CN210059443U - 复合材料模压成型装置 - Google Patents

复合材料模压成型装置 Download PDF

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CN210059443U
CN210059443U CN201920408230.XU CN201920408230U CN210059443U CN 210059443 U CN210059443 U CN 210059443U CN 201920408230 U CN201920408230 U CN 201920408230U CN 210059443 U CN210059443 U CN 210059443U
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composite material
lower metal
coating film
metal part
metal member
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朴海灿
金善奎
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Wuxing Display Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D39/00—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
    • B21D39/02—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of sheet metal by folding, e.g. connecting edges of a sheet to form a cylinder
    • B21D39/021—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of sheet metal by folding, e.g. connecting edges of a sheet to form a cylinder for panels, e.g. vehicle doors
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
    • B29C65/4815—Hot melt adhesives, e.g. thermoplastic adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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    • H10K50/84—Passivation; Containers; Encapsulations
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
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    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
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    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B32B38/105—Removing layers, or parts of layers, mechanically or chemically on edges
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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Abstract

本实用新型涉及复合材料模压成型装置，是防止复合材料的纵剖面向外露出的复合材料模压成型装置。为此，本实用新型的对按上部金属部件、第一热熔部件、树脂部件、第二热熔部件和下部金属部件顺序粘贴的复合材料进行成型的复合材料模压成型装置是，所述下部金属部件的上端面上粘贴第一涂层薄膜，下端面上粘贴第二涂层薄膜；包括：从复合材料的边缘向内侧引入一定距离之处切削至所述下部金属部件上端的第一切割机；将位于切削处外侧的上部金属部件、第一热熔部件、树脂部件、第二热熔部件清除的状态下，将所述下部金属部件弯曲180度而防止所述上部金属部件和树脂部件在侧面向外露出的折边模具。

