CN218218143U - High-reliability high-temperature-resistant PCBA mainboard - Google Patents
High-reliability high-temperature-resistant PCBA mainboard Download PDFInfo
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- CN218218143U CN218218143U CN202222583828.7U CN202222583828U CN218218143U CN 218218143 U CN218218143 U CN 218218143U CN 202222583828 U CN202222583828 U CN 202222583828U CN 218218143 U CN218218143 U CN 218218143U
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Abstract
The utility model discloses a PCBA mainboard technical field, specifically is high reliable high temperature resistant PCBA mainboard, including PCBA mainboard and the mounting box that is used for installing the PCBA mainboard, install the heat conduction subassembly that is used for heat conduction on the PCBA mainboard; the heat conducting assembly comprises; the mounting hole is formed in the PCBA mainboard, and an annular heat conducting pad is mounted on the inner wall of the mounting hole; the outer wall of the heat conduction bolt is connected with the inner wall of the mounting hole and the inner wall of the annular heat conduction pad in a sliding manner; and heat-conducting component, heat-conducting component installation and PCBA mainboard below, the heat-conducting component top is connected with the heat conduction bolt bottom, the utility model discloses the heat of collecting together inside the mainboard of PCBA mainboard passes through mounting hole conduction to annular heat conduction pad, transmits to heat conduction bolt by annular heat conduction pad again, is conducted to heat-conducting component increase heat radiating area by heat conduction bolt again, improves the radiating efficiency.
Description
Technical Field
The utility model relates to a PCBA mainboard technical field specifically is high reliable high temperature resistant PCBA mainboard.
Background
PCBA is the abbreviation of English Printed Circuit Board Assembly, that is, PCBA is the abbreviation of PCBA when PCB blank Board is processed by SMT for loading or the whole process of DIP plug-in.
The existing PCBA mainboard has the main function of amplifying alternating current, so that the load capacity of the whole amplifying circuit can be improved, and the PCBA mainboard is small and exquisite and is convenient to install;
however, when the PCBA mainboard works and rectifies, a large amount of heat can be generated and accumulated in the mainboard and cannot be dissipated, the traditional heat dissipation is that the heat conduction and the heat dissipation are carried out by being connected with the outer wall of the mainboard, but the heat in the mainboard is slowly led out, and the heat dissipation is influenced.
Therefore, the invention discloses the high-reliability high-temperature-resistant PCBA mainboard.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned and/or the problem that exists in the current high reliable high temperature resistant PCBA mainboard, provided the utility model discloses.
Therefore, the utility model aims at providing a high reliable high temperature resistant PCBA mainboard can solve above-mentioned present PCBA mainboard of proposing when the work rectification, can produce a large amount of heat to save in the mainboard, and the dissipation can not fall, and traditional heat dissipation carries out heat conduction heat dissipation with the outer wall connection of mainboard, but the heat derivation in its mainboard is slow, influences radiating problem.
In order to solve the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:
high reliable high temperature resistant PCBA mainboard, it includes: the heat conduction assembly comprises a PCBA mainboard and a mounting box for mounting the PCBA mainboard, wherein a heat conduction assembly for conducting heat is mounted on the PCBA mainboard;
the heat conducting assembly comprises;
the mounting hole is formed in the PCBA mainboard, and an annular heat conducting pad is mounted on the inner wall of the mounting hole;
the outer wall of the heat conduction bolt is connected with the inner wall of the mounting hole and the inner wall of the annular heat conduction pad in a sliding manner; and
and the heat conducting component is arranged below the PCBA mainboard, and the top end of the heat conducting component is connected with the bottom end of the heat conducting bolt.
As a preferred scheme of high reliable high temperature resistant PCBA mainboard, wherein: the mounting hole is equipped with four groups, four groups the mounting hole set up respectively with front side, rear side, left side and the right side at PCBA mainboard top to run through in the PCBA mainboard.
