CN218633997U

CN218633997U - Heat dissipation antistatic mobile phone motherboard

Info

Publication number: CN218633997U
Application number: CN202222254808.5U
Authority: CN
Inventors: 王进; 刘绍帝; 宋均
Original assignee: Jiangxi Jiaye Intelligent Equipment Manufacturing Co ltd
Current assignee: Jiangxi Jiaye Intelligent Equipment Manufacturing Co ltd
Priority date: 2022-08-25
Filing date: 2022-08-25
Publication date: 2023-03-14
Anticipated expiration: 2032-08-25

Abstract

The utility model discloses a static mobile phone motherboard is prevented in heat dissipation, which comprises a substrate, it prevents static mainboard body to have through heat conduction silica gel to connect in the middle of the base plate top, prevent that static mainboard body bottom four corners is provided with square groove, just square groove sets up in the base plate top, square inslot is provided with heat-conducting plate and fin, the heat-conducting plate outer wall is connected with the base plate all around, the fin equidistance sets up in the heat-conducting plate bottom, first recess has been seted up in the middle of the base plate top, bilateral symmetry is provided with first through-hole around the first recess, the base plate top is seted up in first through-hole, first through-hole is linked together with square groove, disperses to square inslot through the fin through the heat-conducting plate the heat that prevents static mainboard body and produce, makes the heat of square inslot lead to the ventilation inslot and disperse to external environment through first through-hole, first recess and second through-hole, second recess to dispel the heat to prevent static mainboard body.

Description

Heat dissipation antistatic mobile phone motherboard

Technical Field

The utility model relates to a prevent static mobile phone motherboard technical field, particularly, relate to a static mobile phone motherboard is prevented in heat dissipation.

Background

The motherboard is also called a motherboard, a system board, a logic board, a motherboard, a backplane, etc., and is a central or main circuit board constituting a complex electronic system such as an electronic computer.

In the prior art, the anti-static mobile phone mainboard generates heat when in use, and the accumulation of the heat can damage the anti-static mobile phone mainboard, thereby influencing the use.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

To the problem in the correlation technique, the utility model provides a static mobile phone motherboard is prevented in heat dissipation to overcome the above-mentioned technical problem that current correlation technique exists.

Therefore, the utility model discloses a specific technical scheme as follows:

the utility model provides a static mobile phone motherboard is prevented in heat dissipation, includes the base plate, it prevents static mainboard body to have a joint through heat conduction silica gel in the middle of the base plate top, prevent that static mainboard body bottom four corners is provided with square groove, just square groove is seted up at the base plate top, square inslot is provided with heat-conducting plate and fin, the heat-conducting plate outer wall is connected with the base plate all around, the fin equidistance sets up in the heat-conducting plate bottom, first recess has been seted up in the middle of the base plate top, bilateral symmetry is provided with first through-hole around the first recess, first through-hole is seted up at the base plate top, first through-hole is linked together with square groove, the ventilation groove has been seted up to the base plate bilateral symmetry, just ventilation groove is linked together with first recess.

Preferably, the top of the base plate is symmetrically provided with second grooves in the front and back direction, the front side of each second groove is provided with a second through hole, each second through hole is formed in the top of the base plate and communicated with the corresponding square groove, and each second groove is communicated with the corresponding ventilation groove.

Preferably, a frame plate is arranged in the ventilation groove, the outer wall of the frame plate is attached to the substrate, and a dust screen is arranged in the frame plate.

Preferably, the front and back of one side of the frame plate are symmetrically provided with fixing bolts, and the tail ends of the fixing bolts penetrate through the frame plate and are in threaded connection with the substrate.

As preferred, heat-conducting plate bottom bilateral symmetry is provided with first diaphragm, be provided with the riser in the middle of the first diaphragm bottom, the riser bottom is provided with the second diaphragm, just first diaphragm and second diaphragm all are connected with the base plate.

Preferably, the vertical plate, the first transverse plate and the second transverse plate are connected to form an I-shaped structure.

The utility model has the advantages that:

1. prevent the heat that static mainboard body produced through the heat-conducting plate and disperse to square inslot through the fin, make the heat of square inslot lead to the ventilation inslot and disperse to the external environment in through first through-hole, first recess and second through-hole, second recess to dispel the heat to prevent static mainboard body.