Description

复合材料模压成型装置
技术领域
本实用新型涉及复合材料的模压成型装置，具体是复合材料的纵剖面不会露在外面的模压成型装置。
背景技术
OLED显示器不需要背光源，属于一个个像素被激活发光的自发光显示器。OLED显示器通常由encap(封装薄膜)、OLED、CRT、玻璃(glass)和ARF(Anti Reflection Film)构成。
通常OLED具有电极和有机层。通电以后空穴和电子由电极注入到有机层，这些在有机层结合的激子形成基态而发光。这种OLED若被渗透氧气或水分则容易引发寿命缩短、发光效率低下等问题。因此有机发光显示装置的制造包括封装工艺(encapsulation)，用来设置防止氧气或水分渗透到OLED面板上的封装结构。
图1图示的是普通的显示屏结构。根据图1，显示屏的结构包括背板、箱体、垫、面板。构成显示器的背板和箱体如图1所示采用双面胶连结。就是说，背板和箱体之间引入双面胶，将背板和箱体连结在一起。
就是说，为了背板和垫的侧面不露在外面，需要箱体(中间箱体：M/C)，因此导致产品单价上升，还需要补充工艺。
先有技术文献
专利文献
(专利文献1)韩国公开专利第2016-0019751号；
(专利文献2)韩国公开专利第2014-0094694号。
实用新型内容
技术问题
本实用新型要解决的问题是，提供不需其它部件也可以避免垫的侧面露在外面的装置。
本实用新型要解决的另一技术问题是，提供平坦刚性优良、侧面表面处理容易的工艺。
本实用新型要解决的又另一技术问题是，提供可节省制造成本的显示器。
本实用新型要解决的又另一技术问题是，提供内侧折边和外侧折边皆可的复合材料。
本实用新型要解决的又另一技术问题是，提供容易清除金属部件上热熔膜的方案。
技术方案
为此，本实用新型提供一种复合材料模压成型装置，作为将复合材料模压成型的复合材料模压成型装置，所述复合材料是按上部金属部件、第一热熔部件、树脂部件、第二热熔部件和下部金属部件顺序粘贴，所述下部金属部件的上端面上粘贴第一涂层薄膜，下端面上粘贴第二涂层薄膜；包括：从复合材料的边缘向内侧引入一定距离之处切削至所述下部金属部件上端的第一切割机；将位于切削处外侧的上部金属部件、第一热熔部件、树脂部件、第二热熔部件清除的状态下，将所述下部金属部件弯曲180度而防止所述上部金属部件和树脂部件在侧面向外露出的折边模具。
有益效果
根据本实用新型的复合材料模压成型装置，其有益效果在于，将相对处于最下端的金属部件用折边模具(夹具)弯曲180度，防止复合材料的剖切面露在外面。如此利用折边模具将金属部件弯曲180度，防止复合材料露在外面，因此不需使用其它中间箱体；
如上所述，不使用其它中间箱体而节省制造成本，外观的表面处理也优良；
本实用新型可以制造内侧折边和外侧折边皆可以的复合材料，为此从金属部件上容易清除热熔膜。
附图说明
图1是图示普通显示器结构；
图2是图示本实用新型一实施例的复合材料的结构；
图3是图示本实用新型一实施例的复合材料的加工过程；
图4是图示本实用新型一实施例的上部金属部件和树脂部件被切削以后复合材料的加工过程；
图5是图示本实用新型一实施例的将上部金属部件弯曲以后的复合材料加工过程；
图6是图示本实用新型一实施例的复合材料加工过程的流程图；
图7是图示本实用新型另一实施例的复合材料加工方法；
图8是图示本实用新型一实施例的在下部金属部件粘贴第一涂层薄膜和第二涂层薄膜的方案；
图9是图示本实用新型一实施例的复合材料的结构；
图10是图示本实用新型一实施例的利用T切割机加工复合材料的部位；
图11是图示本实用新型一实施例的利用折边模具将下部金属部件折边的一例。
符号说明
100：复合材料；102：上部金属部件；
104：树脂部件；106：下部金属部件。
具体实施方式
下面结合附图将本实用新型的优选实施例详细清楚地描述，以便本领域普通技术人员根据本实用新型的这些实施例易于理解和实现。
图2是图示本实用新型一实施例的复合材料。下面结合图2详述本实用新型一实施例的复合材料。
根据图2，复合材料100包括上部金属部件102、树脂部件104和下部金属部件106。根据图2，是构成复合材料的各材料纵剖面(剖切面)具有一个平面的复合材料模压成型装置。
图3是图示本实用新型一实施例的复合材料的加工过程。下面利用图3详述本实用新型一实施例的复合材料的加工过程。
如上所述，复合材料100模压成型装置的复合材料100纵剖面(剖切面)具有一个平面。在此状态下，用切割机加工复合材料的纵剖面(边缘)。如图3所示，切割机是“T型切割机”切削上部金属部件102和树脂部件104。此时树脂部件104比上部金属部件102相对切得多。就是说，切割机中利用直径相对大的部分切削树脂部件104，利用直径相对小的部分切削上部金属部件102。利用切割机，复合材料如图3所示被切削上部金属部件102和树脂部件104，因此成为本实用新型的复合材料模压成型装置。
图4是图示本实用新型一实施例的上部金属部件和上部金属部件被切削以后本实用新型的复合材料模压成型装置的复合材料的加工过程。下面结合图4叙述本实用新型一实施例的上部金属部件和上部金属部件被切削以后复合材料的加工过程。
根据图4，将比树脂部件104相对凸出的上部金属部件102向下部金属部件106方向折弯，将上部金属部件102向下部金属部件106方向折弯而树脂部件104的纵剖面紧贴上部金属部件102。图4是图示上部金属部件102紧贴树脂部件104的整个纵剖面的状态，尤其弯曲的上部金属部件102紧贴下部金属部件106的上端面。就是说，上部金属部件102具有两个折弯部位。根据凸出的上部金属部件102长度，上部金属部件102具有一个折弯部位的本实用新型的复合材料模压成型装置。
图5是图示本实用新型一实施例的将上部弯曲部件弯曲以后的复合材料的加工过程。下面结合图5详述本实用新型一实施例的将上部金属部件弯曲以后的复合材料加工过程。
