CN214542152U

CN214542152U - Novel lead frame magazine

Info

Publication number: CN214542152U
Application number: CN202121128725.0U
Authority: CN
Inventors: 张坚铁; 刘艳; 万伟; 刘鹏; 王联; 郑亚
Original assignee: Anhui Kangjingxiang Electronics Co ltd
Current assignee: Anhui Kangjingxiang Electronics Co ltd
Priority date: 2021-05-25
Filing date: 2021-05-25
Publication date: 2021-10-29
Anticipated expiration: 2031-05-25

Abstract

The utility model discloses a novel lead frame magazine, comprising a main body, the inside of main part just is close to about the side edge department and all sets up flutedly, the recess runs through the top and the bottom of main part, the front and the back of main part just are close to about the side edge department and all set up the draw-in groove, the inside of main part just is close to the back lateral wall and has seted up the spacing groove, the inside fixedly connected with baffle of main part, the bottom fixedly connected with landing leg of main part, the cross sectional shape of recess is "U" shape, the spacing groove distributes for the alternating expression with the position of baffle, the shape of baffle is "L" type, the position of draw-in groove and recess is corresponding. The utility model discloses, the device simple structure is reasonable, can solve the not enough of prior art well, protects the chip effectively, can prevent well that the chip from receiving the damage in the transportation, has simultaneously, low in production cost, advantages such as convenient to use.

Description

Novel lead frame magazine

Technical Field

The utility model relates to a chip transfer device technical field especially relates to a novel lead frame magazine.

Background

The integrated circuit package uses lead frame as carrier of chip, the lead frame realizes the connection between the internal circuit leading-out end of chip and external fresh electric connection by bonding material in the packaging process, and plays the role of connecting with external wire, the integrated circuit package using lead frame has many procedures, other most key several main procedures include chip mounting, lead bonding and plastic package, concretely, the manufactured IC chip is bonded on the chip pad of lead frame by a bonding machine, then the chip and lead frame are bonded by thin metal wire by lead bonding machine, then the lead frames are sent to plastic mould sealing machine for plastic package, lead material box is used to bear lead frame in the whole process, lead frame with different sizes is provided for different package shapes, and lead frame material box corresponding to sizes is proportioned, the traditional lead frame material boxes are all in a following mode.

The lead frame magazine in the prior art has some disadvantages, for example, the lead frame runs the risk of hitting the partition plate when the lead frame is moved in the magazine, thereby causing quality risks such as chip damage, etc., so that improvement of the prior art is needed.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a novel lead frame material box.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a novel lead frame magazine, includes the main part, the inside of main part just is close to about the side edge department and all sets up flutedly, the recess runs through the top and the bottom of main part, the front and the back of main part just are close to about the side edge department and all set up the draw-in groove, the inside of main part just is close to the back lateral wall and has seted up the spacing groove, the inside fixedly connected with baffle of main part, the bottom fixedly connected with landing leg of main part.

As a further description of the above technical solution:

the cross section of the groove is U-shaped.

As a further description of the above technical solution:

the positions of the limiting grooves and the partition plates are distributed in a staggered mode.

As a further description of the above technical solution:

the shape of the baffle is "L" type.

As a further description of the above technical solution:

the positions of the clamping grooves correspond to those of the grooves.

The utility model discloses following beneficial effect has:

1. compared with the prior art, this novel lead frame magazine, the device simple structure is reasonable, can solve the not enough of prior art well, protects the chip effectively, can prevent well that the chip from receiving the damage in the transportation.

2. Compared with the prior art, the novel lead frame material box has the advantages of simple structure, low production cost and convenience in use.

Drawings

Fig. 1 is an external structure front view of a novel lead frame magazine provided by the present invention;

fig. 2 is a top view of the external structure of a novel lead frame magazine provided by the present invention;

fig. 3 is a left side view of the external structure of the novel lead frame magazine provided by the present invention;

fig. 4 is a schematic diagram of the partition structure of the novel lead frame magazine provided by the present invention.

Illustration of the drawings:

1. a main body; 2. a card slot; 3. a groove; 4. a limiting groove; 5. a partition plate; 6. and (7) supporting legs.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-4, the utility model provides a pair of novel lead frame magazine: including main part 1, main part 1's inside and be close to about all seted up recess 3 in the edge department of reason, recess 3 runs through main part 1's top and bottom, main part 1's front and back and be close to about all seted up draw-in groove 2 in the edge department, main part 1's inside and be close to the back side wall and seted up spacing groove 4, main part 1's inside fixedly connected with baffle 5, main part 1's bottom fixedly connected with landing leg 6 plays the effect of protecting the chip when conveniently transporting.

The cross sectional shape of recess 3 is "U" shape, plays and conveniently carries out spacing effect, and spacing groove 4 distributes for the alternating expression with the position of baffle 5, and the shape of baffle 5 is "L" type, plays the effect because of conveniently going on, and draw-in groove 2 is corresponding with recess 3's position.

The working principle is as follows: when the lead frame is used, the chip is fixed on the lead frame, then the lead frame is placed on the surfaces of the limiting groove 4 and the partition plate 5, and then the lead frame is positioned and fixed through the L-shaped partition plate 5, so that the chip is prevented from being damaged due to shaking.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. The utility model provides a novel lead frame magazine, includes main part (1), its characterized in that: the utility model discloses a spacing groove (4) and fixing device, including main part (1), recess (3), draw-in groove (2), limit groove (6), main part (1) and back, the inside of main part (1) just is close to about all set up fluted (3) in the side edge department, recess (3) run through the top and the bottom of main part (1), draw-in groove (2) have all been seted up in the front of main part (1) and the back and just be close to about the side edge department, the inside of main part (1) just is close to the back lateral wall and has seted up spacing groove (4), the inside fixedly connected with baffle (5) of main part (1), the bottom fixedly connected with landing leg (6) of main part (1).

2. The novel lead frame magazine as defined in claim 1, wherein: the cross section of the groove (3) is U-shaped.

3. The novel lead frame magazine as defined in claim 1, wherein: the positions of the limiting grooves (4) and the partition plates (5) are distributed in a staggered mode.

4. The novel lead frame magazine as defined in claim 1, wherein: the shape of the baffle plate (5) is L-shaped.

5. The novel lead frame magazine as defined in claim 1, wherein: the clamping groove (2) corresponds to the groove (3).