device comprising the element. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The directional or positional relationships indicated by "upper", "lower", "left", "right", etc., are based on the directional or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The foregoing is a more detailed description of the utility model in connection with specific preferred embodiments and it is not intended that the utility model be limited to these specific details. For those skilled in the art to which the utility model pertains, several simple deductions or substitutions can be made without departing from the spirit of the utility model, and all shall be considered as belonging to the protection scope of the utility model.
Claims (6)
1. A heat abstractor for phased array radar digital acquisition printed board which characterized in that includes: at least one digital acquisition printed board (1), a casing (2) and a heat sink (3), wherein,
the digital acquisition printed board (1) is provided with at least one heating chip (101), the digital acquisition printed board (1) is provided with a radio frequency interface (102), and a radio frequency cable is connected with the radio frequency interface (102) to realize the transmission of radio frequency signals;
the digital acquisition printed board (1) is connected with the shell (2) through a plurality of first fixing devices, so that the degree of freedom of the digital acquisition printed board (1) in the vertical direction is in a limited movable state;
the radiator (3) is connected with the digital acquisition printed board (1) through a plurality of second fixing devices, and the digital acquisition printed board (1) moves towards the radiator (3) by adjusting the second fixing devices, so that the digital acquisition printed board (1) is tightly attached to the radiator (3).
2. The heat dissipation device for a phased array radar digital acquisition printed board according to claim 1, characterized in that a plurality of the first fixing means are provided at four vertex positions of the digital acquisition printed board (1), respectively.
3. The heat dissipation device for the phased array radar digital acquisition printed board according to claim 1, wherein the first fixing device comprises a first screw (4) and an elastic member (5), and the elastic member (5) is sleeved on the first screw (4);
the digital acquisition printed board (1) is provided with a first through hole, the casing (2) is provided with a threaded connecting hole (6), and the first screw (4) penetrates through the first through hole and then is connected with the threaded connecting hole (6) in a matched mode so as to realize connection of the digital acquisition printed board (1) and the casing (2).
4. The heat dissipation device for a phased array radar digital acquisition printed board according to claim 3, characterized in that the elastic member (5) is a spring.
5. The heat dissipation device for a phased array radar digital acquisition printed board according to claim 1, wherein a plurality of the second fixing devices are respectively provided at four vertex positions of the heat generating chip (101).
6. The heat dissipation device for the phased array radar digital acquisition printed board according to claim 5, wherein the second fixing device comprises a second screw (7), and a second through hole and a third through hole are respectively formed in the heat radiator (3) and the digital acquisition printed board (1);
and the second screw (7) penetrates through the second through hole and the third through hole in sequence and then is matched and connected with a nut (8) so as to realize the connection of the radiator (3) and the digital acquisition printed board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122896531.1U CN216673640U (en) | 2021-11-22 | 2021-11-22 | Heat dissipation device for phased array radar digital acquisition printed board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122896531.1U CN216673640U (en) | 2021-11-22 | 2021-11-22 | Heat dissipation device for phased array radar digital acquisition printed board |
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| CN216673640U true CN216673640U (en) | 2022-06-03 |
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| CN202122896531.1U Active CN216673640U (en) | 2021-11-22 | 2021-11-22 | Heat dissipation device for phased array radar digital acquisition printed board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115629359A (en) * | 2022-12-21 | 2023-01-20 | 西安欣创电子技术有限公司 | Portable phased array radar antenna |
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2021
- 2021-11-22 CN CN202122896531.1U patent/CN216673640U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115629359A (en) * | 2022-12-21 | 2023-01-20 | 西安欣创电子技术有限公司 | Portable phased array radar antenna |
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