2. Through setting up the dust screen, make in the difficult base plate that gets into through the ventilation slot of dust to cause the influence to fin and heat-conducting plate.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of an overall structure of a heat dissipation anti-static mobile phone motherboard according to an embodiment of the present invention;

fig. 2 is a schematic view of an internal structure of a heat dissipation anti-static mobile phone motherboard according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a substrate structure of a heat dissipation anti-static mobile phone motherboard according to an embodiment of the present invention;

fig. 4 is a schematic view illustrating a vertical plate connection of a heat dissipation anti-static mobile phone motherboard according to an embodiment of the present invention;

fig. 5 is an enlarged schematic view of a part a of a heat dissipation anti-static mobile phone motherboard according to an embodiment of the present invention;

fig. 6 is an enlarged schematic view of a part B of a heat dissipation anti-static mobile phone motherboard according to an embodiment of the present invention.

In the figure:

1. a substrate; 2. an anti-static mainboard body; 3. a square groove; 4. a heat conducting plate; 5. a heat sink; 6. a first groove; 7. a first through hole; 8. a ventilation slot; 9. a second groove; 10. a second through hole; 11. a frame plate; 12. a dust screen; 13. a fixing bolt; 14. a first transverse plate; 15. a vertical plate; 16. and the second transverse plate.

Detailed Description

To further illustrate the various embodiments, the present invention provides the accompanying drawings, which are part of the disclosure and which are primarily intended to illustrate embodiments and, together with the description, serve to explain the principles of operation of the embodiments, and, by reference to these drawings, those of ordinary skill in the art will understand the principles of the invention and its advantages, with reference to the drawings and figures, in which elements are not drawn to scale and like elements are generally designated by like reference numerals.

According to the utility model discloses an embodiment provides a static mobile phone motherboard is prevented in heat dissipation.

Example one

As shown in fig. 1-6, according to the utility model discloses a static mobile phone motherboard is prevented in heat dissipation, including base plate 1, it has antistatic mainboard body 2 to connect through heat conduction silica gel in the middle of base plate 1 top, antistatic mainboard body 2 bottom four corners is provided with square groove 3, and square groove 3 sets up in base plate 1 top, square inslot 3 is provided with heat-conducting plate 4 and fin 5, heat-conducting plate 4 outer wall is connected with base plate 1 all around, fin 5 equidistance sets up in heat-conducting plate 4 bottom, first recess 6 has been seted up in the middle of base plate 1 top, bilateral symmetry is provided with first through-hole 7 around first recess 6, first through-hole 7 sets up in base plate 1 top, first through-hole 7 is linked together with square groove 3, ventilation groove 8 has been seted up to base plate 1 bilateral symmetry, and ventilation groove 8 is linked together with first recess 6, second recess 9 has been seted up to base plate 1 top front and back symmetry, second recess 9 front side is provided with second through-hole 10, second through-hole 10 sets up in base plate 1 top, and second through-hole 10 is linked together square groove 3, thereby the heat gets into the heat dissipation through-proof heat dissipation through-discharge effect 2, thereby the heat goes into heat dissipation reinforcing groove 8.

Example two

As shown in fig. 1-6, according to the utility model discloses a static mobile phone motherboard is prevented in heat dissipation according to the embodiment, including base plate 1, it prevents static mainboard body 2 to connect through heat conduction silica gel in the middle of base plate 1 top, it is provided with square groove 3 to prevent static mainboard body 2 bottom four corners, and square groove 3 sets up in base plate 1 top, be provided with heat-conducting plate 4 and fin 5 in the square groove 3, heat-conducting plate 4 outer wall is connected with base plate 1 all around, fin 5 equidistance sets up in heat-conducting plate 4 bottom, first recess 6 has been seted up in the middle of base plate 1 top, bilateral symmetry is provided with first through-hole 7 around first recess 6, first through-hole 7 sets up in base plate 1 top, first through-hole 7 is linked together with square groove 3, ventilation groove 8 has been seted up to base plate 1 bilateral symmetry, and ventilation groove 8 is linked together with first recess 6, be provided with deckle board 11 in the ventilation groove 8, deckle board 11 outer wall laminates with base plate 1, be provided with the internal mesh 12 in the deckle board 11, the deckle board 11 is provided with 13, the front and back symmetry is provided with 13, the internal dust screen 12 that prevents dust and is difficult for external world and blocks the base plate and blocks the external world and to get into the base plate 1.

