CN220041858U - Double-base island lead frame chip packaging structure - Google Patents
Double-base island lead frame chip packaging structure Download PDFInfo
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- CN220041858U CN220041858U CN202320832859.3U CN202320832859U CN220041858U CN 220041858 U CN220041858 U CN 220041858U CN 202320832859 U CN202320832859 U CN 202320832859U CN 220041858 U CN220041858 U CN 220041858U
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- pin
- base island
- island
- lead frame
- diode
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 230000009977 dual effect Effects 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 4
- 238000012858 packaging process Methods 0.000 abstract description 4
- 238000003825 pressing Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 101150077760 SOP4 gene Proteins 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a double-base island lead frame chip packaging structure, which comprises a lead frame, wherein the lead frame is provided with a first base island and a second base island, and the first base island and the second base island are electrically isolated; the diode and the MOS tube are carried on the first base island and electrically connected, the P pole of the diode is downwards connected with the first base island, the N pole of the diode is upwards, and the metal table top for wire bonding is used for wire bonding to connect with the cathode; the second base island is carried and electrically connected with a power driving main control chip. According to the utility model, the diode with the upward N pole is used for wire bonding instead of the diode with the upward P pole, so that the frame material is unified in the IC production and packaging process by using the two-base island instead of the three-base island frame on the premise of not influencing the functions and the current trend of the product, the die bonding wire pressing plate jig is shared and not wasted, the area of the double-base island is larger, the flatness is better, and the heat dissipation of the product is improved. Meanwhile, the production of the two-base island frame is easier, and the difficulty of the frame production is reduced.
Description
Technical Field
The utility model belongs to the technical field of semiconductor packaging, and particularly relates to a double-base island lead frame chip packaging structure.
Background
Chip packaging is a process of directly determining whether a chip is good or not in chip manufacturing, and the chip packaging needs to consider not only space utilization but also heat dissipation performance.
At present, the power driving chip of the common integrated power device in the market is a packaging structure of SOP7, SOP4 or more pins, and under the condition of considering space arrangement and heat dissipation effect, the chip D1, the power electric appliance D2 and the diode D3 can be respectively arranged on three mutually electrically isolated islands for packaging and use, as shown in fig. 1. However, the design of the three-base island frame also has some problems, such as: in the IC production packaging process, the frame materials are not uniform, the die bonding wire pressing plate jig cannot be shared, and the flatness can be influenced due to small area of the base island, so that the heat dissipation performance is also influenced to a certain extent.
Disclosure of Invention
In order to solve the above problems in the prior art, the present utility model provides a dual island leadframe chip package structure.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the double-base island lead frame chip packaging structure comprises a lead frame, wherein the lead frame is provided with a first base island and a second base island, and the first base island and the second base island are electrically isolated; the diode and the MOS tube are carried on the first base island and electrically connected, the P pole of the diode is downwards connected with the first base island, the N pole of the diode is upwards, and the metal table top for wire bonding is used for wire bonding to connect with the cathode; the second base island is carried and electrically connected with a power driving main control chip.
Further, a first pin and a second pin are arranged on the lead frame, the first pin and the second pin are separated from the first base island and the second base island respectively, the first pin is an HV pin, and the second pin is a GND pin; the power driving main control chip is electrically connected with the N pole of the diode, the MOS tube and the second pin through metal leads respectively; the MOS tube is electrically connected with the second base island through a metal lead; the N pole of the diode is electrically connected with the first pin through a metal lead.
Further, at least one fifth pin is further arranged on the lead frame, the fifth pin is separated from the first base island and the second base island respectively, the fifth pin, the first pin and the second pin are arranged on the same side of the lead frame, and the fifth pin is arranged between the first pin and the second pin. The space of lead frame can be utilized to the maximum extent in the setting of fifth pin, has also increased heat radiating area simultaneously, has promoted heat dispersion, the fifth pin is reserved the pin, and reserved pin can be applicable to the power module structure of more output, and the application is more nimble.
Further, one side of the fifth pin, the first pin and the second pin, which is close to the first base island or the second base island, is of a T-shaped structure. During plastic packaging, the design of the T-shaped structure enhances the binding force between the plastic packaging material and the pins, and can effectively prevent the root parts of the pins from being pulled loose by external force during rib cutting.
Further, the first base island is provided with a plurality of fourth pins, the fourth pins are arranged on at least one side of the lead frame, and the fourth pins are DRAIN pins.
Further, a first connection part is arranged on the first base island in a protruding mode, and the first connection part and the fourth pin are arranged on two adjacent sides of the lead frame.
Further, a third pin is arranged on the second base island, and the third pin is a CS pin.