As a preferred scheme of high reliable high temperature resistant PCBA mainboard, wherein: the heat conducting component comprises a heat conducting connecting cap, the inner wall of the top end of the heat conducting connecting cap is connected with the outer wall of the heat conducting bolt, and a heat radiating plate is installed on the outer wall of the heat conducting connecting cap.
As a preferred scheme of high reliable high temperature resistant PCBA mainboard, wherein: the heat conducting component further comprises a heat conducting frame, the top end of the heat conducting frame is provided with a threaded connecting hole corresponding to the mounting hole, and the inner wall of the threaded connecting hole is in threaded connection with the outer wall of the bottom end of the heat conducting bolt.
As a preferred scheme of high reliable high temperature resistant PCBA mainboard, wherein: the mounting box top end lid has closed the installation lid, and four corners fixed mounting of mounting box inner wall have the locating lever, and locating lever outer wall sliding connection has heat conduction rubber pad one.
As a preferred scheme of high reliable high temperature resistant PCBA mainboard, wherein: four corners of PCBA mainboard all set up with locating lever outer wall sliding connection's locating hole, the locating hole top install with locating lever outer wall sliding connection's heat conduction rubber pad two, locating lever top outer wall threaded connection has the nut.
As a preferred scheme of high reliable high temperature resistant PCBA mainboard, wherein: the mounting box both sides have all been seted up the louvre, and the protection casing is installed to the louvre outside.
As a preferred scheme of high reliable high temperature resistant PCBA mainboard, wherein: the protective cover is arc-shaped, one end of the protective cover is communicated with the heat dissipation holes, and the other end of the protective cover is of an opening structure.
As a preferred scheme of high reliable high temperature resistant PCBA mainboard, wherein: and a miniature radiating fan is arranged on the inner side of the radiating hole.
Compared with the prior art:
the heat of the built-up portion in the mainboard of PCBA mainboard is conducted to annular heat conduction pad through the mounting hole, is transmitted to the heat conduction bolt by annular heat conduction pad again, is conducted to the heat conduction part by the heat conduction bolt again and increases heat radiating area, improves the radiating efficiency.
Drawings
FIG. 1 is a front view of a PCBA main board of the present invention;
FIG. 2 is a front view of the PCBA main board and the inner wall of the mounting box;
FIG. 3 is an enlarged view of the area A in FIG. 2 according to the present invention;
FIG. 4 is a front view of the heat conductive connecting cap and the heat dissipating plate of the present invention;
FIG. 5 is a front view of the heat conducting bolt and the heat conducting frame of the present invention;
fig. 6 is a front view of the heat conduction frame of the present invention.
In the figure: PCBA mainboard 1, mounting box 2, installation lid 3, locating lever 4, locating hole 5, nut 6, heat conduction rubber pad 7, heat conduction rubber pad two 8, mounting hole 9, heat conduction bolt 10, heat conduction connecting cap 11, heating panel 12, heat conduction frame 13, threaded connection hole 14, louvre 15, protection casing 16, miniature radiator fan 17.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
The first embodiment is as follows:
the utility model provides a high-reliability high-temperature-resistant PCBA mainboard, which has the advantages of convenient use and improved heat dissipation efficiency, please refer to fig. 1-4, comprising a PCBA mainboard 1 and a mounting box 2 for mounting the PCBA mainboard 1, wherein the PCBA mainboard 1 is provided with a heat conduction component for heat conduction;
the heat conducting component comprises; the mounting hole 9 is formed in the PCBA mainboard 1, and an annular heat conducting pad is mounted on the inner wall of the mounting hole 9; the outer wall of the heat conduction bolt 10 is connected with the inner wall of the mounting hole 9 and the inner wall of the annular heat conduction pad in a sliding manner; the heat conducting component is arranged below the PCBA mainboard 1, the top end of the heat conducting component is connected with the bottom end of the heat conducting bolt 10, four groups of mounting holes 9 are arranged, the four groups of mounting holes 9 are respectively arranged on the front side, the rear side, the left side and the right side of the top of the PCBA mainboard 1 and penetrate through the PCBA mainboard 1, heat accumulated in the PCBA mainboard 1 is conducted to the annular heat conducting pad through the mounting holes, then is transmitted to the heat conducting bolt 10 through the annular heat conducting pad, and then is conducted to the heat conducting component through the heat conducting bolt 10 to increase the heat radiating area and improve the heat radiating efficiency.