EXAMPLE III

As shown in fig. 1-6, according to the utility model discloses a static mobile phone motherboard is prevented in heat dissipation according to an embodiment, including base plate 1, it prevents static mainboard body 2 to have through heat conduction silica gel to adhere in the middle of base plate 1 top, it is provided with square groove 3 to prevent static mainboard body 2 bottom four corners, and square groove 3 offers at base plate 1 top, be provided with heat-conducting plate 4 and fin 5 in the square groove 3, heat-conducting plate 4 outer wall is connected with base plate 1 all around, fin 5 equidistance sets up in heat-conducting plate 4 bottom, first recess 6 has been seted up in the middle of base plate 1 top, bilateral symmetry is provided with first through-hole 7 around first recess 6, first through-hole 7 offers at base plate 1 top, first through-hole 7 is linked together with square groove 3, ventilation groove 8 has been seted up to base plate 1 bilateral symmetry, and ventilation groove 8 is linked together with first recess 6, heat-conducting plate 4 bottom bilateral symmetry is provided with first diaphragm 14, be provided with riser 15 in the middle of first diaphragm 14 bottom, riser 15 bottom is provided with second diaphragm 16, and first diaphragm 14 and second diaphragm 16 all are connected with base plate 1, riser 15 is 14 and is the I-shaped structure, it guarantees that heat-conducting plate 4 is in the stable heat-conducting plate 4, thereby the heat-radiating effect is in heat-conducting plate 4.

To sum up, with the aid of the above technical scheme of the utility model, this device is when using, set up deckle board 11 in ventilation groove 8, use gim peg 13, it is fixed to be connected between deckle board 11 and the base plate 1, prevent static mainboard body 2 when using, the heat of its production is derived and is dispersed to square inslot 3 by fin 5 through heat-conducting plate 4, the heat in square inslot 3 is through first through-hole 7, first recess 6 and second through-hole 10, second recess 9 is led to ventilation groove 8 in and is dispersed to external environment, thereby dispel the heat to preventing static mainboard body 2.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a static mobile phone motherboard is prevented in heat dissipation, includes base plate (1), its characterized in that, it has antistatic mainboard body (2) to connect through heat conduction silica gel in the middle of base plate (1) top, antistatic mainboard body (2) bottom four corners is provided with square groove (3), just square groove (3) are seted up in base plate (1) top, be provided with heat-conducting plate (4) and fin (5) in square groove (3), heat-conducting plate (4) outer wall is connected with base plate (1) all around, fin (5) equidistance sets up in heat-conducting plate (4) bottom, first recess (6) have been seted up in the middle of base plate (1) top, bilateral symmetry is provided with first through-hole (7) around first recess (6), base plate (1) top is seted up in first through-hole (7), first through-hole (7) are linked together with square groove (3), ventilation groove (8) have been seted up to base plate (1) bilateral symmetry, just ventilation groove (8) are linked together with first recess (6).

2. The heat-dissipation antistatic mobile phone motherboard according to claim 1, wherein the top of the base plate (1) is symmetrically provided with second grooves (9) in front and back, the front side of the second groove (9) is provided with a second through hole (10), the second through hole (10) is provided at the top of the base plate (1), the second through hole (10) is communicated with the square groove (3), and the second groove (9) is communicated with the ventilation groove (8).

3. The heat-dissipating and anti-static mobile phone motherboard according to claim 1, wherein a frame plate (11) is arranged in the ventilation groove (8), the outer wall of the frame plate (11) is attached to the substrate (1), and a dust screen (12) is arranged in the frame plate (11).

4. The heat dissipation and antistatic mobile phone motherboard according to claim 3, wherein the fixing bolts (13) are symmetrically arranged in front and back of one side of the frame plate (11), and the tail ends of the fixing bolts (13) penetrate through the frame plate (11) and are in threaded connection with the substrate (1).

5. The heat dissipation antistatic mobile phone motherboard according to claim 1, wherein the heat conducting plate (4) is provided with a first horizontal plate (14) at the bottom in bilateral symmetry, a vertical plate (15) is provided in the middle of the bottom of the first horizontal plate (14), a second horizontal plate (16) is provided at the bottom of the vertical plate (15), and the first horizontal plate (14) and the second horizontal plate (16) are both connected with the base plate (1).

6. The heat dissipation and antistatic mobile phone motherboard as claimed in claim 5, wherein the vertical plate (15) is connected with the first horizontal plate (14) and the second horizontal plate (16) to form an I-shaped structure.