CN217719509U - Pressing plate of semiconductor product packaging bonding machine - Google Patents
Pressing plate of semiconductor product packaging bonding machine Download PDFInfo
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- CN217719509U CN217719509U CN202221062981.9U CN202221062981U CN217719509U CN 217719509 U CN217719509 U CN 217719509U CN 202221062981 U CN202221062981 U CN 202221062981U CN 217719509 U CN217719509 U CN 217719509U
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- heating block
- vacuum adsorption
- heat dissipation
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Abstract
The utility model discloses a pressing plate of a semiconductor product packaging bonding machine, which comprises a cover plate and a heating block which are separated from each other, wherein the left end and the right end of the cover plate are provided with mounting ear plates, the left end and the right end of the cover plate are respectively provided with a heat dissipation window, the middle of the cover plate between the heat dissipation windows is provided with a middle strip-shaped hole, and the left side and the right side of the middle strip-shaped hole are respectively provided with a rib plate which is protruded towards the heating block; heating piece upper portion is equipped with to the outstanding boss of apron direction, the boss middle part is equipped with a plurality of X type vacuum adsorption holes of group, and X type vacuum adsorption hole is arranged into one and when apron and heating piece pressfitting each other, and X type vacuum adsorption hole is whole to be located middle part bar hole within range. The utility model discloses be convenient for the bonded back product heat dissipation, the tighter of pressing during the bonding, X type vacuum adsorption hole design has increased the vacuum adsorption area for the adsorbed more jail of product, the wholeness can be more stable, and equipment operation is stable, be heated more evenly, has improved production efficiency and clamp plate utilization efficiency greatly.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor package, specifically relate to a semiconductor product encapsulation bonding machine clamp plate.
Background
In the WB process of semiconductor packaging, the product is subjected to the processes of feeding, pressing plate pressing, heating, wire welding, heat dissipation and material returning on a bonding machine.
The existing QFN/DFN universal pressing plate has relatively more invar and firmer appearance, is not beneficial to heat dissipation of a bonded product, and can cause a certain degree of color change of a frame when the product is at a high temperature for a long time;
the cover plate of the prior QFN/DFN universal pressing plate is mostly in a large window form (1 Block presses 10 rows), the pressing position range is wide, the cover plate can only be pressed on the upper side and the lower side of a product frame, the pressing effect is not good, the middle part of a product is easy to arch, the product is warped, welding is not good, and PR recognition is not easy to cause missed beating;
the conventional QFN/DFN universal pressing plate heating block adopts a large-area conductive ceramic material, and the whole BOND welding line area is heated unevenly after heating, so that a series of defects such as spherical abnormal balls, craters and the like of a product are caused;
the surface of the current QFN/DFN universal pressing plate heating block adopts a large number of fine vacuum holes, the vacuum adsorption force is weak, the performance is not stable, the product is not pressed well, the chip is not on line, the chip is suspended with a base island, a vacuum area is easy to damage, the vacuum adsorption is poor, and the base island is deformed in the production process.
Disclosure of Invention
An object of the utility model is to above-mentioned problem, provide a semiconductor product encapsulation bonding machine clamp plate, its simple structure, heat dissipation, pressfitting effect are better, vacuum adsorption power is stronger with higher speed to it is stable high-efficient.
The technical scheme of the utility model is realized like this.
A semiconductor product packaging bonder clamp plate is characterized in that: the heat dissipation device comprises a cover plate and a heating block which are separated from each other, wherein mounting lug plates are arranged at the left end and the right end of the cover plate, heat dissipation windows are respectively arranged at the left end and the right end of the cover plate, a middle strip-shaped hole is arranged in the middle of the cover plate between the heat dissipation windows, and rib plates protruding towards the heating block are respectively arranged at the left side and the right side of the middle strip-shaped hole; the upper part of the heating block is provided with a boss protruding towards the cover plate direction, the middle part of the boss is provided with a plurality of groups of X-shaped vacuum adsorption holes, each group of X-shaped vacuum adsorption holes are used for adsorbing a chip base island and comprise 5 holes including four end points and a middle cross point, the X-shaped vacuum adsorption holes are arranged in a row, and when the cover plate and the heating block are mutually pressed, all the X-shaped vacuum adsorption holes are positioned in the range of the middle strip-shaped holes; the lower part of the heating block is provided with an inward sunk bottom screw hole; a vacuum channel is arranged in the heating block, one end of the vacuum channel is communicated with the X-shaped vacuum adsorption hole, and the other end of the vacuum channel extends to a side outlet of the heating block.
Further, the heat dissipation window is rectangular.
Furthermore, the connecting part of the boss and the heating block main body is provided with an arc-shaped chamfer, so that the friction of the frame during stepping passing is reduced.
Furthermore, the installation ear plate is connected with the plane of the cover plate main body through an inclined plane plate, so that the influence of screws installed on the installation ear plate on the plane of the cover plate main body is avoided.
The utility model has the advantages that: 1. the utility model has simple structure of the pressing plate of the bonder, and the heat dissipation window and the middle strip-shaped hole are convenient for the heat dissipation of the bonded product; 2. the cover plate is provided with the protruding rib plate, so that the pressing is tighter during the bonding; 3. the design of the X-shaped vacuum adsorption holes increases the vacuum adsorption area, so that the product is adsorbed more firmly; 4. the whole performance is more stable, the equipment operation is stable, the heating is more uniform, and the production efficiency and the utilization efficiency of the pressing plate are greatly improved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a plan view structural diagram of the present invention.
Fig. 3 is a schematic structural diagram of the cover plate of the present invention.
