CN209282166U - A kind of lead frame mold - Google Patents
A kind of lead frame mold Download PDFInfo
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- CN209282166U CN209282166U CN201920182870.3U CN201920182870U CN209282166U CN 209282166 U CN209282166 U CN 209282166U CN 201920182870 U CN201920182870 U CN 201920182870U CN 209282166 U CN209282166 U CN 209282166U
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- pin
- lead frame
- mold
- die assembly
- angle
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Abstract
A kind of lead frame mold, the mold include several groups die assembly, and the die assembly includes the first pin, the second pin between the first pin；It is fixedly connected on the same line between first pin and second pin by dowel；The end of the second pin is set as angle-style end, and the angle-style end successively includes pin in first, pin in second, and pin is linear line shape in described second.The utility model provides a kind of lead frame mold, pin in the second of second pin is designed as linear line shape, and it is set as 1.4Mil line width, gap, which can be increased, makes development uniform, obtain the 0.4PITCH etched frame that fixed column size can be controlled effectively, and convenience and high-efficiency when mapping, product yield significantly improve, even foot ratio reduces.
Description
Technical field
The utility model relates to semiconductor chip lead frame manufacturing fields, and in particular to a kind of lead frame etching mould
Tool.
Background technique
Lead frame is the basic material of semiconductor packages, as the chip carrier of integrated circuit, by means of being bonded material
Expect that (spun gold, aluminium wire, copper wire) realizes the electrical connection of chip internal circuits exit and outer lead, forms the key of electric loop
Structural member plays the function served as bridge connected with outer lead.Its major function be exactly be circuit connection, heat dissipation, mechanical support etc.
Effect.The Main Trends of The Development of integrated circuit is high density, high foot position, slimming, miniaturization at present, and packaged type is from initial
DIP packaged type gradually develops to packaged types such as SOP, QFP, BGA, CSP, QFN.
Etching is the technology by materials'use chemical reaction or physical shock effect and removal.Etching technique can be divided into wet
Etching and two class of dry ecthing.It may be utilized in fabricating the printing embossing plate such as copperplate, photo zincography earliest, be also widely used for mitigating weight
The processing of the thin type workpiece that (Weight Reduction) instrument panelling, nameplate and traditional processing method are difficult to etc.；By not
Disconnected improvement and process equipment development can also be used for aviation, machinery, electronics sheet parts fine etching product in chemical industry
Processing, especially on manufacture of semiconductor, etching is even more indispensable technology.
At present during developing packaging frame new product, most common most important design is right angle compensation shape
The technique of painting.The design of right angle generally all continues pervious way inside frame, does angular shape design.However the gap of angular shape from
Harntail is smaller and smaller to gap between the top of the horn line line, and line line gap can be smaller after 0.5MIL line width is arranged, and has exceeded the system of development
Journey limit of power, since development unevenly causes the problem for occurring etching uneven, fixed column fertilizer partially very universal, at interior pin especially
It is prominent.And this angular technique of painting is more complicated.When making the frame of 0.4PITCH, it may appear that fixed column fluctuation is big and shape is inclined
The phenomenon of fertilizer, very big influence is caused to product quality.
Utility model content
The utility model provides a kind of lead frame mold, and pin in the second of second pin is designed as line
Property it is linear, and be set as 1.4Mil line width, can increase gap makes development uniformly, and obtaining fixed column size can effectively control
0.4PITCH etched frame, and convenience and high-efficiency when mapping, product yield significantly improves, and even foot ratio reduces.
The technical solution adopted in the utility model is as follows:
A kind of lead frame mold, the mold include several groups die assembly, and the die assembly includes first
Pin, the second pin between the first pin；It is fixedly connected between first pin and second pin by dowel
On the same line；The end of the second pin is set as angle-style end, and the angle-style end successively includes pin in first, second
Interior pin, pin is linear line shape in described second.
The working principle and process of the technical program are as follows:
The lead frame mold in the utility model is required in etching step in lead frame manufacturing process
Mold, mold is for producing with the consistent concave-convex picture and text of mold or gap in lead frame；It is described
The first pin, second pin, dowel, angle-style end in mold in the lead frame produced the first pin, the
Two pins, dowel, angle-style end are the same, are equal to be made so designing superior lead frame mold
The pin for the lead frame made, which is formed, to be fixed.So pin is linear line shape in the second of second pin, compared to existing skill
The design of feeler shape in art, the design of linear line shape increase gap and make development uniformly, and acquisition fixed column size can be effective
The 0.4PITCH etched frame of control.When making lead frame QFN (0404-0.40) 028-0001 mold, with new
The glass molds of this designing technique production produce this lead frame, and with the mold production of the design of the prior art before this
Lead frame carries out Statistical Comparison, manufactures from our company and counts old design and newly-designed yield difference in three production reports
Are as follows: 61% and 87%, wherein connecting foot ratio is respectively as follows: 9.88% and 2.1%, hence it is evident that yield improves, and even foot ratio reduces.
