CN210406045U - Sealed case heat dissipation device and sealed case - Google Patents
Sealed case heat dissipation device and sealed case Download PDFInfo
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- CN210406045U CN210406045U CN201921392321.5U CN201921392321U CN210406045U CN 210406045 U CN210406045 U CN 210406045U CN 201921392321 U CN201921392321 U CN 201921392321U CN 210406045 U CN210406045 U CN 210406045U
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Abstract
The utility model relates to a heat dissipation technical field discloses a canned type machine case heat abstractor and canned type machine case are used for dispelling the heat to the electronic components that generate heat in the mounting plate case, include: the internal heat transfer system is positioned in the sealed case and is abutted against the heating electronic component, and the heat generated by the heating electronic component can be transferred to the internal heat transfer system; the external heat transfer system comprises a blowing part and heat dissipation cover plates, wherein the heat dissipation cover plates are all made of soaking plates, the blowing part is arranged on the inner sides of the heat dissipation cover plates, and the external heat transfer system is used for transferring heat outside the sealing area to the outside air; a plurality of heat dissipation apron interconnect can heat transfer each other between a plurality of heat dissipation apron, and a plurality of heat dissipation apron all are used for the outside air heat transfer. The utility model discloses a canned type machine case heat abstractor's radiating efficiency is high, can effectively reduce canned type quick-witted incasement portion temperature, has improved canned type machine case's performance and has increased quick-witted incasement electronic components's alternative.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to a canned type machine case heat abstractor and canned type machine case.
Background
At present, most of the chassis of the existing electronic devices adopt fans to perform forced convection to dissipate heat. The heat radiation fan is arranged in the case, and blows the external air to the heating electronic components through forced convection, so that the heat exchange between the heating electronic components and the external air is realized. Because the technology needs the high-speed rotation of the cooling fan and the heating electronic components are directly communicated with the outside air, the noise of the case is relatively large, the case of the equipment is not sealed, the dust and moisture can not be prevented, and the service performance and the service life of the electronic components in the case are seriously influenced.
The heat dissipation of the chassis of the existing sealed electronic equipment mostly adopts a method of increasing the heat dissipation area and the surface area of the chassis, so that the size of the chassis is increased, the chassis is large in size, heavy in weight and high in cost, and unnecessary waste is caused. Moreover, the chassis of the existing sealed electronic device has low heat dissipation efficiency and high internal temperature, which seriously restricts the improvement of the corresponding device performance and the selection of the electronic components in the chassis.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a canned type machine case heat abstractor, this canned type machine case heat abstractor's radiating efficiency is high, can effectively reduce quick-witted incasement portion temperature.
In order to achieve the purpose, the utility model adopts the following technical proposal:
a sealed chassis heat sink for dissipating heat from heat-generating electronic components mounted in a sealed chassis, comprising:
an internal heat transfer system which is located in the sealed case and is in contact with the heat-generating electronic component, and which allows heat generated by the heat-generating electronic component to be transferred to the internal heat transfer system;
the external heat transfer system comprises a blowing part and a plurality of heat dissipation cover plates, the heat dissipation cover plates are all made of soaking plates, the blowing part is arranged on the inner sides of the heat dissipation cover plates, and the external heat transfer system is used for transferring heat of the internal heat transfer system to the outside air;
the heat dissipation cover plates are connected with each other, heat can be conducted among the heat dissipation cover plates, and the heat dissipation cover plates are used for transferring heat to outside air.
Preferably, the internal heat transfer system includes a heat conduction structure made of a vapor chamber and a heat sink, and one side of the heat conduction structure abuts against the heat-generating electronic component and the other side abuts against the heat sink.
Preferably, the air blowing part comprises a fan and an air cavity, the air cavity consists of the radiator, one heat dissipation cover plate and an air cavity baffle, the air cavity baffle is connected between the radiator and the one heat dissipation cover plate, and the fan is located in the air cavity.
Preferably, the heat dissipation cover plate comprises a first heat dissipation cover plate, and the first heat dissipation cover plate is covered on the air cavity and connected to the air cavity baffle.
Preferably, an air inlet and an air outlet are formed in the first heat dissipation cover plate, the air inlet and the air outlet are communicated with the air cavity, and the air cavity baffle at the air outlet is obliquely arranged to facilitate the outflow of air in the air cavity.
