CN218867098U - High-strength lead frame for packaging devices - Google Patents
High-strength lead frame for packaging devices Download PDFInfo
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- CN218867098U CN218867098U CN202222821568.2U CN202222821568U CN218867098U CN 218867098 U CN218867098 U CN 218867098U CN 202222821568 U CN202222821568 U CN 202222821568U CN 218867098 U CN218867098 U CN 218867098U
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- lead frame
- heat dissipation
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- chip carrier
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Abstract
The utility model discloses a high strength lead frame for device package relates to the relevant technical field of semiconductor package, including lead frame, chip carrier, the chip carrier sets up the inside at the lead frame, outside one side of lead frame is provided with the pin, terminal surface fixedly connected with strengthens the gasket before the outside of lead frame, the outside rear end face fixedly connected with strengthening rib of lead frame, one side of fixed muscle and outside one side fixed connection of lead frame, individual lead frame are connected fixedly, and the strengthening rib that sets up and fixed muscle cooperation between them use, have increased the lead frame bulk strength, and use through the cooperation between the heat dissipation recess that sets up and the louvre, after chip carrier package in the lead frame, can not contact with the lead frame through the heat dissipation recess part that sets up with its surface, can be through the heat dissipation recess discharge after excessive at the louvre to a certain extent has increased the radiating effect.
Description
Technical Field
The utility model relates to a semiconductor package is related to technical field, specifically relates to a device package is with high strength lead frame.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry.
The prior art has the following problems: the existing device can use the corresponding lead frame to carry out packaging operation on the integrated circuit chip in the packaging process, the lead frame for the existing packaging is directly packaged together with a chip carrier, so that the surfaces of the lead frame and the chip carrier which are in contact are directly attached together, the heat dissipation effect during working is poor easily, the structural strength of the lead frame is not high, the damage is easily caused, the service life is shortened, and the existing use requirement cannot be met.
SUMMERY OF THE UTILITY MODEL
For solving above-mentioned technical problem, a high strength lead frame is used in device encapsulation is provided, this technical scheme has solved the current device that proposes in the above-mentioned background art at the encapsulation in-process, can use the lead frame that corresponds to encapsulate the operation to integrated circuit chip, and the lead frame that current encapsulation was used is in the same place with the direct encapsulation of chip carrier, the direct laminating in surface that both contacted like this is in the same place, lead to easily that the radiating effect is relatively poor at the during operation, and lead frame structural strength is not high, lead to easily impaired, the service life is reduced, and then existing user demand can not be satisfied, be unfavorable for the problem of use.
In order to achieve the above purpose, the utility model adopts the technical scheme that:
the utility model provides a high strength lead frame for device package, includes lead frame, chip carrier, the chip carrier sets up the inside at the lead frame, outside one side of lead frame is provided with the pin, terminal surface fixedly connected with strengthens the gasket before the outside of lead frame, the outside rear end face fixedly connected with strengthening rib of lead frame, the fixed muscle of terminal surface fixedly connected with of strengthening rib, one side of fixed muscle and outside one side fixed connection of lead frame.
Preferably, a heat dissipation groove is formed in the position, close to the middle position, of the inner bottom end of the lead frame, and heat dissipation holes are formed in the inner bottom end of the heat dissipation groove.
Preferably, the terminal pins are provided in plurality and uniformly distributed on the lead frame.
Preferably, the heat dissipation hole penetrates through the lead frame.
Preferably, the interior of the leadframe is adapted to the chip carrier.
Compared with the prior art, the utility model provides a device is high strength lead frame for encapsulation possesses following beneficial effect:
the utility model discloses be provided with the strengthening rib, strengthen gasket and fixed muscle, strengthen the gasket through setting up and connect fixedly to two adjacent lead frames, and the strengthening rib that sets up and fixed muscle cooperation between them are used, the lead frame bulk strength has been increased, thereby the life of lead frame has been increased, and cooperation between heat dissipation recess and the louvre through setting up is used, back in the lead frame when chip carrier encapsulation, can partly not contact with the lead frame through the heat dissipation recess that sets up with the surface of its contact, the heat that produces like this when using the work can be through heat dissipation recess excessive back through the louvre discharge, thereby the radiating effect has been increased to a certain extent, the practicality of lead frame is improved, just the utility model discloses simple structure, high durability and convenient use.