Further, the line width of pin is 1.4Mil in described the second of linear line shape.In feeler shape second pin from
Harntail is smaller and smaller to gap between the top of the horn line line, and line line gap can be smaller after pin 0.5MIL line width in setting second, has surpassed
The process capability range developed out, it is interior since development unevenly causes the problem for occurring etching uneven, fixed column fertilizer partially very universal
It is especially prominent at pin.And this angular technique of painting is more complicated.When making the frame of 0.4PITCH, it may appear that fixed column fluctuation
The partially fertile phenomenon of big and shape, very big influence is caused to product quality.But pin in the second of linear line shape, it is set as
1.4Mil line width.Gap can so be increased and make development uniformly, obtain the 0.4PITCH erosion that fixed column size can be controlled effectively
Frame is carved, the partially fertile phenomenon of fixed column fluctuation and shape is avoided.
Further, totally four groups of the die assembly, the angle-style end outwardly, the dowel inwardly, mould described in four groups
Tool component surrounds square.Four groups of die assemblies collectively form the pin portions of lead frame, for subsequent realization chip interior electricity
The electrical connection of pass outlet and outer lead.
Further, the second pin is six groups, is distributed between first pin at die assembly both ends.
Further, round die block is equipped between adjacent first pin and second pin and adjacent first pin.It is round
Module corresponds to the circular gap of lead frame, provides tie point for subsequent electrical connection.
Further, the four corners for the square that die assembly described in four groups is constituted are equipped with star-like module.Star-like mould mould
Block corresponds to the star-like gap of lead frame, provides tie point for subsequent electrical connection.
In conclusion the beneficial effect of the utility model compared to the prior art is:
(1) by pin in the second of second pin it is innovatively linear line shape in the utility model, and is designed as
1.4Mil line width can obtain uniform development size, and be able to solve 0.4PITCH frame instead of the antenniform of former complexity
Frame fixed column fertilizer and fixed column partially fluctuate big problem；
(2) mold uses this new design that can improve yield in the utility model, improves product quality；It is making
When lead frame QFN (0404-0.40) 028-0001 mold, the glass molds production made of new this designing technique should
Money lead frame, and this lead frame of the mold production of preantenna shape Technology design carries out Statistical Comparison therewith, from our company
It manufactures and counts old design in three production reports and newly-designed yield is respectively as follows: 61% and 87%, wherein connecting foot ratio point
Not are as follows: 9.88% and 2.1%, hence it is evident that yield improves, and even foot ratio reduces.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of lead frame mold in the prior art
Fig. 2 is the partial enlarged view of lead frame mold in the prior art
Fig. 3 is the structural schematic diagram of lead frame mold in the utility model
Fig. 4 is the partial enlarged view of lead frame mold in the utility model
In the figure, it is marked as 1- die assembly, the first pin of 2-, 3- second pin, 4- dowel, 5- angle-style end, 6- first
Interior pin, pin in 7- second, 8- round die block, the star-like module of 9-.
Specific embodiment
All features disclosed in this specification can be with any other than mutually exclusive feature and/or step
Mode combines.
In order to make those skilled in the art more fully understand the technical solution of the utility model, below with reference to Fig. 1-4 and
The utility model is described in further detail for specific embodiment.
Embodiment 1
A kind of lead frame mold, the mold include several groups die assembly 1, and the die assembly 1 includes the
One pin 2, the second pin 3 between the first pin 2；Pass through dowel 4 between first pin 2 and second pin 3
It is fixedly connected on the same line；The end of the second pin 3 is set as angle-style end 5, and the angle-style end 5 successively includes first
Pin 7 in interior pin 6, second, pin 7 is linear line shape in described second.
The lead frame mold in the utility model is required in etching step in lead frame manufacturing process
Mold, mold is for producing with the consistent concave-convex picture and text of mold or gap in lead frame；It is described
The first pin 2, second pin 3, dowel 4, angle-style end 5 in mold and the first pin in the lead frame produced
2, second pin 3, dowel 4, angle-style end 5 are the same, so designing superior lead frame mold just etc.