Preferably, the heat dissipation cover plate further comprises a second heat dissipation cover plate and a third heat dissipation cover plate, and the second heat dissipation cover plate and the third heat dissipation cover plate are connected to two opposite ends of the first heat dissipation cover plate.
Preferably, the outer surface and the inner surface of the first heat dissipation cover plate are both provided with heat dissipation fins, and the heat dissipation fins on the inner surface of the first heat dissipation cover plate are both located in the air cavity and used for increasing the heat dissipation area of the first heat dissipation cover plate.
Preferably, the heat sink is provided with heat dissipation fins for transferring heat of the heat sink to the air cavity.
Preferably, the wind direction in the wind cavity is parallel to both the extending direction of the wind guide grooves on the heat dissipation fins on the inner surface of the first heat dissipation cover plate and the extending direction of the wind guide grooves on the heat dissipation fins of the heat sink.
Another object of the utility model is to provide a canned type machine case, this canned type machine case radiating efficiency is high, small, light in weight, can be dustproof, dampproofing, and strong adaptability to adverse circumstances is strong.
To achieve the purpose, the utility model adopts the following technical proposal:
a sealed case comprises the sealed case heat dissipation device of any one of the above aspects.
The utility model has the advantages that:
the utility model provides a canned type machine case heat abstractor and canned type machine case, this canned type machine case heat abstractor are used for dispelling the heat to the electronic components that generate heat who installs at canned type quick-witted incasement, through the setting that sets up inside heat transfer system and outside heat transfer system at canned type machine incasement for the heat of the electronic components that generate heat of canned type machine incasement transmits inside heat transfer system earlier, then transmits outside heat transfer system again, finally transmits to the outside air. The heat dissipation cover plate of the sealed case adopts the vapor chamber, so that the heat transfer speed is improved, the temperature in the case is rapidly reduced, the heat dissipation surface area of the case is increased due to the arrangement of the heat dissipation cover plate, the surface temperature of the case is more uniform, the heat dissipation capacity of the case with the same surface area is improved, the heat dissipation capacity of the case is improved, and the volume of the case is effectively reduced; meanwhile, the heat dissipation device of the sealed case can rapidly guide heat generated by the heating electronic components to the surface of the case, so that the requirements on the performance of the electronic components are reduced, the selectivity of the electronic components is increased, the working reliability of the electronic components is ensured, and the functions and the performance of the case with the same volume are improved. In addition, the heating electronic components of the sealed case are positioned in the sealed case, so that sand dust, flying floc, salt mist and the like can be effectively prevented, and the adaptability of the case to severe environments is improved.
Drawings
Fig. 1 is an exploded schematic view of a heat dissipation device of a sealed enclosure according to an embodiment of the present invention;
fig. 2 is a front view of a heat dissipation device for a sealed enclosure according to an embodiment of the present invention;
fig. 3 is a top view of a heat dissipation device for a sealed enclosure according to an embodiment of the present invention;
fig. 4 is a cross-sectional view of a heat dissipation device for a sealed enclosure according to an embodiment of the present invention;
fig. 5 is a heat dissipation schematic diagram of a heat dissipation device for a sealed chassis according to an embodiment of the present invention.
In the figure:
1. an internal heat transfer system; 11. a heat conducting structure; 12. a heat sink;
2. an external heat transfer system; 21. a blowing section; 211. a fan; 212. a wind cavity; 2121. a wind cavity baffle; 22. a heat dissipation cover plate; 221. a first heat dissipation cover plate; 2211. an air inlet hole; 2212. an air outlet; 222. a second heat-dissipating cover plate; 223. a third heat dissipation cover plate;
100. a heat-generating electronic component;
200. a sealed case is provided.
Detailed Description
In order to make the technical problem solved by the present invention, the technical solutions adopted by the present invention and the technical effects achieved by the present invention clearer, the following will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The present embodiment provides a sealed enclosure 200, in which a sealed enclosure 200 is provided with a sealed enclosure heat sink, which is used to dissipate heat generated from a heat generating electronic component 100 mounted in the sealed enclosure 200, and which includes an internal heat transfer system 1 and an external heat transfer system 2 that exchanges heat with the internal heat transfer system 1, as can be seen from fig. 1.
Specifically, the internal heat transfer system 1 is located inside the sealed enclosure 200 and is in contact with the heat-generating electronic component 100, and the heat generated by the heat-generating electronic component 100 can be transferred to the internal heat transfer system 1; adjacent to the internal heat transfer system 1 is an external heat transfer system 2, the external heat transfer system 2 being used for transferring heat of the internal heat transfer system 1 to the outside air.
