CN209912847U

CN209912847U - Integrated machine for producing SOP (silicon on insulator) packaged double transistors and connecting support thereof

Info

Publication number: CN209912847U
Application number: CN201920963624.1U
Authority: CN
Inventors: 陶柳; 黄荣华
Original assignee: Foshan Blue Arrow Electronics Co Ltd
Current assignee: Foshan Blue Arrow Electronics Co Ltd
Priority date: 2019-06-25
Filing date: 2019-06-25
Publication date: 2020-01-07
Anticipated expiration: 2029-06-25

Abstract

The utility model provides a disjunctor machine and linking bridge for producing SOP encapsulation double transistor. The connecting bracket comprises a left connecting piece, a right connecting piece and a middle connecting piece; the left connecting piece is strip-shaped, and the right end of the left connecting piece is fixedly connected with the left end of the middle connecting piece; the right connecting piece is also in a strip shape, and the left end of the right connecting piece is fixedly connected with the right end of the middle connecting piece; the middle connecting piece is a longitudinal stretching body with a concave cross section. The integrated machine comprises a connecting support, two SOP packaged single-transistor die bonding machines, two external conversion plates and a signal connecting wire; the left end of the left connecting piece is fixedly connected with a discharging track of one SOP packaged single-transistor die bonder, the right end of the right connecting piece is fixedly connected with a feeding track of the other SOP packaged single-transistor die bonder, and the two external conversion boards are respectively connected with signal control boards of the two SOP packaged single-transistor die bonders through signal connecting wires.

Description

Integrated machine for producing SOP (silicon on insulator) packaged double transistors and connecting support thereof

Technical Field

The utility model belongs to the technical field of the semiconductor package equipment, concretely relates to disjunctor and linking bridge for producing SOP encapsulation double transistor.

Background

At present, an SOP-packaged single transistor and an SOP-packaged double transistor use different production facilities, respectively. The existing SOP packaged single transistor production equipment is specially used for producing SOP packaged single transistors, the equipment cannot directly finish the production of SOP packaged double transistors through one process on a production line, although the equipment can also produce the SOP packaged double transistors through two processes (the SOP packaged double transistors which are processed for the first time are taken down from a discharge rail of the SOP packaged single transistor production equipment and then are sent into the SOP packaged single transistor production equipment for secondary processing), the production mode has low efficiency and is easy to generate defective products.

In recent years, with the rapid increase of the demand of the market for the SOP packaged two-transistor, for the enterprises equipped with a large amount of SOP packaged single-transistor production equipment and less SOP packaged two-transistor production equipment, the problem that the demand of the market for the SOP packaged two-transistor is difficult to meet due to the lack of special equipment or the production cost is greatly increased due to the purchase of a large amount of SOP packaged two-transistor production equipment is faced.

Disclosure of Invention

The utility model discloses an aim at reforming transform the equipment that is used for producing SOP encapsulation single transistor to current, make it can be used for producing SOP encapsulation single transistor, can produce SOP encapsulation double transistor again to satisfy the market needs better, and reduce enterprise manufacturing cost.

In order to achieve the above object, the present invention first provides a connecting bracket, which comprises a left connecting member, a right connecting member and a middle connecting member; the left connecting piece is strip-shaped, and the right end of the left connecting piece is fixedly connected with the left end of the middle connecting piece; the right connecting piece is also in a strip shape, and the left end of the right connecting piece is fixedly connected with the right end of the middle connecting piece; the middle connecting piece is a longitudinal stretching body with a concave cross section.

Further, the middle connecting piece is formed by a bottom plate, a left side wall and a right side wall which are symmetrically arranged on two sides of the bottom plate in an integrated mode, the top of the left side wall is bent rightwards, and the top of the right side wall is bent leftwards.

Furthermore, the left connecting piece, the right connecting piece and the middle connecting piece are fixedly connected through screws and screw holes respectively, and the left end of the left connecting piece and the right end of the right connecting piece are also provided with screw holes respectively.

The utility model provides a connected machine for producing SOP packaged double transistors, which comprises a connecting bracket, two SOP packaged single transistor die bonder, two external connection conversion boards and a signal connecting wire, wherein the connecting bracket is used as a connecting mechanism; the left end of the left connecting piece is fixedly connected with a discharging track of one SOP packaged single-transistor die bonder, the right end of the right connecting piece is fixedly connected with a feeding track of the other SOP packaged single-transistor die bonder, and the two external conversion boards are respectively connected with signal control boards of the two SOP packaged single-transistor die bonders through signal connecting wires.

The utility model discloses following beneficial effect has:

1. the technical problem of producing the SOP packaged double-transistor by using SOP packaged single-transistor production equipment is solved, so that the market demand is better met, the production cost of enterprises is greatly reduced, and the production benefit of the enterprises is improved.