It is fixed in the pin of the lead frame manufactured is formed.So pin 7 is linear line shape, phase in the second of second pin 3
Compared with the design of feeler shape in the prior art, the design of linear line shape increases gap and development is made uniformly to obtain fixed column ruler
The very little 0.4PITCH etched frame that can effectively control.In production lead frame QFN (0404-0.40) 028-0001 mold
When, this lead frame, and the mold with the design of the prior art before are produced with the glass molds that new this designing technique makes
Production this lead frame carry out Statistical Comparison, from our company manufacture three production reports in count it is old design and it is newly-designed
Yield is respectively as follows: 61% and 87%, wherein connecting foot ratio is respectively as follows: 9.88% and 2.1%, hence it is evident that yield improves, even foot ratio
It reduces.
Embodiment 2
Based on embodiment 1, linear line shape described second in pin 7 line width be 1.4Mil.Draw in feeler shape second
Foot 7 is smaller and smaller from harntail to gap between the top of the horn line line, and line line gap can be more after pin 70.5MIL line width in setting second
It is small, exceed the process capability range of development, unevenly leads to occur to etch the partially fertile problem of uneven, fixed column very due to developing
Generally, especially prominent at interior pin.And this angular technique of painting is more complicated.When making the frame of 0.4PITCH, it may appear that
The phenomenon that fixed column fluctuation is big and shape is partially fertile, very big influence is caused to product quality.But draw in the second of linear line shape
Foot 7 is set as 1.4Mil line width.Gap can so be increased and make development uniformly, obtain what fixed column size can be controlled effectively
0.4PITCH etched frame avoids the partially fertile phenomenon of fixed column fluctuation and shape.
Embodiment 3
Based on embodiment 1, totally four groups of the die assembly 1, the angle-style end 5 outwardly, the dowel 4 inwardly, four groups
The die assembly 1 surrounds square.Four groups of die assemblies 1 collectively form the pin portions of lead frame, are subsequent realization core
The electrical connection of piece internal circuit exit and outer lead.
Embodiment 4
Based on embodiment 1, the second pin 3 is six groups, is distributed between first pin 2 at 1 both ends of die assembly.
Embodiment 5
Based on embodiment 1, round die block is equipped between adjacent first pin 2 and second pin 3 and adjacent first pin 2
8.The circular gap of the corresponding lead frame of round die block 8 provides tie point for subsequent electrical connection.
Embodiment 6
Based on embodiment 1, the four corners for the square that die assembly 1 described in four groups is constituted are equipped with star-like module 9.It is star-like
Mould module corresponds to the star-like gap of lead frame, provides tie point for subsequent electrical connection.
The specific embodiment of the application above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
The limitation to the application protection scope therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, under the premise of not departing from technical scheme design, various modifications and improvements can be made, these belong to this
The protection scope of application.
Claims (6)
1. a kind of lead frame mold, is fixedly installed in mold base, it is characterised in that: the mold includes several groups mold
Component (1), the die assembly (1) include the first pin (2), the second pin (3) between the first pin (2)；It is described
It is fixedly connected on the same line between first pin (2) and second pin (3) by dowel (4)；The second pin (3)
End be set as angle-style end (5), the angle-style end (5) successively includes pin (6) in first, pin (7) in second, described the
Pin (7) is linear line shape in two.
2. a kind of lead frame mold according to claim 1, it is characterised in that: described the second of linear line shape
The line width of interior pin (7) is 1.4Mil.
3. a kind of lead frame mold according to claim 1, it is characterised in that: the die assembly (1) totally four
Group, the angle-style end (5) outwardly, the dowel (4) inwardly, die assembly described in four groups (1) surrounds square.
4. a kind of lead frame mold according to claim 1, it is characterised in that: the second pin (3) is six
Group is distributed between first pin (2) at die assembly (1) both ends.
5. a kind of lead frame mold according to claim 1, it is characterised in that: adjacent first pin (2) and
Round die block (8) are equipped between two pins (3) and adjacent first pin (2).
6. a kind of lead frame mold according to claim 1, it is characterised in that: die assembly described in four groups (1)
The four corners of the square of composition are equipped with star-like module (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920182870.3U CN209282166U (en) | 2019-02-01 | 2019-02-01 | A kind of lead frame mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920182870.3U CN209282166U (en) | 2019-02-01 | 2019-02-01 | A kind of lead frame mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209282166U true CN209282166U (en) | 2019-08-20 |
Family
ID=67605976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920182870.3U Active CN209282166U (en) | 2019-02-01 | 2019-02-01 | A kind of lead frame mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209282166U (en) |
-
2019
- 2019-02-01 CN CN201920182870.3U patent/CN209282166U/en active Active
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