In this embodiment, the heat dissipation device of the sealed enclosure cooperates with the internal heat transfer system 1 and the external heat transfer system 2, and the heat of the heat-generating electronic component 100 in the sealed enclosure is transferred to the internal heat transfer system 1, then to the external heat transfer system 2, and finally to the outside air. Specifically, the external heat transfer system 2 includes a blowing portion 21 and a plurality of heat dissipation cover plates 22, the blowing portion 21 is disposed between the internal heat transfer system 1 and the heat dissipation cover plates 22, the blowing portion 21 can transfer heat of the internal heat transfer system 1 to the outside of the chassis by blowing, and the heat of the internal heat transfer system 1 can also be transferred to the heat dissipation cover plates 22 in the form of heat radiation, so as to be transferred to the outside of the chassis. The plurality of interconnected heat-dissipating cover plates 22 can transfer heat with each other, so that the temperature uniformity of the heat-dissipating cover plates 22 is improved, and the heat-dissipating area of the case is increased. The heat dissipation cover plate 22 is made of a vapor chamber, which is a plate body with a fine vacuum cavity structure on the inner wall, and has high thermal convection coefficient and high heat transfer efficiency, thereby being beneficial to realizing the rapid heat dissipation of the heat dissipation cover plate 22.
The sealed case radiating device improves the heat transfer speed and the radiating capacity of the case surface, the radiating surface area of the case is increased, the surface temperature of the case is more uniform, the internal temperature of the case can be quickly reduced, and the radiating capacity of the case with the same surface area is improved, so that the radiating capacity of the case is improved, the sealed case radiating device can be adapted to the case with higher heat production, the size and the weight of the case can be reduced effectively, the case cost is reduced, and the waste is avoided; the sealed case heat dissipation device can effectively reduce the working temperature in the case, thereby reducing the requirements on the performance of electronic components, increasing the selectivity of the electronic components, being adaptable to the case with larger power, ensuring the reliable work and improving the function and performance of the case with the same volume.
In the present embodiment, as shown in fig. 1-5, the internal heat transfer system 1 comprises a heat conducting structure 11 and a heat sink 12. Preferably, the heat conducting structure 11 and the heat sink 12 are both made of vapor chamber, the vapor chamber is a plate body with a fine vacuum cavity structure on the inner wall, and is preferably made of copper, so that the heat convection coefficient is high, the heat transfer efficiency is high, and the rapid heat transfer of the heat conducting structure 11 and the heat sink 12 can be realized. Specifically, as shown in fig. 1, the heat conducting structure 11 includes a heat conducting structure cavity 111 and a heat conducting structure plate 112, and the heat sink 12 includes a heat sink cavity 121 and a heat sink plate 122. Since the lower surface of the heat conducting structure 11 abuts against the heat generating electronic component 100 and the upper surface of the heat conducting structure 11 abuts against the heat sink 12, the heat generated by the heat generating electronic component 100 can be quickly transferred to the heat conducting structure 11 first, the heat conducting structure 11 can also quickly transfer the heat to the heat sink 12, and the heat is further transferred to the external heat transfer system 2 by the upper surface of the heat sink 12. Preferably, the external heat transfer system 2 comprises a blowing portion 21 and a heat-radiating cover plate 22. Further, the heat dissipation cover plate 22 is made of a vapor chamber, the vapor chamber is a plate body with a fine vacuum cavity structure on the inner wall, and is preferably made of copper, the vapor chamber has a high thermal convection coefficient, has high heat transfer efficiency, and can realize rapid heat transfer of the heat dissipation cover plate 22. The blowing portion 21 is disposed between the heat sink 12 and the heat radiating cover 22, and the blowing portion 21 of the external heat transfer system 2 transfers heat of the heat sink 12 to the external air by blowing. Wherein, the below of radiator 12 is heat conduction structure 11, will blow the portion 21 and set up in radiator 12 top, can make the electronic components that generate heat not directly communicate with each other with the outside air and carry out the heat exchange, can prevent that dust and steam in the outside air from contacting the electronic components that generate heat, improves quick-witted incasement electronic components's performance and life-span.
