CN219855543U - Die lead groove of discrete device - Google Patents

Die lead groove of discrete device Download PDF

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Publication number
CN219855543U
CN219855543U CN202320263343.1U CN202320263343U CN219855543U CN 219855543 U CN219855543 U CN 219855543U CN 202320263343 U CN202320263343 U CN 202320263343U CN 219855543 U CN219855543 U CN 219855543U
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CN
China
Prior art keywords
die
discrete device
baffle
stop block
fixedly connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202320263343.1U
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Chinese (zh)
Inventor
章春
阮建华
周杨
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Lesan Phoenix Semiconductor Co
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Lesan Phoenix Semiconductor Co
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Publication date
Application filed by Lesan Phoenix Semiconductor Co filed Critical Lesan Phoenix Semiconductor Co
Priority to CN202320263343.1U priority Critical patent/CN219855543U/en
Application granted granted Critical
Publication of CN219855543U publication Critical patent/CN219855543U/en
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Abstract

The utility model provides a die wire slot of a discrete device, which relates to the technical field of dies, and comprises a die, a baffle plate and a plurality of baffle plates, wherein the die is provided with a groove, and the baffle plates are symmetrically arranged at the top of the groove and are fixedly connected with the die; the stop block is provided with an inclined plane which is V-shaped, the side surface of the stop block is fixedly connected with the baffle, and the bottom of the stop block is fixedly connected with the die; the utility model is suitable for die forming of discrete devices, can reduce the flying skin of the die material of the plastic package body and reduce the pressure of electroplating high-pressure water, thereby reducing the risk of cracking and improving the benefit of enterprises.

Description

Die lead groove of discrete device
Technical Field
The utility model relates to the technical field of dies, in particular to a die wire slot of a discrete device.
Background
With the gradual development of the semiconductor industry, the discrete device is an important component of the industry, and has many applications in high-performance occasions such as ultra-high power, high voltage and the like due to the advantages of good heat dissipation performance and the like. Discrete devices refer to electronic devices with individual functions and with functions that cannot be split, and are mainly composed of chips, lead wires/frames, and plastic package housing parts. At present, when a die is used for producing discrete devices, as shown in fig. 1, a forming die is in an in-line design, and in the specific production process, the plastic package body die material has a certain flying skin, and meanwhile, when electroplating, the die can be demolded only by high water pressure, so that the risk of cracking exists.
Disclosure of Invention
The utility model aims to provide a die lead slot of a discrete device, which solves the problems of flying skin residue caused by the direct-row design of the discrete device and possible cracks caused by high water pressure required by electroplating.
The embodiment of the utility model is realized by the following technical scheme: the die wire guide groove of the discrete device comprises a die, wherein the die is provided with a groove, and also comprises baffle plates, and a plurality of baffle plates are symmetrically arranged at the top of the groove and fixedly connected with the die; the stop block is provided with an inclined plane which is V-shaped, the side surface of the stop block is fixedly connected with the baffle, and the bottom of the stop block is fixedly connected with the die;
furthermore, the baffle plates and the stop blocks are distributed in an array at intervals;
further, the baffle plates arranged at the two ends are fixedly connected with strip-shaped stop blocks, and the strip-shaped stop blocks are fixedly connected with the die;
furthermore, the number of the baffle plates and the number of the baffle blocks are four, and three openings are symmetrically arranged between the baffle plates;
further, the thickness of the baffle plate is 0.03mm;
further, the clamping leg of the V-shaped inclined plane is 139 degrees;
further, a plurality of dies are fixedly connected.
The technical scheme of the utility model has at least the following advantages and beneficial effects: through set up the baffle on the mould, can form the pin of discrete device according to the mould, on this basis, through the setting on dog V style of calligraphy inclined plane, can reduce the plastic envelope body mould material and fly skin, simultaneously because the inclined plane is for the straight-line design, increased the surface area, reduced the pressure of electroplating high-pressure water to the risk of crackle has been reduced, the benefit of enterprise has been improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a die lead groove of a discrete device provided in the prior art;
fig. 2 is a schematic structural diagram of a die lead groove of a discrete device according to embodiment 1 of the present utility model;
fig. 3 is a schematic diagram of the working state of the die lead groove of the discrete device according to embodiment 1 of the present utility model;
icon: 1-mold, 2-baffle, 3-baffle, 4-inclined plane, 5-bar baffle and 6-notch.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples
The utility model provides a die wire slot of a discrete device, which is shown in fig. 2, and comprises a die 1, wherein the die 1 is provided with a groove, and also comprises baffle plates 2, and a plurality of baffle plates 2 are symmetrically arranged at the top of the groove and fixedly connected with the die 1; the stop block 3, the stop block 3 is equipped with inclined plane 4, and inclined plane 4 is the V style of calligraphy, stop block 3 side and baffle 2 fixed connection, stop block 3 bottom and mould 1 fixed connection.
It is worth mentioning that through setting up baffle 2 on mould 1, can form the pin of discrete device according to mould 1, on this basis, through dog 3V style of calligraphy inclined plane 4's setting, can reduce the plastic envelope body mould material and fly skin, simultaneously because inclined plane 4 is for the straight-line design, increased the surface area, and then reduced the pressure of electroplating high-pressure water when drawing of patterns to the risk of cracking has been reduced, the quality of discrete device has been promoted, the benefit of enterprise has been improved.
Baffle 2, a plurality of baffles 2 symmetry interval array distributes, and baffle 2 quantity for example is four, and interval distribution's baffle 2 is formed with three places opening 6, can form the pin of discrete device after injection mould material cooling shaping, in some embodiments, baffle 2 thickness can be 0.03mm, can realize the shaping function of mould 1, has reduced the manufacturing cost of mould 1 simultaneously.
The baffle plates 3 are symmetrically distributed at intervals, the number of the baffle plates 2 is four, the baffle plates 3 are provided with inclined planes 4, the inclined planes 4 are V-shaped, in some embodiments, the clamping legs of the V-shaped inclined planes 4 can be 139 degrees, and due to the arrangement of the inclined planes 4, the contact area can be increased relative to a straight-line design, and then the water pressure during demolding can be reduced during electroplating, the risk of cracking is reduced, the quality of discrete devices is improved, and the benefit of enterprises is improved; the baffle blocks 3 which are distributed on two sides at intervals are fixedly connected with the strip-shaped baffle blocks 5, the strip-shaped baffle blocks 5 are fixedly connected with the die 1, and can be enclosed with the baffle plates 2 to form a rectangular space, so that the die 1 can be conveniently formed and operated.
In some embodiments, the die 1, the baffle 2 and the baffle 3 may be integrally formed, and then the V-shaped inclined surface 4 is cut for the baffle 3, so that the processing steps of the discrete device die 1 can be reduced, the production efficiency of the discrete device die 1 is improved, and the production cost of the discrete device die 1 is reduced.
In some embodiments, as shown in fig. 3, a plurality of discrete device dies 1 are fixedly connected, for example, a plurality of discrete device dies 1 are arranged side by side, and are fixedly connected, for example, integrally formed or welded, so that the forming operation of the discrete device dies 1 can be performed in batch, the processing efficiency is improved, and meanwhile, the enterprise benefit is improved.
The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (7)

