CN210365259U - 处理液容置装置 - Google Patents

处理液容置装置 Download PDF

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Publication number
CN210365259U
CN210365259U CN201921305466.7U CN201921305466U CN210365259U CN 210365259 U CN210365259 U CN 210365259U CN 201921305466 U CN201921305466 U CN 201921305466U CN 210365259 U CN210365259 U CN 210365259U
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CN
China
Prior art keywords
liquid
isolation
fixing end
groove
leakage
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Active
Application number
CN201921305466.7U
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English (en)
Chinese (zh)
Inventor
冯傳彰
郭承玮
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Scientech Corp
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Scientech Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Weting (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Engineering (AREA)
CN201921305466.7U 2019-05-09 2019-08-13 处理液容置装置 Active CN210365259U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962845360P 2019-05-09 2019-05-09
US62/845,360 2019-05-09

Publications (1)

Publication Number Publication Date
CN210365259U true CN210365259U (zh) 2020-04-21

Family

ID=70250320

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201921305466.7U Active CN210365259U (zh) 2019-05-09 2019-08-13 处理液容置装置
CN201911064906.9A Pending CN111916367A (zh) 2019-05-09 2019-11-04 基板处理装置及蚀刻基板的控制方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201911064906.9A Pending CN111916367A (zh) 2019-05-09 2019-11-04 基板处理装置及蚀刻基板的控制方法

Country Status (3)

Country Link
KR (2) KR200493208Y1 (ko)
CN (2) CN210365259U (ko)
TW (2) TWI704093B (ko)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3712330A (en) * 1970-10-16 1973-01-23 M Davis Liquid spill collection system
JPH05267514A (ja) * 1992-03-18 1993-10-15 Fujitsu Ltd 浸漬冷却構造
JPH09143761A (ja) * 1995-11-28 1997-06-03 Hitachi Ltd エッチング方法および装置
US6406641B1 (en) * 1997-06-17 2002-06-18 Luxtron Corporation Liquid etch endpoint detection and process metrology
US6318581B1 (en) * 2000-03-06 2001-11-20 Snyder Industries, Inc. Discharge outlet for double wall containment tank assembly
US6635573B2 (en) * 2001-10-29 2003-10-21 Applied Materials, Inc Method of detecting an endpoint during etching of a material within a recess
US6806948B2 (en) * 2002-03-29 2004-10-19 Lam Research Corporation System and method of broad band optical end point detection for film change indication
KR100452918B1 (ko) * 2002-04-12 2004-10-14 한국디엔에스 주식회사 두께측정시스템이 구비된 회전식각장치
KR20110039673A (ko) * 2009-10-12 2011-04-20 세메스 주식회사 약액 냉각 장치
KR101199028B1 (ko) * 2012-03-14 2012-11-08 (주)혜원전기 냉온 정수기용 냉각코일 고정장치
JP2013222914A (ja) * 2012-04-19 2013-10-28 Hitachi Ltd 液漏れ防止装置及び方法、液冷システム
US9698062B2 (en) * 2013-02-28 2017-07-04 Veeco Precision Surface Processing Llc System and method for performing a wet etching process
CN107112186B (zh) * 2014-09-05 2020-04-21 Tel艾派恩有限公司 用于基片的射束处理的过程气体增强
TWI656594B (zh) * 2016-12-15 2019-04-11 辛耘企業股份有限公司 基板處理裝置
US10262910B2 (en) * 2016-12-23 2019-04-16 Lam Research Corporation Method of feature exaction from time-series of spectra to control endpoint of process

Also Published As

Publication number Publication date
KR200493208Y1 (ko) 2021-02-18
KR20200130642A (ko) 2020-11-19
KR20200002523U (ko) 2020-11-19
TW202041441A (zh) 2020-11-16
KR102337304B1 (ko) 2021-12-10
CN111916367A (zh) 2020-11-10
TW202042320A (zh) 2020-11-16
TWI704093B (zh) 2020-09-11
TWI734207B (zh) 2021-07-21

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