The internal heat transfer system 1 and the heat dissipation cover plate 22 are both made of vapor plates, the vapor plates are high in heat convection coefficient, high in heat transfer efficiency, low in expansion thermal resistance, uniform in heat flux, high in heat transfer speed and light in weight, and heat generated by the heating electronic component 100 can be rapidly conducted out to the surface of the case, so that the internal temperature of the case is effectively reduced, and the working efficiency of the case temperature control system is improved. Preferably, the thickness of the sealed enclosure 200 in this embodiment is not less than 7mm, which facilitates the installation of the vapor chamber.
In this embodiment, the blowing part 21 includes a fan 211 and a wind cavity 212, the wind cavity 212 is composed of the heat sink 12, one of the heat sink cover plates 22 and a wind cavity shield 2121, the wind cavity shield 2121 is connected between the heat sink 12 and one of the heat sink cover plates 22, and the fan 211 is located in the wind cavity 212 to provide power for the air flowing in the wind cavity 212. The air cavity shield 2121 not only serves to form the air cavity 212, but the shield 2121 and the heat sink 12 can also isolate the air cavity 212 from the sealed case, so as to prevent dust in the air flow blown in the air cavity 212 from entering the sealed case. Specifically, the wind chamber shield 2121 and the heat sink 12 and a heat sink cover plate 22 may be connected by screws, welding, or the like. Further, a wind chamber 212 is formed between the upper surface of the heat sink 12 and the lower surface of the heat-radiating cover plate 22. The heat-dissipating cover plate 22 is not connected to the internal heat transfer system 1, which facilitates the assembly, disassembly, maintenance and replacement of the heat-dissipating cover plate 22 and the internal heat-generating electronic component 100. Preferably, the heat sink 12 is provided with heat dissipating fins on a side surface of the air cavity 212, the heat dissipating fins are located in the air cavity 212, and the heat dissipating fins can increase the heat dissipating area of the heat sink 12, thereby facilitating the heat sink 12 to rapidly transfer heat to the surface of the heat sink 12 and enhancing the heat exchange between the heat sink 12 and the air flow in the air cavity 212. Preferably, the fan 211 is located at one end of the wind cavity 212, which can increase the length of the ventilation air channel in the wind cavity 212, so that the flow path of the external air in the wind cavity 212 is longer, which is beneficial for the external air to take away more heat on the heat dissipation fins.
Since the front cover is generally provided with operation buttons, indicator lights, maintenance windows, and the like, and the rear cover is generally provided with a plurality of plugs, referring to fig. 3 and 4, in the present embodiment, only the upper cover and the left and right covers are replaced with vapor chambers, that is, the heat dissipation cover 22 includes a first heat dissipation cover 221, a second heat dissipation cover 222, and a third heat dissipation cover 223. Specifically, as shown in fig. 1, the first heat sink cover 221 includes a first heat sink cover cavity 2211 and a first heat sink cover plate 2212, the second heat sink cover 222 includes a second heat sink cover cavity 2221 and a second heat sink cover plate 2222, and the third heat sink cover 223 includes a third heat sink cover cavity 2231 and a third heat sink cover plate 2232. The first heat-dissipating cover plate 221 covers the air cavity 212, and the second heat-dissipating cover plate 222 and the third heat-dissipating cover plate 223 are respectively connected to two opposite sides of the first heat-dissipating cover plate 221, so that the heat-dissipating cover plate 22 is integrally of a U-shaped structure, the effective heat-dissipating area of the case is increased, the surface temperature of the case is more uniform, and the temperature inside the case can be rapidly reduced. Of course, in another embodiment, the top cover, the bottom cover, the left and right side covers, and the front and rear side covers of the chassis may be replaced with vapor chambers.
Preferably, heat dissipation fins are disposed on both the outer surface and the inner surface of the first heat dissipation cover plate 221, the outer surface of the first heat dissipation cover plate 221 is outside the chassis, and the inner surface of the first heat dissipation cover plate 221 is inside the chassis. The heat dissipation fins on the inner surface of the first heat dissipation cover plate 221 are located in the air cavity 212, and the heat dissipation fins can increase the heat dissipation area of the first heat dissipation cover plate 221, so that heat of the air cavity 212 can be transferred to the first heat dissipation cover plate 221, the contact area of the first heat dissipation cover plate 221 and the outside air can be increased, and the heat conduction efficiency of the first heat dissipation cover plate 221 can be improved. More preferably, a surface blowing system is disposed outside the chassis to force outside air to form convection, and the convection air flows through the air guiding grooves of the heat dissipating fins on the upper outer surface of the first heat dissipating cover 221 to take away heat of the heat dissipating fins, which is beneficial to making the surface temperature of the chassis more uniform.