Further, a second connecting portion is arranged on the second base island in a protruding mode, and the second connecting portion and the third pin are arranged on two adjacent sides of the lead frame.
Compared with the prior art, the double-base island lead frame chip packaging structure uses the diode with the upward N pole to replace the diode with the upward P pole to wire, and finally uses the two base islands to replace the three base island frame on the premise of not influencing the product function and the current trend. After the two-base island is realized to replace the three-base island frame, frame materials in the IC production and packaging process are unified, the die bonding wire pressing plate jig is shared and is not wasted, the area of the two-base island is larger, the flatness is better, and the heat dissipation of the product is improved. Meanwhile, the production of the two-base island frame is easier, and the difficulty of the frame production is reduced.
Drawings
The following description of the embodiments of the utility model is further defined by reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a conventional package structure;
FIG. 2 is a schematic diagram of a dual island leadframe chip package structure according to the present utility model;
fig. 3 is a schematic diagram of a diode structure with an upward N-pole in the present utility model.
Detailed Description
Referring to fig. 2, the dual-island lead frame chip package structure of the present embodiment includes a lead frame 1, where the lead frame 1 is provided with a first island 21 and a second island 22, and the first island 21 and the second island 22 are electrically isolated from each other; the first base island 21 is carried and electrically connected with a diode 3 and a MOS tube 4, the P pole of the diode 3 is downwards connected with the first base island 21, the N pole of the diode 3 is upwards, and a metal table top for wire bonding is used for wire bonding to connect with a cathode; the second base island 22 is carried on and electrically connected with the power driving main control chip 5. Diode 3 and MOS pipe 4 are fixed through conductive silver glue and first base island 21 bonding, and power drive main control chip 5 is fixed through conductive silver glue and second base island 22 bonding, adopts the diode of ES05JN model that tai cang Tianyu electron limited company produced in this embodiment, and its structure schematic diagram is as shown in FIG. 3, and diode 3 and MOS pipe 4 set up on same base island, and in this embodiment, diode 3 and MOS pipe 4 follow the design of first base island 21 diagonal, can further promote heat dispersion. In addition, the double-base island design increases the area of the first base island 21 and the second base island 22, compared with the triple-base island design, has high chip integration, the LED lighting circuit can simplify the circuit on the periphery of the package, and can be widely used in low-power supply driving products, LED lighting products with high requirements on the volume and cost of a power supply board and circuits.
In this embodiment, the lead frame 1 is preferably provided with a first pin 61 and a second pin 62, the first pin 61 and the second pin 62 are separated from the first base island 21 and the second base island 22 respectively, the first pin 61 is an HV pin, and the second pin 62 is a GND pin; the power driving main control chip 5 is electrically connected with the N pole of the diode 3, the MOS tube 4 and the second pin 62 through metal leads respectively; the MOS tube 4 is electrically connected with the second base island 22 through a metal lead; the N-pole of the diode 3 is electrically connected to the first pin 61 through a metal lead.
In this embodiment, preferably, at least one fifth lead 65 is further disposed on the lead frame 1, the fifth lead 65 is separated from the first base island 21 and the second base island 22, the fifth lead 65, the first lead 61 and the second lead 62 are disposed on the same side of the lead frame 1, and the fifth lead 65 is disposed between the first lead 61 and the second lead 62. The space of lead frame 1 can be utilized to the maximum extent in the setting of fifth pin 65, has also increased heat radiating area simultaneously, has promoted heat dispersion, fifth pin 65 is reserved the pin, and reserved pin can be applicable to the power module structure of more outputs, and the application is more nimble.
In this embodiment, preferably, the sides of the fifth lead 65, the first lead 61 and the second lead 62 near the first base island 21 or the second base island 22 are in a T-shaped structure. During plastic packaging, the design of the T-shaped structure enhances the binding force between the plastic packaging material and the pins, and can effectively prevent the root parts of the pins from being pulled loose by external force during rib cutting.
In this embodiment, a plurality of fourth pins 64 are preferably disposed on the first base island 21, the fourth pins 64 are disposed on at least one side of the leadframe 1, and the fourth pins 64 are DRAIN pins. The fourth pin 64 may further improve the heat dissipation performance of the components on the first base island 21.
In this embodiment, the first land 21 is preferably provided with a first connection portion 71 protruding therefrom, and the first connection portion 71 and the fourth pin 64 are disposed on two sides adjacent to the lead frame 1.
In this embodiment, preferably, a third pin 63 is disposed on the second base island 22, and the third pin 63 is a CS pin.
