CN212463834U - Plastic cooling fin with excellent heat conduction performance - Google Patents
Plastic cooling fin with excellent heat conduction performance Download PDFInfo
- Publication number
- CN212463834U CN212463834U CN202020461456.9U CN202020461456U CN212463834U CN 212463834 U CN212463834 U CN 212463834U CN 202020461456 U CN202020461456 U CN 202020461456U CN 212463834 U CN212463834 U CN 212463834U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat dissipation
- layer
- plastic
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a plastic fin that heat conductivility is excellent, including plastic fin main part, the lower extreme surface of plastic fin main part is provided with can dismantle the heat dissipation and connect the mainboard, one side of plastic fin main part is provided with the radiating block that can lead heat. A plastic fin that heat conductivility is excellent, through the dismantlement heat dissipation connection mainboard that sets up, can let the simple position of installing in the difference of fin, it is also very convenient to connect between the fin, the application range that makes the fin is wider, and should dismantle heat dissipation connection mainboard and divide into heat transfer bottom plate and heat dissipation upper plate, it is better with radiating effect to transfer heat like this, can let heat conductivility increase through the heat dissipation piece that can lead who sets up, this heat dissipation piece that can lead divide into the three-layer altogether, be a heat transfer layer respectively, heat dissipation layer and No. two heat transfer layers, and the louvre has been designed on the heat dissipation layer, the elasticity and the heat dissipation function on heat dissipation layer have been strengthened, bring better use prospect.
Description
Technical Field
The utility model relates to a fin field specifically is a plastic fin that heat conductivility is excellent.
Background
The radiating fin is a device for radiating heat of electronic elements which are easy to generate heat in electrical appliances, and is made of aluminum alloy, brass or bronze into plate, sheet or multi-sheet, for example, a CPU in a computer needs to use a relatively large radiating fin, a power tube, a line tube and a power amplifier in a power amplifier all use radiating fins, and a layer of heat-conducting silicone grease is coated on the contact surface of the electronic elements and the radiating fins when the radiating fin is used, so that the heat generated by the elements is more effectively conducted to the radiating fins and then is radiated to the ambient air through the radiating fins.
The existing plastic radiating fin is inconvenient to detach and connect when being installed and used, the heat transfer and radiating effects are not good, certain adverse effects are brought to the use process of people, and therefore the plastic radiating fin with excellent heat conducting performance is provided.
SUMMERY OF THE UTILITY MODEL
(1) Solves the technical problem
The utility model provides a to prior art not enough, the utility model provides a plastic fin that heat conductivility is excellent possesses easily to dismantle and the installation, and transfers heat and radiating effect advantage such as good, can effectively solve the problem in the background art.
(2) Technical scheme
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a plastic fin that heat conductivility is excellent, includes plastic fin main part, the lower extreme surface of plastic fin main part is provided with can dismantle the heat dissipation connection mainboard, one side of plastic fin main part is provided with the heat dissipation piece that can lead heat, one side of heat dissipation piece that can lead heat is provided with No. two heat dissipation diaphragms, the opposite side of heat dissipation piece that can lead heat is provided with a heat dissipation diaphragm, one side of a heat dissipation diaphragm is provided with the heat dissipation riser.
Preferably, the detachable heat dissipation connecting main board comprises a heat transfer bottom plate, a heat dissipation upper plate, a connecting plate and a screw, the heat transfer bottom plate is located on the outer surface of the lower end of the heat dissipation upper plate, the connecting plate is located on the outer surface of one side of the detachable heat dissipation connecting main board, and the screw is located on the outer surface of the upper end of the connecting plate.
Preferably, the heat-conducting radiating block comprises a first heat transfer layer, a radiating layer, radiating holes and a second heat transfer layer, wherein the first heat transfer layer is positioned on the outer surface of the lower end of the radiating layer, the second heat transfer layer is positioned on the outer surface of the upper end of the radiating layer, and the radiating holes are positioned on the outer surface of one side of the radiating layer.
Preferably, a fixing groove is formed between the heat transfer bottom plate and the heat dissipation upper plate, the outer surface of the upper end of the heat transfer bottom plate is detachably connected with the outer surface of the lower end of the heat dissipation upper plate through the fixing groove, a fixing plate is arranged between the connecting plate and the detachable heat dissipation connecting main plate, and the outer surface of one side of the connecting plate is fixedly connected with the outer surface of one side of the detachable heat dissipation connecting main plate through the fixing plate.
