CN215644460U - Triode with high heat dissipation structure - Google Patents

Abstract

The utility model discloses a triode with a high heat dissipation structure, which comprises a plastic package body, a triode chip arranged in the plastic package body and a base plate arranged on one side of the plastic package body, wherein three pins are fixed on the base plate at intervals; one side of the plastic package body, which is far away from the substrate, is provided with a radiating fin, and the other end of each insulating heat conduction strip is respectively connected with the radiating fin. Compared with the prior art, the heat dissipation performance of the triode can be improved, and the service life and the safety of the triode are improved.

Description

Triode with high heat dissipation structure

Technical Field

The utility model relates to the field of triodes, in particular to a triode with a high heat dissipation structure.

Background

The triode is a semiconductor triode, also called a bipolar transistor and a transistor, and is a semiconductor device for controlling current. The function is to amplify the weak signal into an electric signal with larger amplitude value, and the electric signal is also used as a contactless switch. The triode is one of basic semiconductor components and is widely applied to various industries. In the prior art, the heat dissipation performance of the triode is mostly determined by the heat dissipation performance of the plastic package body, and the triode has poor heat conduction performance due to the absence of a heat dissipation structure inside, so that heat accumulation is easily caused, elements are burnt out, and the service life of the triode is shortened, so that improvement is needed.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide the triode with the high heat dissipation structure, so that the heat conduction efficiency of the triode is improved, the internal heat is prevented from being excessively accumulated, and the service life is prolonged.

In order to achieve the purpose, the utility model adopts the technical scheme that: a triode with a high heat dissipation structure comprises a plastic package body, a triode chip arranged in the plastic package body and a base plate arranged on one side of the plastic package body, wherein three pins are fixed on the base plate at intervals; one side of the plastic package body, which is far away from the substrate, is provided with a radiating fin, and the other end of each insulating heat conduction strip is respectively connected with the radiating fin.

In a further technical scheme, all the insulating heat conducting strips are arranged side by side or staggered with each other.

In a further technical scheme, five or more than five insulating heat conduction strips are arranged inside the plastic package body, each insulating heat conduction strip extends along the length direction of the plastic package body, an assembly hole is formed between every two adjacent insulating heat conduction strips, and the size of the assembly hole is 0.2 mm-0.5 mm.

In a further technical scheme, the insulating heat conducting strip comprises a heat conducting silica gel strip or a ceramic heat conductor.

In a further technical scheme, a first heat conduction layer is arranged on the upper surface of the triode chip, a second heat conduction layer is arranged on the lower surface of the triode chip, and the first heat conduction layer and the second heat conduction layer respectively comprise fiber heat conduction sheets with the same or different thicknesses.

In a further technical scheme, a sealing silica gel ring is arranged between each plastic package body and the radiating fin.

In a further technical scheme, the triode chip is connected with each insulating heat conduction strip through a heat conduction adhesive.

In a further technical scheme, heat dissipation hole structures are respectively arranged on two sides of the substrate.

In a further technical scheme, the outer end part of each pin is respectively provided with a bayonet.

After adopting the structure, compared with the prior art, the utility model has the advantages that: according to the utility model, the internal heat conduction structure consisting of two or more than two insulation heat conduction strips is arranged in the plastic package body, and the heat dissipation efficiency of the triode chip is improved by utilizing the characteristic of high-efficiency and rapid heat conduction and the excellent performance of the heat conduction structure, so that excessive accumulation of heat is avoided, and the service life and the heat dissipation performance of the triode are improved; the performance of the three-machine tube is further improved through the heat dissipation layer structures respectively arranged on the upper surface and the lower surface of the triode core.

Drawings

The utility model is further illustrated with reference to the following figures and examples.

Fig. 1 is a schematic structural view of the present invention.

Fig. 2 is a schematic cross-sectional view of the present invention.

In the figure:

the heat dissipation structure comprises a plastic package body 1, an insulating heat conduction strip 2, a heat dissipation sheet 3, a triode chip 4, a first heat conduction layer 41, a second heat conduction layer 42, a substrate 5, a heat dissipation hole structure 51, pins 6 and a bayonet 61.

Detailed Description

The following are merely preferred embodiments of the present invention, and do not limit the scope of the present invention.