In this embodiment, the second land 22 is preferably provided with a second connection portion 72 protruding therefrom, and the second connection portion 72 and the third pin 63 are disposed on two sides adjacent to the lead frame 1.
In this embodiment, the first pin 61, the second pin 62, the third pin 63, the fourth pin 64 and the fifth pin 65 preferably adopt strength-enhanced pins, that is, the hardness of the pins is greater than a preset strength, so that the pins are not easy to bend or break, and the reliability of the package is improved; and a space is reserved between the pins so as to reduce the risk of discharge breakdown caused by too close space between the pins.
The double-base island lead frame chip packaging structure of the embodiment uses the diode with the upward N pole to replace the diode with the upward P pole to wire, and finally uses the two-base island to replace the three-base island frame on the premise of not influencing the function and the current trend of the product. After the two-base island is realized to replace the three-base island frame, frame materials in the IC production and packaging process are unified, the die bonding wire pressing plate jig is shared and is not wasted, the area of the two-base island is larger, the flatness is better, and the heat dissipation of the product is improved. Meanwhile, the production of the two-base island frame is easier, and the difficulty of the frame production is reduced.
In the above description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The foregoing description is only of a preferred embodiment of the utility model, which can be practiced in many other ways than as described herein, so that the utility model is not limited to the specific implementations disclosed above. While the foregoing disclosure has been described with reference to certain embodiments, it will be understood by those skilled in the art that various changes and modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. Any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present utility model without departing from the technical solution of the present utility model still falls within the scope of the technical solution of the present utility model.
Claims (8)
1. A double-base island lead frame chip packaging structure is characterized in that: the lead frame (1) is provided with a first base island (21) and a second base island (22), and the first base island (21) and the second base island (22) are electrically isolated; the first base island (21) is carried and electrically connected with a diode (3) and an MOS (metal oxide semiconductor) tube (4), the P pole of the diode (3) is downwards connected with the first base island (21), the N pole of the diode (3) is upwards, and a metal table top for wire bonding is used for wire bonding to connect with a negative pole; the second base island (22) is carried on and electrically connected with a power driving main control chip (5).
2. The dual island leadframe chip package structure of claim 1, wherein: a first pin (61) and a second pin (62) are arranged on the lead frame (1), the first pin (61) and the second pin (62) are separated from the first base island (21) and the second base island (22) respectively, the first pin (61) is an HV pin, and the second pin (62) is a GND pin; the power supply driving main control chip (5) is electrically connected with the N pole of the diode (3), the MOS tube (4) and the second pin (62) through metal leads respectively; the MOS tube (4) is electrically connected with the second base island (22) through a metal lead; the N pole of the diode (3) is electrically connected with the first pin (61) through a metal lead.
3. The dual island leadframe chip package structure of claim 2, wherein: the lead frame (1) is further provided with at least one fifth pin (65), the fifth pin (65) is separated from the first base island (21) and the second base island (22) respectively, the fifth pin (65), the first pin (61) and the second pin (62) are arranged on the same side of the lead frame (1), and the fifth pin (65) is arranged between the first pin (61) and the second pin (62).
4. The dual island leadframe chip package structure of claim 3, wherein: one side of the fifth pin (65), the first pin (61) and the second pin (62) close to the first base island (21) or the second base island (22) is of a T-shaped structure.
5. The dual island leadframe chip package structure of claim 1, wherein: the first base island (21) is provided with a plurality of fourth pins (64), the fourth pins (64) are arranged on at least one side of the lead frame (1), and the fourth pins (64) are DRAIN pins.
6. The dual island leadframe chip package structure of claim 5, wherein: the first base island (21) is provided with a first connecting part (71) in a protruding mode, and the first connecting part (71) and the fourth pin (64) are arranged on two adjacent sides of the lead frame (1).
7. The dual island leadframe chip package structure of claim 1, wherein: and a third pin (63) is arranged on the second base island (22), and the third pin (63) is a CS pin.
8. The dual island leadframe chip package structure of claim 7, wherein: and a second connecting part (72) is arranged on the second base island (22) in a protruding mode, and the second connecting part (72) and the third pin (63) are arranged on two adjacent sides of the lead frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320832859.3U CN220041858U (en) | 2023-04-14 | 2023-04-14 | Double-base island lead frame chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320832859.3U CN220041858U (en) | 2023-04-14 | 2023-04-14 | Double-base island lead frame chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220041858U true CN220041858U (en) | 2023-11-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320832859.3U Active CN220041858U (en) | 2023-04-14 | 2023-04-14 | Double-base island lead frame chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220041858U (en) |
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2023
- 2023-04-14 CN CN202320832859.3U patent/CN220041858U/en active Active
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