Preferably, be provided with the recess between a heat transfer layer and the heat dissipation layer, the upper end surface on a heat transfer layer can be dismantled through recess and heat dissipation layer's lower extreme surface and be connected, be provided with the draw-in groove between No. two heat transfer layers and the heat dissipation layer, the lower extreme surface on No. two heat transfer layers can be dismantled through draw-in groove and heat dissipation layer's upper segment surface and be connected.
Preferably, a fixed block is arranged between the heat conduction and dissipation block 5 and the plastic heat dissipation sheet main body 1, and the outer surface of the lower end of the heat conduction and dissipation block 5 is fixedly connected with the outer surface of the upper end of the plastic heat dissipation sheet main body 1 through the fixed block.
Advantageous effects
Compared with the prior art, the utility model provides a plastic fin that heat conductivility is excellent possesses following beneficial effect:
1. this plastic fin that heat conductivility is excellent through the dismantlement heat dissipation connection mainboard that sets up, can let the simple position of installing in the difference of fin, and it is also very convenient that the connection between the fin makes the application range of fin wider, and should dismantle the heat dissipation connection mainboard and divide into heat transfer bottom plate and heat dissipation upper plate, and heat transfer and radiating effect also can be better like this.
2. This plastic fin that heat conductivility is excellent can let heat conductivility greatly increased through the radiating block that can lead that sets up, and this radiating block that can lead that heat divides into the three-layer altogether, is heat transfer layer, heat dissipation layer and No. two heat transfer layers respectively, and has designed the louvre on the heat dissipation layer, has strengthened the elasticity and the heat dissipation function on heat dissipation layer.
Drawings
Fig. 1 is a schematic view of the overall structure of the plastic heat sink with excellent heat conductivity.
Fig. 2 is the utility model relates to a can dismantle heat dissipation connection mainboard overall structure picture in the plastic fin that heat conductivility is excellent.
Fig. 3 is an overall structure diagram of a heat-conducting and heat-dissipating block in a plastic heat sink with excellent heat-conducting property according to the present invention.
In the figure: 1. a plastic heat sink body; 2. the detachable heat dissipation connecting main board; 3. a heat dissipation vertical plate; 4. a first heat dissipation transverse plate; 5. a heat conductive and dissipating block; 6. a second heat dissipation transverse plate; 201. a heat transfer base plate; 202. a heat dissipation upper plate; 203. a connecting plate; 204. a screw; 501. a first heat transfer layer; 502. a heat dissipation layer; 503. heat dissipation holes; 504. and a second heat transfer layer.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1-3, a plastic heat sink with excellent heat conductivity includes a plastic heat sink main body 1, a detachable heat-dissipating connecting main board 2 is disposed on the outer surface of the lower end of the plastic heat sink main body 1, a heat-conducting heat-dissipating block 5 is disposed on one side of the plastic heat sink main body 1, a heat-dissipating transverse plate 6 is disposed on one side of the heat-conducting heat-dissipating block 5, a heat-dissipating transverse plate 4 is disposed on the other side of the heat-conducting heat-dissipating block 5, and a heat-dissipating vertical plate 3 is disposed on one side of the heat.
Further, the detachable heat dissipation connection main board 2 comprises a heat transfer bottom board 201, a heat dissipation upper board 202, a connecting board 203 and screws 204, the heat transfer bottom board 201 is located on the outer surface of the lower end of the heat dissipation upper board 202, the connecting board 203 is located on the outer surface of one side of the detachable heat dissipation connection main board 2, and the screws 204 are located on the outer surface of the upper end of the connecting board 203, so that the heat dissipation fins can be conveniently detached and installed.
Furthermore, the heat-conducting heat-dissipating block 5 includes a first heat-transferring layer 501, a heat-dissipating layer 502, heat-dissipating holes 503 and a second heat-transferring layer 504, wherein the first heat-transferring layer 501 is located on the outer surface of the lower end of the heat-dissipating layer 502, the second heat-transferring layer 504 is located on the outer surface of the upper end of the heat-dissipating layer 502, and the heat-dissipating holes 503 are located on the outer surface of one side of the heat-dissipating layer 502, so that the heat-dissipating effect is.