Fig. 4 is a schematic structural view of the heating block of the present invention.
In the figure, 1, a cover plate, 2, a heating block, 11, an installation lug plate, 12, a heat dissipation window, 13, a rib plate, 14, a middle strip-shaped hole, 21, a boss, 22, an X-shaped vacuum adsorption hole, 23, a bottom screw hole, 24 and a vacuum channel.
Detailed Description
The technical solution of the present invention will be further described in detail by the following embodiments and the accompanying drawings.
As shown in fig. 1-4, the pressing plate of the semiconductor product packaging bonding machine of the present invention comprises a cover plate 1 and a heating block 2 which are separated from each other, wherein mounting ear plates 11 are arranged at the left and right ends of the cover plate 1, a rectangular heat dissipation window 12 is respectively arranged on the left and right sides of the cover plate 1, a middle strip-shaped hole 14 is arranged in the middle of the cover plate 1 between the heat dissipation windows 12, and rib plates 13 protruding towards the heating block 2 are respectively arranged at the left and right sides of the middle strip-shaped hole 14; the upper part of the heating block 2 is provided with a boss 21 protruding towards the cover plate 1, the middle part of the boss 21 is provided with 12 groups of X-shaped vacuum adsorption holes 22, each group of X-shaped vacuum adsorption holes 22 is used for adsorbing a chip base island and comprises 5 holes including four end points and a middle cross point, the X-shaped vacuum adsorption holes 22 are arranged in a line, and when the cover plate 1 and the heating block 2 are mutually pressed, the X-shaped vacuum adsorption holes 22 are all positioned in the range of the middle strip-shaped hole 14; the lower part of the heating block 2 is provided with an inward sunk bottom screw hole 23; a vacuum channel 24 is arranged in the heating block 2, one end of the vacuum channel 24 is communicated with the X-shaped vacuum adsorption hole 22, and the other end of the vacuum channel extends to a side outlet of the heating block 2.
The boss 21 is equipped with arc chamfer with the 2 main part connecting portions of heating block, reduces the friction when the frame is step-by-step to pass through.
The installation ear plate 11 is connected with the main plane of the cover plate 1 through an inclined plane plate, and the influence of screws installed on the installation ear plate 11 on the main plane of the cover plate 1 is avoided.
During the use, be equipped with the frame to left side or the step-by-step removal in right side between apron 1 and the heating block 2, the base island of a row of chip on the frame passes through X type vacuum adsorption hole 22 on the boss 21 and fixes, heating block 2 heats the chip, apron 1 pushes down, two floor 13 push down the frame, it is more tight to press during the bonding, the product heat dissipation after the bonding of heat dissipation window 12 and middle part bar hole 14 is convenient for, after the bonding of a row of chip on the completion frame, the frame is to left side or right side step-by-step, next row of chip begins the bonding.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.
Claims (4)
1. A semiconductor product packaging bonder clamp plate is characterized in that: the heat dissipation device comprises a cover plate and a heating block which are separated from each other, wherein mounting lug plates are arranged at the left end and the right end of the cover plate, heat dissipation windows are respectively arranged at the left end and the right end of the cover plate, a middle strip-shaped hole is arranged in the middle of the cover plate between the heat dissipation windows, and rib plates protruding towards the heating block are respectively arranged at the left side and the right side of the middle strip-shaped hole; the upper part of the heating block is provided with a boss protruding towards the cover plate direction, the middle part of the boss is provided with a plurality of groups of X-shaped vacuum adsorption holes, each group of X-shaped vacuum adsorption holes are used for adsorbing a chip base island and comprise 5 holes including four end points and a middle cross point, the X-shaped vacuum adsorption holes are arranged in a row, and when the cover plate and the heating block are mutually pressed, all the X-shaped vacuum adsorption holes are positioned in the range of the middle strip-shaped holes; the lower part of the heating block is provided with an inward sunk bottom screw hole; and a vacuum channel is arranged in the heating block, one end of the vacuum channel is communicated with the X-shaped vacuum adsorption hole, and the other end of the vacuum channel extends to a side outlet of the heating block.
2. The semiconductor product packaging bonder platen of claim 1, wherein: the heat dissipation window is rectangular.
3. The semiconductor product packaging bonder platen of claim 1, wherein: the boss is equipped with arc chamfer with heating block main part connecting portion.
4. The semiconductor product packaging bonder platen of claim 1, wherein: the installation ear plate is connected with the plane of the cover plate main body through an inclined plane plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221062981.9U CN217719509U (en) | 2022-05-06 | 2022-05-06 | Pressing plate of semiconductor product packaging bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221062981.9U CN217719509U (en) | 2022-05-06 | 2022-05-06 | Pressing plate of semiconductor product packaging bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217719509U true CN217719509U (en) | 2022-11-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221062981.9U Active CN217719509U (en) | 2022-05-06 | 2022-05-06 | Pressing plate of semiconductor product packaging bonding machine |
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| CN (1) | CN217719509U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116631961A (en) * | 2023-07-21 | 2023-08-22 | 青岛泰睿思微电子有限公司 | Small-sized DFN packaging chip and wire bonding device thereof |
-
2022
- 2022-05-06 CN CN202221062981.9U patent/CN217719509U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116631961A (en) * | 2023-07-21 | 2023-08-22 | 青岛泰睿思微电子有限公司 | Small-sized DFN packaging chip and wire bonding device thereof |
| CN116631961B (en) * | 2023-07-21 | 2023-12-08 | 青岛泰睿思微电子有限公司 | Small-sized DFN packaging chip and wire bonding device thereof |
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