The utility model provides a take triode of high heat radiation structure, as shown in fig. 1 and fig. 2, including the plastic-sealed body 1, locate the triode chip 4 of the 1 inside of plastic-sealed body and set up in the base plate 5 of the 1 one side of plastic-sealed body, 5 intervals of base plate are fixed with three pin 6, its characterized in that: two or more than two insulation heat conduction strips 2 are arranged inside the plastic package body 1, the end parts of the insulation heat conduction strips 2 are respectively connected with a substrate 5, a triode chip 4 is respectively connected with the insulation heat conduction strips 2, and the triode chip 4 is electrically connected with the substrate 5; one side of the plastic package body 1, which is far away from the substrate 5, is provided with a heat sink 3, and the other ends of the insulating and heat conducting strips 2 are respectively connected to the heat sink 3. Through the inside heat conduction structure that the inside setting at plastic-sealed body 1 comprises two or more than two insulating heat conduction strips 2, utilize the excellent performance of its high-efficient quick heat conduction's characteristic and heat conduction structure, improve triode chip 4's radiating efficiency, avoid the heat to excessively pile up, improve the life and the heat dispersion of triode.

Specifically, the insulating and heat conducting strips 2 are arranged side by side or staggered with each other.

Preferably, five or more than five insulation heat conduction strips 2 are arranged inside the plastic package body 1, each insulation heat conduction strip 2 extends along the length direction of the plastic package body 1, an assembly hole is formed between every two adjacent insulation heat conduction strips 2, and the size of the assembly hole is 0.2 mm-0.5 mm.

Specifically, the insulating heat-conducting strip 2 includes a heat-conducting silicone strip or a ceramic heat conductor.

Specifically, the upper surface of the triode chip 4 is provided with a first heat conduction layer 41, the lower surface is provided with a second heat conduction layer 42, and the first heat conduction layer 41 and the second heat conduction layer 42 respectively comprise a fiber heat conduction sheet with the same or different thickness. Further improve the radiating efficiency of triode.

Specifically, a silicone sealing ring 31 is disposed between each plastic package 1 and the heat sink 3. The sealing effect is achieved by the silicone sealing ring 31, but sealing materials such as heat sealing glue can also be adopted.

Specifically, the triode chip 4 is connected with each insulating heat conduction strip 2 through heat conduction viscose glue.

Specifically, the two sides of the substrate 5 are respectively provided with heat dissipation hole structures 51.

Specifically, the outer end of each pin 6 is provided with a bayonet 61.

The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.

Claims (9)

1. The utility model provides a take triode of high heat radiation structure, includes plastic-sealed body (1), locates inside triode chip (4) of plastic-sealed body (1) and sets up in base plate (5) of plastic-sealed body (1) one side, and base plate (5) interval is fixed with three pin (6), its characterized in that: two or more than two insulation heat conduction strips (2) are arranged in the plastic package body (1), the end parts of the insulation heat conduction strips (2) are respectively connected with the substrate (5), the triode chips (4) are respectively connected with the insulation heat conduction strips (2), and the triode chips (4) are electrically connected with the substrate (5); one side of the plastic package body (1) far away from the substrate (5) is provided with a radiating fin (3), and the other end of each insulating heat conduction strip (2) is respectively connected with the radiating fin (3).

2. The triode with high heat dissipation structure of claim 1, wherein: the insulating heat conduction strips (2) are arranged side by side or staggered with each other.

3. The triode with high heat dissipation structure of claim 2, wherein: the plastic package body (1) is internally provided with five or more than five insulation heat conduction strips (2), each insulation heat conduction strip (2) extends along the length direction of the plastic package body (1), an assembly hole is formed between every two adjacent insulation heat conduction strips (2), and the size of the assembly hole is 0.2-0.5 mm.

4. The triode with high heat dissipation structure of claim 3, wherein: the insulating heat conduction strip (2) comprises a heat conduction silicon rubber strip or a ceramic heat conductor.

5. The triode with high heat dissipation structure of claim 4, wherein: the upper surface of the triode chip (4) is provided with a first heat conduction layer (41), the lower surface of the triode chip is provided with a second heat conduction layer (42), and the first heat conduction layer (41) and the second heat conduction layer (42) respectively comprise fiber heat conduction sheets with the same or different thicknesses.

6. The triode with high heat dissipation structure of claim 1, wherein: and a sealing silica gel ring (31) is arranged between each plastic package body (1) and the radiating fin (3).

7. The triode with high heat dissipation structure of claim 1, wherein: the triode chip (4) is connected with each insulating heat conduction strip (2) through heat conduction viscose glue.

8. The triode with high heat dissipation structure of claim 1, wherein: and heat dissipation hole structures (51) are respectively arranged on two sides of the substrate (5).

9. The triode with high heat dissipation structure of claim 1, wherein: the outer end of each pin (6) is provided with a bayonet (61) respectively.

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