Further, be provided with the fixed slot between heat transfer base plate 201 and the heat dissipation upper plate 202, the upper end surface of heat transfer base plate 201 can be dismantled with the lower extreme surface of heat dissipation upper plate 202 through the fixed slot and be connected, connecting plate 203 with can dismantle and be provided with the fixed plate between the heat dissipation connection mainboard 2, one side surface of connecting plate 203 is connected through the fixed plate and can dismantle one side fixed surface of heat dissipation connection mainboard 2, is favorable to the heat conductivility of fin.
Furthermore, a groove is formed between the first heat transfer layer 501 and the heat dissipation layer 502, the outer surface of the upper end of the first heat transfer layer 501 is detachably connected with the outer surface of the lower end of the heat dissipation layer 502 through the groove, a clamping groove is formed between the second heat transfer layer 504 and the heat dissipation layer 502, and the outer surface of the lower end of the second heat transfer layer 504 is detachably connected with the outer surface of the upper section of the heat dissipation layer 502 through the clamping groove, so that the heat dissipation fins can be conveniently detached and installed.
Furthermore, a fixed block is arranged between the heat conduction and dissipation block 5 and the plastic heat dissipation sheet main body 1, and the outer surface of the lower end of the heat conduction and dissipation block 5 is fixedly connected with the outer surface of the upper end of the plastic heat dissipation sheet main body 1 through the fixed block, so that the connection is tighter, and the use is convenient.
Principle of operation
The utility model discloses a plastic fin main part 1, can dismantle heat dissipation connection mainboard 2, heat dissipation riser 3, heat dissipation diaphragm 4, can lead heat dissipation piece 5, No. two heat dissipation diaphragms 6, heat transfer bottom plate 201, heat dissipation upper plate 202, connecting plate 203, screw 204, a heat transfer layer 501, heat dissipation layer 502, louvre 503 and No. two heat transfer layers 504, when using this fin, through the dismantled heat dissipation connection mainboard 2 that sets up, can let the simple installation in different position of fin, it is also very convenient to connect between the fin, make the application range of fin wider, and should dismantle heat dissipation connection mainboard 2 and divide into heat transfer bottom plate 201 and heat dissipation upper plate 202, heat transfer and radiating effect also can be better like this, can let heat conductivility greatly increased through the heat dissipation piece 5 that leads that sets up, this can lead heat dissipation piece divide into the three-layer altogether, be a heat transfer layer 501, respectively, The heat dissipation layer 502 and the second heat transfer layer 504 are provided with heat dissipation holes 503, so as to enhance the elasticity and heat dissipation function of the heat dissipation layer.
It is noted that, herein, relational terms such as first and second (a, b, etc.) and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a plastic fin that heat conductivility is excellent, includes plastic fin main part (1), its characterized in that: the lower extreme surface of plastic fin main part (1) is provided with can dismantle heat dissipation connection mainboard (2), one side of plastic fin main part (1) is provided with heat conduction radiating block (5), one side of heat conduction radiating block (5) is provided with heat dissipation diaphragm (6) No. two, the opposite side of heat conduction radiating block (5) is provided with heat dissipation diaphragm (4) No. one, one side of heat dissipation diaphragm (4) is provided with heat dissipation riser (3).
2. The plastic heat sink as claimed in claim 1, wherein: the detachable heat dissipation connection main board (2) comprises a heat transfer bottom board (201), a heat dissipation upper board (202), a connecting board (203) and screws (204), wherein the heat transfer bottom board (201) is located on the outer surface of the lower end of the heat dissipation upper board (202), the connecting board (203) is located on the outer surface of one side of the detachable heat dissipation connection main board (2), and the screws (204) are located on the outer surface of the upper end of the connecting board (203).
3. The plastic heat sink as claimed in claim 1, wherein: the heat-conducting radiating block (5) comprises a first heat transfer layer (501), a radiating layer (502), radiating holes (503) and a second heat transfer layer (504), wherein the first heat transfer layer (501) is located on the outer surface of the lower end of the radiating layer (502), the second heat transfer layer (504) is located on the outer surface of the upper end of the radiating layer (502), and the radiating holes (503) are located on the outer surface of one side of the radiating layer (502).