In this embodiment, the extending direction of the air guiding grooves of the heat dissipating fins on the inner surface of the first heat dissipating cover 221 and the extending direction of the air guiding grooves of the heat dissipating fins on the heat sink 12 are parallel to the flow direction of the air flow in the air cavity 212, so that the air flow in the air cavity 212 is smooth, and the air flow introduced into the air cavity 212 can take away the heat on the heat dissipating fins of the heat sink 12 along the air guiding grooves of the heat dissipating fins on the inner surface of the first heat dissipating cover 221 and the air guiding grooves of the heat dissipating fins on the heat sink 12, and can be smoothly discharged to the outside air. Preferably, the fan 211 includes four silent ultrathin axial fans, so that the flow direction of the air inside the air cavity 212 is parallel to the extending direction of the air guiding grooves of the heat dissipating fins on the inner surface of the first heat dissipating cover 221, thereby achieving the best auxiliary heat dissipating effect, improving the working efficiency of the temperature control system, reducing the noise of the chassis, and improving the man-machine environment. Under the action of the fan 211, the outside air is forcibly sucked into the air cavity 212 and flows through the air guide grooves of the heat dissipation fins in the air cavity 212 to take away the heat on the heat dissipation fins, so that the surface temperature of the chassis is more uniform, and the temperature in the chassis is rapidly reduced.
Preferably, referring to fig. 5, the first heat dissipation cover plate 221 is provided with an air inlet 2211 and an air outlet 2212, and the air inlet 2211 and the air outlet 2212 are communicated through the air cavity 212. Preferably, the air inlet 2211 is formed in one end of the first heat dissipation cover 221 and is disposed opposite to the fan 211, so that the fan 211 can suck more external air into the air cavity 212, and the air flow brings heat on the heat dissipation fins in the air cavity 212 out to the external air through the air outlet 2212, thereby achieving heat dissipation of the heat dissipation device for the sealed chassis. Preferably, the air cavity baffle 2121 at the air outlet 2212 is obliquely arranged, so that the air in the air cavity 212 can be smoothly extruded by the airflow blown by the fan 211 along the slope of the air cavity baffle 2121, the air in the air cavity 212 can smoothly flow out, and the flowability of the air in the air cavity 212 is improved. In this embodiment, the air cavity 212 of the external heat transfer system 2 is independent from the inside of the sealed enclosure, so that impurities such as sand and dust can be effectively prevented from entering the inside of the enclosure, and the sealing and electromagnetic shielding effects of the enclosure are not affected. The air cavity 212 adopts an embedded structure and a design of an invisible air channel, so that the processing difficulty can be reduced, sand dust, salt mist, flying floc and the like can be effectively prevented from entering the air cavity 212, the blockage of the air cavity 212 can be avoided, and the air circulation in the air cavity 212 is smooth.
In this embodiment, most of the heat sink 12 is taken away by the outside air introduced into the air cavity 212; a small part of heat is transferred to the first heat dissipation cover plate 221 in a radiation and convection manner, the heat of the first heat dissipation cover plate 221 is rapidly transferred to the outer surface of the first heat dissipation cover plate 221, the second heat dissipation cover plate 222 and the third heat dissipation cover plate 223, and the heat transferred to the outer surface of the first heat dissipation cover plate 221 is transferred to the outside air in a radiation and natural convection manner through the heat dissipation fins on the outer surface of the first heat dissipation cover plate 221; the heat transferred to the second and third heat radiating cover plates 222 and 223 is transferred to the external air by means of radiation and natural convection. Preferably, the outer surfaces of the second heat dissipation cover plate 222 and the third heat dissipation cover plate 223 are both provided with heat dissipation fins, which can increase the contact area between the second heat dissipation cover plate 222 and the third heat dissipation cover plate 223 and the outside air, and increase the heat dissipation speed.