The heat conducting component comprises a heat conducting connecting cap 11, the inner wall of the top end of the heat conducting connecting cap 11 is connected with the outer wall of the heat conducting bolt 10, and a heat radiating plate 12 is installed on the outer wall of the heat conducting connecting cap 11.
2 top end covers of mounting box have closed installation lid 3, four corners fixed mounting of 2 inner walls of mounting box have locating lever 4, 4 outer wall sliding connection of locating lever have heat conduction rubber pad 7, four corners of PCBA mainboard 1 all set up with 4 outer wall sliding connection's of locating lever locating hole 5, 5 tops of locating hole install with 4 outer wall sliding connection's of locating lever heat conduction rubber pad two 8, 4 top outer wall threaded connection of locating lever have nut 6, louvre 15 has all been seted up to 2 both sides of mounting box, protection casing 16 is installed in the 15 outside of louvre, the shape of protection casing 16 is established to the arc, the one end of protection casing 16 communicates with each other with louvre 15, the other end is established to open structure, miniature radiator fan 17 is installed to louvre 15's inboard.
When the heat dissipation device is used specifically, the heat conduction bolt 10 is an aluminum bolt and has a high heat conductivity coefficient, a person skilled in the art fixedly installs an annular heat conduction pad in each installation hole 9, the heat conduction bolt 10 penetrates through the inner wall of each installation hole 9 to be connected with the heat conduction connection cap 11, the outer wall of the heat conduction bolt is attached to the inner wall of the annular heat conduction pad, the outer wall of the heat conduction connection cap 11 is fixedly provided with a heat dissipation plate 12, each positioning rod 4 is provided with a first heat conduction rubber pad 7, the PCBA mainboard 1 is connected with the outer wall of the positioning rod 4 through the positioning hole 5, a second heat conduction rubber pad 8 is installed above the positioning hole 5 of the PCBA mainboard 1 and is in sliding connection with the outer wall of the positioning rod 4, the nut 6 is in threaded connection with the outer wall at the top end of the positioning rod 4, the PCBA mainboard 1 is fixed, the micro heat dissipation fan 17 is opened to accelerate air flow, one part of heat generated by the PCBA mainboard 1 is conducted to the heat conduction bolt 10 through the installation hole 9, the heat conduction bolt 10 is conducted to the heat conduction connection cap 11 and the heat dissipation plate 12, the heat dissipation area is enlarged, and the other part is conducted to the first heat conduction rubber pad 7 and the second heat dissipation plate 8, and the heat dissipation efficiency is improved.
Example two:
the utility model provides a high reliable high temperature resistant PCBA mainboard please refer to 5-6, and heat-conducting component still includes heat conduction frame 13, and threaded connection hole 14 corresponding with mounting hole 9 is seted up on heat conduction frame 13 top, and threaded connection hole 14 inner wall carries out threaded connection with heat conduction bolt 10 bottom outer wall.