4. The plastic heat sink as claimed in claim 2, wherein: a fixing groove is formed between the heat transfer bottom plate (201) and the heat dissipation upper plate (202), the outer surface of the upper end of the heat transfer bottom plate (201) is detachably connected with the outer surface of the lower end of the heat dissipation upper plate (202) through the fixing groove, a fixing plate is arranged between the connecting plate (203) and the detachable heat dissipation connecting main plate (2), and the outer surface of one side of the connecting plate (203) is fixedly connected with the outer surface of one side of the detachable heat dissipation connecting main plate (2) through the fixing plate.
5. The plastic heat sink as claimed in claim 3, wherein: a groove is formed between the first heat transfer layer (501) and the heat dissipation layer (502), the upper end outer surface of the first heat transfer layer (501) is detachably connected with the lower end outer surface of the heat dissipation layer (502) through the groove, a clamping groove is formed between the second heat transfer layer (504) and the heat dissipation layer (502), and the lower end outer surface of the second heat transfer layer (504) is detachably connected with the upper section outer surface of the heat dissipation layer (502) through the clamping groove.
6. The plastic heat sink as claimed in claim 1, wherein: a fixed block is arranged between the heat conduction radiating block (5) and the plastic radiating fin main body (1), and the outer surface of the lower end of the heat conduction radiating block (5) is fixedly connected with the outer surface of the upper end of the plastic radiating fin main body (1) through the fixed block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020461456.9U CN212463834U (en) | 2020-04-01 | 2020-04-01 | Plastic cooling fin with excellent heat conduction performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020461456.9U CN212463834U (en) | 2020-04-01 | 2020-04-01 | Plastic cooling fin with excellent heat conduction performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212463834U true CN212463834U (en) | 2021-02-02 |
Family
ID=74466793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020461456.9U Active CN212463834U (en) | 2020-04-01 | 2020-04-01 | Plastic cooling fin with excellent heat conduction performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212463834U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573555A (en) * | 2021-07-27 | 2021-10-29 | 歌尔光学科技有限公司 | Heat-conducting plastic sheet, preparation method thereof and electronic equipment |
-
2020
- 2020-04-01 CN CN202020461456.9U patent/CN212463834U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573555A (en) * | 2021-07-27 | 2021-10-29 | 歌尔光学科技有限公司 | Heat-conducting plastic sheet, preparation method thereof and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2021057581A1 (en) | Electronic device | |
| CN212463834U (en) | Plastic cooling fin with excellent heat conduction performance | |
| WO2019024656A1 (en) | Floating-type heat sink and elastic bracket therefor | |
| CN207399740U (en) | A kind of radiating fin | |
| CN202918629U (en) | Printed circuit board cooling plate heat-dissipation structure | |
| CN214155222U (en) | Heat dissipation device for low-voltage cabinet circuit board | |
| CN210432279U (en) | Novel ann inserts formula fin | |
| TW201524278A (en) | DC/DC power module and DC/DC power system assembly | |
| CN209087822U (en) | A kind of novel heat sink strip convenient for clamping | |
| CN208387167U (en) | A kind of cooling fin | |
| CN207836056U (en) | A kind of multiple layer combination cooling fin | |
| CN211959878U (en) | Anti-corrosion heat-conducting plastic radiating fin | |
| CN203376679U (en) | CPU radiating sheet | |
| CN207639070U (en) | A kind of cooling fast aluminum alloy radiator casing | |
| CN212064715U (en) | Corrosion-resistant fin | |
| CN201780974U (en) | Heat sink of heating electronic component | |
| CN216852914U (en) | Radiating fin with good radiating effect | |
| CN201975386U (en) | Heat pipe and fin welding radiating rib | |
| CN212064712U (en) | Convenient-to-use radiating fin | |
| CN208689533U (en) | A kind of CPU radiating fin | |
| CN209629949U (en) | A kind of refrigeration Slimming machine | |
| CN217932680U (en) | Moisture-proof high-temperature-resistant touch display device | |
| CN217993746U (en) | Polyimide composite film with high heat dissipation performance | |
| CN216357854U (en) | Conveniently-adjusted radiating fin | |
| CN216014182U (en) | Embedded radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |