CN216488048U - Photoelectric coupler lead frame - Google Patents
Photoelectric coupler lead frame Download PDFInfo
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- CN216488048U CN216488048U CN202220113485.5U CN202220113485U CN216488048U CN 216488048 U CN216488048 U CN 216488048U CN 202220113485 U CN202220113485 U CN 202220113485U CN 216488048 U CN216488048 U CN 216488048U
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- lead frame
- buffer spring
- frame body
- box
- design box
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Abstract
The utility model discloses a photoelectric coupler lead frame belongs to the lead frame field, including the lead frame body, the outside of lead frame body is provided with the design box, the outside cover of design box is equipped with buffering frame. A photoelectric coupler lead frame, the design box encloses around the lead frame body and the bottom, can play certain supporting role to the lead frame body, prevent that the lead frame body from directly receiving the problem that appears warping after the extrusion, be favorable to improving the life of lead frame body, through the buffer frame who sets up, first buffer spring and second buffer spring, the buffer frame cover is established around the design box, and set up elastic first buffer spring and second buffer spring between design box and the buffer frame, the extrusion force that can multi-direction buffering design box received, thereby ensure the security performance that the lead frame body was used, be favorable to reducing the risk that the lead frame body received the pressure and sent the damage.
Description
Technical Field
The utility model relates to a lead frame field, in particular to photoelectric coupler lead frame.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to use the lead frame in most semiconductor integrated blocks and is an important basic material in the electronic information industry; however, the existing lead frame is easy to deform after being extruded during use, so that the matching of the semiconductor integrated block and the carrying sheet area of the lead frame is reduced, and the service life of the lead frame is also reduced due to the damage caused by extrusion and collision.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a photoelectric coupler lead frame can effectively solve the problem that current lead frame easily appears the deformation after receiving the extrusion when using among the background art for the regional matching nature of slide glass of semiconductor integrated package and lead frame descends, and the damage that extrusion and collision brought also can reduce the life's of lead frame problem.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a photoelectric coupler lead frame, includes the lead frame body, the outside of lead frame body is provided with the design box, the outside cover of design box is equipped with the buffering frame, be provided with first buffer spring between the surface of design box and the inner wall of buffering frame, it is provided with second buffer spring to lie in first buffer spring place region between the surface of design box and the inner wall of buffering frame, the lower terminal surface fixed mounting of design box has places the bottom plate.
As the further improvement of above-mentioned scheme, the inside of stereotype box is provided with the lead frame and puts into the chamber, first lateral opening has been seted up to a side surface of stereotype box, the second lateral opening has been seted up to the adjacent side surface of lead frame body, the bottom recess has been seted up to the lower surface of stereotype box, and the stereotype box is enclosed all around the lead frame body and is in the bottom, can play certain supporting role to the lead frame body, prevents that the lead frame body from directly receiving the problem that appears warping after the extrusion, is favorable to improving the life of lead frame body.
As a further improvement of the above scheme, four buffer chambers are arranged between the shaping box and the buffer frame, and the four buffer chambers are located on four sides of the shaping box.
As a further improvement of the above scheme, the one end of first buffer spring and the outer fixed surface of calibrator are connected, the other end of first buffer spring and the inner wall fixed connection of buffering frame, the one end of second buffer spring and the outer fixed surface of calibrator are connected, the other end of second buffer spring and the inner wall fixed connection of buffering frame.
As a further improvement of the above scheme, the first buffer spring and the second buffer spring are arranged at four corners of the shaping box, and the buffer frame is movably connected with the shaping box through the first buffer spring and the second buffer spring.
As a further improvement of the scheme, the surface of the lead frame body is provided with a round hole, and the surface of the lead frame body is provided with a chip carrying area.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses in, through the design box that sets up, the design box encloses around the lead frame body and the bottom, can play certain supporting role to the lead frame body, prevent that the lead frame body from directly receiving the problem that appears warping after the extrusion, be favorable to improving the life of lead frame body, through the buffer frame who sets up, first buffer spring and second buffer spring, the buffer frame cover is established around the design box, and be provided with elastic first buffer spring and second buffer spring between design box and the buffer frame, the extrusion force that can multi-direction buffering design box received, thereby ensure the security performance that the lead frame body was used, be favorable to reducing the risk that the lead frame body received the pressure and sent the loss.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic view of the split structure of the lead frame body of the present invention;
FIG. 3 is a schematic view of the buffering frame structure of the present invention;
fig. 4 is a schematic structural diagram of the shaping box of the present invention.
In the figure: 1. a lead frame body; 2. a shaping box; 3. a buffer frame; 4. a first buffer spring; 5. a buffer chamber; 6. placing a bottom plate; 7. the lead frame is placed in the cavity; 8. a first lateral opening; 9. a bottom groove; 10. a second lateral opening; 11. a circular hole; 12. a second buffer spring; 13. a slide area.
Detailed Description
To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the attached drawings in the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are part of the embodiments of the present invention, rather than all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
As shown in fig. 1-4, a photoelectric coupler lead frame comprises a lead frame body 1, a shaping box 2 is arranged outside the lead frame body 1, a buffering frame 3 is sleeved outside the shaping box 2, a first buffering spring 4 is arranged between the outer surface of the shaping box 2 and the inner wall of the buffering frame 3, a second buffering spring 12 is arranged between the outer surface of the shaping box 2 and the inner wall of the buffering frame 3 in the area where the first buffering spring 4 is located, and a placing bottom plate 6 is fixedly arranged on the lower end face of the shaping box 2.