1. The utility model provides a mould wire groove of discrete device, includes mould (1), mould (1) are equipped with the recess, its characterized in that still includes:
the baffle plates (2) are symmetrically arranged at the tops of the grooves and fixedly connected with the die (1);
the stop block (3), stop block (3) are equipped with inclined plane (4), inclined plane (4) are the V style of calligraphy, stop block (3) side with baffle (2) fixed connection, stop block (3) bottom with mould (1) fixed connection.
2. The die lead groove of the discrete device according to claim 1, wherein the baffle plate (2) and the stop block (3) are arranged in a spaced array.
3. A die wire guiding groove for a discrete device as claimed in claim 2, characterized in that the baffle plates (2) arranged at both ends are fixedly connected with a bar-shaped stop block (5), the bar-shaped stop block (5) being fixedly connected with the die (1).
4. A die wire guiding groove for a discrete device as claimed in claim 3, characterized in that the number of the baffle plates (2) and the number of the baffle blocks (3) are four, and three openings (6) are symmetrically arranged between the baffle plates (2).
5. A die lead groove for a discrete device as claimed in claim 4, wherein the baffle (2) has a thickness of 0.03mm.
6. The die lead groove of the discrete device as claimed in claim 5, wherein the grip foot of the V-shaped bevel (4) is 139 °.
7. A die lead groove for a discrete device as claimed in claim 6, characterized in that several of the dies (1) are fixedly connected.
CN202320263343.1U 2023-02-20 2023-02-20 Die lead groove of discrete device Active CN219855543U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320263343.1U CN219855543U (en) 2023-02-20 2023-02-20 Die lead groove of discrete device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320263343.1U CN219855543U (en) 2023-02-20 2023-02-20 Die lead groove of discrete device

Publications (1)

Publication Number Publication Date
CN219855543U true CN219855543U (en) 2023-10-20

Family

ID=88336989

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320263343.1U Active CN219855543U (en) 2023-02-20 2023-02-20 Die lead groove of discrete device

Country Status (1)

Country Link
CN (1) CN219855543U (en)

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