Drawings
Fig. 1 is a schematic perspective view of a high-strength lead frame for packaging a device according to the present invention;
fig. 2 is a schematic view of a three-dimensional structure of a lead frame according to the present invention;
fig. 3 is a schematic view of a three-dimensional structure of the lead frame according to another view angle of the present invention;
the reference numbers in the figures are:
1. reinforcing ribs; 2. a reinforcing gasket; 3. a lead frame; 4. a chip carrier; 5. a terminal pin; 6. fixing the ribs; 8. a heat dissipation groove; 9. and (4) heat dissipation holes.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments described below are by way of example only, and other obvious variations will occur to those skilled in the art.
Referring to fig. 1-3, a high-strength lead frame for packaging a device, including a lead frame 3, a chip carrier 4, the chip carrier 4 is disposed inside the lead frame 3, the inside of the lead frame 3 is adapted to the chip carrier 4, one side of the outside of the lead frame 3 is provided with a plurality of lead pins 5, the lead pins 5 are uniformly distributed on the lead frame 3, the set lead pins 5 are conveniently connected and fixed with an external lead, a reinforcing gasket 2 is fixedly connected to the front end face of the outside of the lead frame 3, a reinforcing rib 1 is fixedly connected to the rear end face of the outside of the lead frame 3, a fixing rib 6 is fixedly connected to the end face of the reinforcing rib 1, and one side of the fixing rib 6 is fixedly connected to one side of the outside of the lead frame 3.
The inside bottom of lead frame 3 is close to intermediate position department and has seted up heat dissipation recess 8, and heat dissipation hole 9 has been seted up to the inside bottom of heat dissipation recess 8, and the heat dissipation hole 9 that just sets up runs through in lead frame 3, and the heat dissipation hole 9 of seting up has a plurality ofly and evenly distributed on lead frame 3.
The utility model discloses during the use, connect fixedly through the reinforcement gasket 2 that sets up to two adjacent lead frames 3, and the strengthening rib 1 that sets up uses with the cooperation of fixed muscle 6 both, has increased 3 bulk strength of lead frame. After the chip carrier 4 is packaged in the lead frame 3, the surface contacting with the chip carrier is not contacted with the lead frame 3 through a part of the arranged heat dissipation groove 8, so that heat generated during working can be dissipated through the heat dissipation groove 8 and then the heat dissipation hole 9.
The foregoing shows and describes the basic principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that all the embodiments and descriptions are provided in the present invention, and that various changes and modifications can be made without departing from the spirit and scope of the present invention, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. The utility model provides a device is high strength lead frame for encapsulation, its characterized in that, includes lead frame (3), chip carrier (4) set up the inside in lead frame (3), outside one side of lead frame (3) is provided with pin (5), terminal surface fixedly connected with strengthens gasket (2) before the outside of lead frame (3), outside rear end face fixedly connected with strengthening rib (1) of lead frame (3), terminal surface fixedly connected with fixed muscle (6) of strengthening rib (1), one side of fixed muscle (6) and outside one side fixed connection of lead frame (3).
2. A high strength lead frame for device packaging according to claim 1, wherein: the heat dissipation structure is characterized in that a heat dissipation groove (8) is formed in the position, close to the middle position, of the inner bottom end of the lead frame (3), and heat dissipation holes (9) are formed in the inner bottom end of the heat dissipation groove (8).
3. A high strength lead frame for device packaging according to claim 2, wherein: the lead pins (5) are arranged in a plurality and are uniformly distributed on the lead frame (3).
4. A high strength lead frame for device encapsulation according to claim 2, wherein: the heat dissipation hole (9) penetrates through the lead frame (3).
5. A high strength lead frame for device packaging according to claim 2, wherein: the interior of the lead frame (3) is adapted to the chip carrier (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222821568.2U CN218867098U (en) | 2022-10-26 | 2022-10-26 | High-strength lead frame for packaging devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222821568.2U CN218867098U (en) | 2022-10-26 | 2022-10-26 | High-strength lead frame for packaging devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218867098U true CN218867098U (en) | 2023-04-14 |
Family
ID=87375459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222821568.2U Active CN218867098U (en) | 2022-10-26 | 2022-10-26 | High-strength lead frame for packaging devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218867098U (en) |
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2022
- 2022-10-26 CN CN202222821568.2U patent/CN218867098U/en active Active
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