When the heat conduction bolt is used specifically, the heat conduction bolt 10 is an aluminum bolt and has a high heat conduction coefficient, a person skilled in the art fixedly installs an annular heat conduction pad in each installation hole 9, the heat conduction bolt 10 penetrates through the inner wall of each installation hole 9 to be connected with the heat conduction frame 13, the outer wall of the heat conduction bolt is attached to the inner wall of the annular heat conduction pad, a first heat conduction rubber pad 7 is installed on each positioning rod 4, the PCBA mainboard 1 is connected with the outer wall of the positioning rod 4 through the positioning hole 5, a second heat conduction rubber pad 8 is installed above the positioning hole 5 of the PCBA mainboard 1 and is in sliding connection with the outer wall of the positioning rod 4, the nut 6 is in threaded connection with the outer wall at the top end of the positioning rod 4, the PCBA mainboard 1 is fixed, the miniature heat dissipation fan 17 is opened to accelerate air flow, a part of heat generated by the PCBA mainboard 1 is conducted to the heat conduction bolt 10 through the installation hole 9, the heat conduction bolt 10 is conducted to the heat conduction frame 13, the heat dissipation area is enlarged, a part of the heat conduction rubber pad 7 and the second heat conduction rubber pad 8, and the miniature heat dissipation fan 17 accelerates air flow, and improves the heat dissipation efficiency.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (9)
1. High-reliable high temperature resistant PCBA mainboard, including PCBA mainboard (1) and mounting box (2) that are used for installing PCBA mainboard (1), its characterized in that: a heat conduction component for conducting heat is arranged on the PCBA main board (1);
the heat conducting assembly comprises;
the mounting hole (9), the mounting hole (9) is opened and connected with the PCBA mainboard (1), and the inner wall of the mounting hole (9) is provided with an annular heat conducting pad;
the outer wall of the heat conduction bolt (10) is connected with the inner wall of the mounting hole (9) and the inner wall of the annular heat conduction pad in a sliding mode; and
the heat conducting component is arranged below the PCBA main board (1), and the top end of the heat conducting component is connected with the bottom end of the heat conducting bolt (10).
2. The PCBA mainboard as recited in claim 1, wherein four sets of said mounting holes (9) are provided, and said four sets of said mounting holes (9) are respectively opened on the front side, the rear side, the left side and the right side of the top of the PCBA mainboard (1) and penetrate through the PCBA mainboard (1).
3. The PCBA mainboard as recited in claim 2, wherein, the heat conduction part comprises a heat conduction connection cap (11), the top inner wall of the heat conduction connection cap (11) is connected with the outer wall of the heat conduction bolt (10), and the outer wall of the heat conduction connection cap (11) is provided with a heat dissipation plate (12).
4. The PCBA mainboard as recited in claim 2, wherein the heat conduction component further comprises a heat conduction frame (13), the top end of the heat conduction frame (13) is provided with a threaded connection hole (14) corresponding to the mounting hole (9), and the inner wall of the threaded connection hole (14) is in threaded connection with the outer wall of the bottom end of the heat conduction bolt (10).
5. The PCBA mainboard as recited in claim 1, wherein, the top end of the mounting box (2) is covered with a mounting cover (3), positioning rods (4) are fixedly mounted at four corners of the inner wall of the mounting box (2), and a first heat-conducting rubber gasket (7) is slidably connected to the outer wall of the positioning rods (4).
6. The PCBA mainboard of claim 5, wherein locating holes (5) slidably connected with the outer wall of the locating rod (4) are formed in four corners of the PCBA mainboard (1), a second heat-conducting rubber pad (8) slidably connected with the outer wall of the locating rod (4) is mounted above the locating holes (5), and a nut (6) is in threaded connection with the outer wall of the top end of the locating rod (4).
7. The high-reliability high-temperature-resistant PCBA mainboard as recited in claim 1, wherein heat dissipation holes (15) are formed in both sides of the mounting box (2), and a protective cover (16) is installed outside the heat dissipation holes (15).
8. The PCBA main board as recited in claim 7, wherein the shield (16) is arc-shaped, one end of the shield (16) is communicated with the heat dissipation hole (15), and the other end is open structure.
9. The PCBA main board in accordance with claim 7, wherein the inside of the heat dissipation hole (15) is installed with a micro heat dissipation fan (17).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202222583828.7U CN218218143U (en) | 2022-09-28 | 2022-09-28 | High-reliability high-temperature-resistant PCBA mainboard |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202222583828.7U CN218218143U (en) | 2022-09-28 | 2022-09-28 | High-reliability high-temperature-resistant PCBA mainboard |
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Publication Number | Publication Date |
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CN218218143U true CN218218143U (en) | 2023-01-03 |
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CN202222583828.7U Active CN218218143U (en) | 2022-09-28 | 2022-09-28 | High-reliability high-temperature-resistant PCBA mainboard |
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- 2022-09-28 CN CN202222583828.7U patent/CN218218143U/en active Active
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