2. Simple structure, low cost and convenient popularization and implementation.

Drawings

Fig. 1 is a schematic structural view of a connecting bracket according to an embodiment of the present invention;

FIG. 2 is a cross-sectional structural view of an intermediate connector in the connecting bracket;

FIG. 3 is a schematic plan view of a connecting bracket between an outfeed rail and an infeed rail of two SOP packaged single transistor die bonders;

fig. 4 is a schematic plan view of a signal control board between an external connection conversion board and an SOP packaged single transistor die bonder.

Detailed Description

The structural features of the present invention are described in detail below with reference to the accompanying drawings.

As shown in fig. 1, a connecting bracket includes a left connecting member 3, a right connecting member 1, and a middle connecting member 2; the left connecting piece 3 is strip-shaped, and the right end of the left connecting piece is fixedly connected with the left end of the middle connecting piece 2; the right connecting piece 1 is also in a strip shape, and the left end of the right connecting piece is fixedly connected with the right end of the middle connecting piece 2; the middle connecting piece 2 is a stretching body with a concave cross section.

In this embodiment, the left connecting member 3, the right connecting member 1 and the middle connecting member 2 are respectively fixedly connected by screws and screw holes, the left end of the left connecting member 3 is provided with a screw hole 301, and the right end of the right connecting member 1 is also provided with a screw hole 101. As shown in fig. 2, the middle connector 2 is integrally formed by a bottom plate 203, and a left sidewall 201 and a right sidewall 202 symmetrically disposed at both sides of the bottom plate 203, wherein the top of the left sidewall 201 is bent to the right, and the top of the right sidewall 202 is bent to the left.

In the production process of the SOP packaged double transistor, the connecting bracket is used for connecting two SOP packaged single transistor die bonding machines. The existing SOP packaged single-transistor die bonder is provided with a feeding rail and a discharging rail, and moreover, the signal control board connection of the existing SOP packaged single-transistor die bonder is generally arranged on the back surface of the SOP packaged single-transistor die bonder.

As shown in fig. 3 and 4, an integrated machine for producing SOP packaged dual transistors includes a connection bracket, two SOP packaged single transistor die bonding machines, two external connection conversion boards (external connection conversion board 7 and external connection conversion board 8) and a signal connection line 10; the left end of the left connecting piece 3 is fixedly connected with a discharge rail 5 of one SOP packaging single-transistor die bonder through a screw and a screw hole 301, and the right end of the right connecting piece 1 is fixedly connected with a feed rail 4 of the other SOP packaging single-transistor die bonder through a screw and a screw hole 101. The signal control boards of the two SOP packaged single transistor die bonder, namely the signal control board 6 and the signal control board 9, are connected with the external conversion board 7 and the external conversion board 8 through signal connecting wires 10.

The structural features of the connected machine and the connecting bracket for producing the SOP packaged double transistor according to the present invention are described in detail above with reference to the accompanying drawings. The utility model discloses a theory of operation for producing the disjunctor of SOP encapsulation double transistor is: the production problem of the SOP packaged double transistors is solved through the relay type cooperative work of the two SOP packaged single transistor sticking machines.

Claims

1. A linking bridge, its characterized in that: comprises a left connecting piece, a right connecting piece and a middle connecting piece; the left connecting piece is strip-shaped, and the right end of the left connecting piece is fixedly connected with the left end of the middle connecting piece; the right connecting piece is also in a strip shape, and the left end of the right connecting piece is fixedly connected with the right end of the middle connecting piece; the middle connecting piece is a longitudinal stretching body with a concave cross section.

2. The attachment bracket of claim 1, wherein: the middle connecting piece is formed by integrally forming a bottom plate, a left side wall and a right side wall which are symmetrically arranged on two sides of the bottom plate, the top of the left side wall is bent rightwards, and the top of the right side wall is bent leftwards.

3. The attachment bracket of claim 1 or 2, wherein: the left connecting piece, the right connecting piece and the middle connecting piece are fixedly connected through screws and screw holes respectively, and the left end of the left connecting piece and the right end of the right connecting piece are also provided with screw holes respectively.

4. The utility model provides a disjunctor for producing SOP encapsulation double transistor, includes two SOP encapsulation single transistor die bonder, two external converter plates and signal connection line, its characterized in that: the connecting bracket as claimed in any one of claims 1 to 3, wherein the left end of the left connecting member is fixedly connected to the discharging track of one SOP packaged single-transistor die bonder, the right end of the right connecting member is fixedly connected to the feeding track of another SOP packaged single-transistor die bonder, and the two external connection conversion boards are respectively connected to the signal control boards of the two SOP packaged single-transistor die bonders through signal connecting wires.