In this embodiment, the inside of sizing box 2 is provided with the lead frame and puts into chamber 7, first lateral opening 8 has been seted up on one side surface of sizing box 2, second lateral opening 10 has been seted up on the adjacent side surface of lead frame body 1, bottom recess 9 has been seted up to sizing box 2's lower surface, sizing box 2 encloses around lead frame body 1 and bottom, can play certain supporting role to lead frame body 1, prevent that lead frame body 1 from directly receiving the problem that appears warping after the extrusion, be favorable to improving lead frame body 1's life.
The buffer chambers 5 are arranged between the shaping box 2 and the buffer frame 3, and the four buffer chambers 5 are arranged on the four sides of the shaping box 2.
In this embodiment, the one end of first buffer spring 4 and the outer fixed surface of design box 2 are connected, the other end of first buffer spring 4 and the inner wall fixed connection of buffering frame 3, the one end of second buffer spring 12 and the outer fixed surface of design box 2 are connected, the other end of second buffer spring 12 and the inner wall fixed connection of buffering frame 3, buffering frame 3 cover is established around design box 2, and set up elastic first buffer spring 4 and second buffer spring 12 between design box 2 and the buffering frame 3, the extrusion force that can multi-direction buffering design box 2 received, thereby ensure the security performance that lead frame body 1 used, be favorable to reducing the risk that lead frame body 1 received the pressure and caused the loss.
The first buffer spring 4 and the second buffer spring 12 are arranged at four corners of the shaping box 2, and the buffer frame 3 is movably connected with the shaping box 2 through the first buffer spring 4 and the second buffer spring 12.
The surface of the lead frame body 1 is provided with a round hole 11, and the surface of the lead frame body 1 is provided with a chip carrying area 13.
It should be noted that, the utility model relates to a photoelectric coupler lead frame, the lead frame body 1 is placed in the lead frame placing cavity 7 of the shaping box 2, and the lower surface of the lead frame body 1 is adhered on the upper surface of the placing bottom plate 6 through glue, when in use, the shaping box 2 is enclosed around and at the bottom of the lead frame body 1, which can play a certain supporting role for the lead frame body 1, and prevent the lead frame body 1 from deforming after being directly extruded, which is beneficial to improving the service life of the lead frame body 1, in the use process, the buffer frame 3 is sleeved around the shaping box 2, and the elastic first buffer spring 4 and the second buffer spring 12 are arranged between the shaping box 2 and the buffer frame 3, which can buffer the extrusion force of the shaping box 2 in multiple directions, thereby ensuring the safety performance of the lead frame body 1, the risk of damage to the lead frame body 1 due to compression is reduced.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. Although embodiments of the present invention have been shown and described, it is not intended to limit the scope of the invention, which is defined by the appended claims and their equivalents, and all changes in equivalent structure or equivalent flow process that can be made by using the contents of the specification and drawings or applied directly or indirectly to other related technical fields are intended to be embraced therein by the scope of the invention.
Claims (6)
1. A photoelectric coupler lead frame is characterized in that: including lead frame body (1), the outside of lead frame body (1) is provided with design box (2), the outside cover of design box (2) is equipped with buffering frame (3), be provided with first buffer spring (4) between the surface of design box (2) and the inner wall of buffering frame (3), it is provided with second buffer spring (12) to be located first buffer spring (4) place region between the surface of design box (2) and the inner wall of buffering frame (3), the lower terminal surface fixed mounting of design box (2) has places bottom plate (6).
2. A lead frame for a photocoupler according to claim 1, wherein: the inside of design box (2) is provided with lead frame and puts into chamber (7), first lateral opening (8) have been seted up on a side surface of design box (2), second lateral opening (10) have been seted up on the adjacent side surface of lead frame body (1), bottom recess (9) have been seted up to the lower surface of design box (2).
3. A photoelectric coupler lead frame according to claim 2, characterized in that: be provided with between sizing box (2) and buffer frame (3) cushion chamber (5), four side directions that cushion chamber (5) are located sizing box (2) are provided with four altogether.
4. A photoelectric coupler lead frame according to claim 3, characterized in that: the one end of first buffer spring (4) and the outer fixed surface connection of design box (2), the other end of first buffer spring (4) and the inner wall fixed connection of buffering frame (3), the one end of second buffer spring (12) and the outer fixed surface connection of design box (2), the other end of second buffer spring (12) and the inner wall fixed connection of buffering frame (3).
5. A photoelectric coupler lead frame according to claim 4, characterized in that: first buffer spring (4) with second buffer spring (12) are located four corner position settings of calibrator (2), buffering frame (3) are through first buffer spring (4) and second buffer spring (12) and calibrator (2) swing joint.
6. A photoelectric coupler lead frame according to claim 5, characterized in that: the lead frame is characterized in that a round hole (11) is formed in the surface of the lead frame body (1), and a slide glass area (13) is arranged on the surface of the lead frame body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220113485.5U CN216488048U (en) | 2022-01-17 | 2022-01-17 | Photoelectric coupler lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220113485.5U CN216488048U (en) | 2022-01-17 | 2022-01-17 | Photoelectric coupler lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216488048U true CN216488048U (en) | 2022-05-10 |
Family
ID=81434681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220113485.5U Active CN216488048U (en) | 2022-01-17 | 2022-01-17 | Photoelectric coupler lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216488048U (en) |
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2022
- 2022-01-17 CN CN202220113485.5U patent/CN216488048U/en active Active
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