The sealed case 200 provided by the embodiment can not only prevent sand and dust, flying floc and salt fog, so that the case has the characteristics of dust prevention and moisture prevention, but also prolong the service life of electronic components in the case, and improve the adaptability of the case to severe environments such as high temperature, low temperature and sand and dust.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A heat dissipating apparatus for a sealed enclosure for dissipating heat from a heat generating electronic component (100) mounted in the sealed enclosure, comprising:
an internal heat transfer system (1) which is located in the sealed case and is in contact with the heat-generating electronic component (100), and which allows heat generated by the heat-generating electronic component (100) to be transferred to the internal heat transfer system (1);
an external heat transfer system (2) comprising a blowing part (21) and a plurality of radiating cover plates (22), wherein the plurality of radiating cover plates (22) are made of soaking plates, the blowing part (21) is arranged between the internal heat transfer system (1) and the radiating cover plates (22), and the external heat transfer system (2) is used for transferring heat of the internal heat transfer system (1) to the outside air;
the heat dissipation cover plates (22) are connected with each other, heat can be mutually transferred among the heat dissipation cover plates (22), and the heat dissipation cover plates (22) are all used for transferring heat to outside air.
2. The sealed cabinet heat sink according to claim 1, wherein the internal heat transfer system (1) comprises a heat conducting structure (11) made of vapor chamber and a heat sink (12), one side of the heat conducting structure (11) abutting the heat generating electronic component (100) and the other side abutting the heat sink (12).
3. The sealed chassis heat sink of claim 2, wherein the wind blowing portion (21) includes a fan (211) and a wind cavity (212), the fan (211) being located in the wind cavity (212), the wind cavity (212) being comprised of the heat sink (12), one of the heat dissipating cover plates (22), and a wind cavity shield (2121), the wind cavity shield (2121) being connected between the heat sink (12) and one of the heat dissipating cover plates (22) for isolating the wind cavity (212) from the sealed chassis.
4. The sealed chassis heatsink of claim 3, wherein said heatsink cover plate (22) comprises a first heatsink cover plate (221), said first heatsink cover plate (221) covering said wind cavity (212) and being connected to said wind cavity dam (2121).
5. The sealed type case heat dissipation device of claim 4, wherein an air inlet hole (2211) and an air outlet hole (2212) are formed in the first heat dissipation cover plate (221), the air inlet hole (2211) and the air outlet hole (2212) are communicated through the air cavity (212), and the air cavity baffle (2121) at the air outlet hole (2212) is obliquely arranged to facilitate outflow of air in the air cavity (212).
6. The sealed-type case heat sink of claim 4, wherein the heat-dissipating cover (22) further comprises a second heat-dissipating cover (222) and a third heat-dissipating cover (223), the second heat-dissipating cover (222) and the third heat-dissipating cover (223) being connected to opposite ends of the first heat-dissipating cover (221).
7. The sealed-type case heat sink as defined in claim 4, wherein the first heat-dissipating cover (221) has heat-dissipating fins on both the outer surface and the inner surface thereof, and the heat-dissipating fins on the inner surface of the first heat-dissipating cover (221) are located in the air cavity (212) to increase the heat-dissipating area of the first heat-dissipating cover (221).
8. The sealed chassis heat sink of claim 7, wherein heat fins are provided on the heat sink (12) for transferring heat from the heat sink (12) into the wind cavity (212).
9. The sealed-type case heat sink of claim 8, wherein the direction of the wind in the wind chamber (212) is parallel to both the direction of the air guide grooves in the heat dissipating fins on the inner surface of the first heat dissipating cover (221) and the direction of the air guide grooves in the heat dissipating fins of the heat sink (12).
10. A sealed cabinet comprising a sealed cabinet and the sealed cabinet heat sink of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921392321.5U CN210406045U (en) | 2019-08-26 | 2019-08-26 | Sealed case heat dissipation device and sealed case |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921392321.5U CN210406045U (en) | 2019-08-26 | 2019-08-26 | Sealed case heat dissipation device and sealed case |
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| CN210406045U true CN210406045U (en) | 2020-04-24 |
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| CN201921392321.5U Active CN210406045U (en) | 2019-08-26 | 2019-08-26 | Sealed case heat dissipation device and sealed case |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110418557A (en) * | 2019-08-26 | 2019-11-05 | 北京东土科技股份有限公司 | A kind of closed type cabinet cooling device and closed type cabinet |
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2019
- 2019-08-26 CN CN201921392321.5U patent/CN210406045U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110418557A (en) * | 2019-08-26 | 2019-11-05 | 北京东土科技股份有限公司 | A kind of closed type cabinet cooling device and closed type cabinet |
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