根据图5，将上部金属部件102弯曲以后，利用折边模具(Hemming die，压力机)将下部金属部件106弯曲180°折叠。如此，利用折边模具将下部金属部件106弯曲180°折叠而防止复合材料的纵剖面露在外面的复合材料模压成型装置。
如上所述，本实用新型利用折边模具将下部金属部件106弯曲180度，因此不需要为了防止复合材料的边缘(纵剖面)露在外面而实施利用其它部件(中间箱体：M/C)防止树脂部件104的边缘露在外面的工艺。
图6是图示本实用新型一实施例的复合材料加工过程的流程图。下面结合图6详述本实用新型一实施例的本实用新型的复合材料模压成型装置的复合材料加工过程。
在S600步骤，用“T切割机”将由上部金属部件102、树脂部件104和下部金属部件106构成的复合材料切削上部金属部件102和树脂部件104的边缘。此时树脂部件104比上部金属部件102相对切削得多。
在S602步骤，将比树脂部件104相对切削得较少的上部金属部件102向下部金属部件106方向弯曲。此时，上部金属部件102根据树脂部件104的厚度、从树脂部件104凸出的长度具有一个弯曲部位或两个弯曲部位。
在S604步骤，利用折边模具将下部金属部件106弯曲180°而防止复合材料的边缘向外露出。
如上所述，本实用新型利用折边模具将下部金属部件106弯曲180°而不需要其它部件也可以防止树脂部件104的边缘露在外面的本实用新型的复合材料模压成型装置。
图7是图示本实用新型另一实施例的复合材料加工方法。根据图7，复合材料包括上部金属部件102、树脂部件104和下部金属部件106。图3是利用切割机切害上部金属部件102和树脂部件104，尤其对树脂部件104切削得相对较多。与此相比，图7是将上部金属部件102和树脂部件104相同地切削，也不进行上部金属部件102的弯曲过程。但图7是同样进行利用折边模具将下部金属部件106弯曲180°的工序。进而图7也是利用下部金属部件106防止上部金属部件102边缘(剖切面，纵剖面)、树脂部件104的边缘(剖切面，纵剖面)向外露出，因此不需要进行利用其它部件防止复合材料的纵剖面向外露出的工序的本实用新型的复合材料模压成型装置。
本实用新型涉及的是由上部金属部件、树脂部件和下部金属部件形成的复合材料，但并不限于此。是可以适用于不锈钢(STS)-铝-不锈钢(STS)构成的复合材料、由铝-冷轧铁板(SPCC)-铝构成的复合材料等各种形态复合材料的本实用新型的复合材料模压成型装置。
就是说，本实用新型可以适用于具有层压结构的复合材料的纵剖面不向外露出的各种材料。此时将位于最下端的材料用折边模具弯曲180°即可获得上述效果。
上述的实用新型中虽然没有说明，但上部金属部件和树脂部件之间是利用第一热熔模材料(第一热熔膜：Hot melt film)粘合，树脂部件和下部金属部件之间是利用第二热熔模材料(第二热熔模)粘合。
树脂部件和下部金属部件之间是被第二热熔膜材料粘合的状态下不能粘贴涂层薄膜，故下部金属部件是只能向内侧折边。故需要利用折边模具将下部金属部件向内侧折边的方案和向外侧折边的方案。
图8是图示本实用新型一实施例的在下部金属部件上粘合第一涂层薄膜和第二涂层薄膜的方案。下面结合图8详述本实用新型一实施例的在下部金属部件上粘贴第一涂层薄膜和第二涂层薄膜的本实用新型的复合材料模压成型装置。
根据图8，下部金属部件下端面上粘贴第二涂层薄膜，上端面上粘贴第一涂层薄膜。第二涂层薄膜是粘贴于下部金属部件的整个下端面，相反第一涂层薄膜是在下部金属部件的上端面上粘贴成梯形状。就是说，是第一涂层薄膜粘贴于下部金属部件的第一方向即两侧的同时被粘贴成向与第一方向的直角方向即第二方向相离一定间隔的状态的本实用新型的复合材料模成型装置。
补充说明就是，先在下部金属部件的下端面粘贴第二涂层薄膜后，将下部金属部件翻过来，在下部金属部件的上端面上粘贴第一涂层薄膜。
图9是图示本实用新型一实施例的复合材料的结构。根据图9，复合材料是从上端开始按上部金属部件、第一热熔部件、树脂部件、第二热熔部件和下部金属部件顺序粘贴。当然如上所述，下部金属部件是上端面粘贴第一涂层薄膜，下端面上粘贴第二涂层薄膜。因第一涂层薄膜而粘贴第一涂层薄膜的部分是第二涂层薄膜不会直接粘贴于下部金属部件的本实用新型的复合材料模压成型装置。
然后复合材料利用切割机按一定间隔切割。就是说，利用切割机将复合材料向第二方向切割，尤其将向第二方向形成的第一涂层薄膜的中间部分切割而制成四边状的复合材料。
图10是图示本实用新型一实施例的利用T切割机加工复合材料的部位。下面结合图10详述本实用新型一实施例的利用T切割机加工复合材料的部位。
根据图10，利用T切割机加工复合材料的部位是，以第二涂层薄膜粘贴的部位和未粘贴的部位边界线为中心按一定宽度切削。当然如上所述，并不是切削所有部位，仅切削至下部金属部件的上端。
复合材料中下部金属部件的上端被切削的状态下清除边缘部分形成的第二热熔部件。如上所述，因第一涂层薄膜而第二热熔部件不会粘贴于第一涂层薄膜(或下部金属部件)，因此可从下部金属部件简单地清除第二热熔部件。清除第二热熔部件以后，位于第二热熔部件上端的树脂部件、第一热熔部件和上部金属部件也被清除。
图10是图示第二热熔部件从复合材料中被清除的状态。第二热熔部件被清除的复合材料是仅留下上端面粘第一涂层薄膜和下端面粘贴第二涂层薄膜的下部金属部件。
图11是图示本实用新型一实施例的利用折边模具将下部金属部件折边的一例。如图11所示，下部金属部件是上端面粘贴第一涂层薄膜，下端面粘贴第二涂层薄膜，故利用折边模具不仅可以向内侧折边，也可以向外侧折边。
以上实施例仅用以说明本实用新型的技术方案，而非对其限制；本领域的普通技术人员应当理解：其依然可以对前述各实施例所述的技术方案进行修改或者等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本实用新型各实施例所述技术方案的范围。

Claims (5)

1.一种复合材料模压成型装置，其特征在于，
作为将复合材料模压成型的复合材料模压成型装置，
所述复合材料是按上部金属部件、第一热熔部件、树脂部件、第二热熔部件和下部金属部件顺序粘贴，所述下部金属部件的上端面上粘贴第一涂层薄膜，下端面上粘贴第二涂层薄膜；
包括：
从复合材料的边缘向内侧引入一定距离之处切削至所述下部金属部件上端的第一切割机；
将位于切削处外侧的上部金属部件、第一热熔部件、树脂部件、第二热熔部件清除的状态下，将所述下部金属部件弯曲180度而防止所述上部金属部件和树脂部件在侧面向外露出的折边模具。
2.根据权利要求1所述的复合材料模压成型装置，其特征在于，
所述第二涂层薄膜粘贴于下部金属部件的整个下端面，所述第一涂层薄膜粘贴于下部金属部件的上端面中一部分。
3.根据权利要求2所述的复合材料模压成型装置，其特征在于，
所述第一涂层薄膜粘贴于所述下部金属部件的第一方向即两侧，被粘贴成向与第一方向直径方向的第二方向相离一定间隔的状态。
4.根据权利要求3所述的复合材料模压成型装置，其特征在于，
包括：利用第一切割机切削至所述下部金属部件上端之前，将所述复合材料切削向第二方向粘贴的第一涂层薄膜的中间部分而制造四边形状的复合材料的第二切割机。
5.根据权利要求4所述的复合材料模压成型装置，其特征在于，
所述第一切割机切削将第一涂层薄膜被粘贴的部分和第一涂层薄膜未被粘贴部分包括的一定宽度程度。
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