CN209607756U - Based on the high voltage LED chip encapsulating structure connected in multi-chip - Google Patents

Abstract

The utility model relates to LED encapsulation technology fields, and it discloses based on the high voltage LED chip encapsulating structure connected in multi-chip, including substrate, the inside of the substrate offers circulating slot, the top fixation of the circulating slot is communicated with connectivity slot, is connected at the top of the top of the connectivity slot and substrate, insulation thermal transfer plate is fixedly installed at the top of the substrate, it is fixedly welded with solder at the top of the insulation thermal transfer plate, is fixedly welded with chip at the top of the solder.This is based on the high voltage LED chip encapsulating structure connected in multi-chip, by the way that refrigerating fluid is added in circulating slot the temperature of substrate is reduced, so that the heat of chip is rapidly performed by by insulation thermal transfer plate conducts the temperature rapid decrease so that chip, it ensure that the service life of LED chip, heat is transmitted by insulation thermal transfer plate, and chip and the liquid in circulating slot insulate, it prevents from causing between chip and liquid that short circuit occurs between all chips.

Description

Based on the high voltage LED chip encapsulating structure connected in multi-chip

Technical field

The utility model relates to LED encapsulation technology fields, specially based on the high voltage LED chip encapsulation connected in multi-chip Structure.

Background technique

LED encapsulates the encapsulation for referring to luminescence chip, has relatively big difference compared to integrated antenna package, the encapsulation of LED is to encapsulation Material has special requirement because the encapsulation of LED be not only required to protection wick, but also want can light transmission, in general, The function of encapsulation is to provide chip enough protections, prevent chip in air for a long time exposed or mechanical damage and fail, with Improve the stability of chip；LED is encapsulated, it is also necessary to which there is good light extraction efficiency and good thermal diffusivity, good encapsulation LED can be allowed to have better luminous efficiency and dissipating-heat environment, and then promote the service life of LED.

The encapsulation of LED at present generally be exactly by being packaged between chip and substrate, radiate lean on when chip bottom gold Belong to heat sink to radiate, the difference that such heat dissipation effect compares is even more so for the high voltage LED chip of some multi-chips, institute Guarantee the service life of LED chip in a manner of needing to change its heat dissipation, and encapsulating structure used at present is excessively complicated, Cost is excessively high.

Utility model content

In view of the deficiencies of the prior art, the utility model is provided based on the high voltage LED chip encapsulation connected in multi-chip Structure, has good heat dissipation effect, the simple advantage of structure, and the heat dissipation effect difference and structure for solving traditional encapsulating structure are answered Miscellaneous problem.

The utility model provides the following technical solutions: based on the high voltage LED chip encapsulating structure connected in multi-chip, including Substrate, the inside of the substrate offer circulating slot, and the top fixation of the circulating slot is communicated with connectivity slot, the connectivity slot It is connected at the top of top and substrate, insulation thermal transfer plate, the insulation thermal transfer plate is fixedly installed at the top of the substrate Top be fixedly welded with solder, be fixedly welded with chip at the top of the solder, the side of the insulation thermal transfer plate is fixed It is bonded with moulding compound, the inner surface of the moulding compound is in contact with the outer surface of chip, and the side fixed bonding of the chip has Silica gel, the top coating of the chip have fluorescent powder, are fixedly installed with first lead frame at the top of the substrate, and described first One end of lead frame is fixedly connected with gold thread, and the other end of the gold thread is connected with the side of chip, the top of the substrate Portion is fixedly installed with lens, and the second lead frame, one end of second lead frame are fixedly installed at the top of the substrate Offer clamping groove.

Preferably, the other end of second lead frame is fixedly connected with gold thread identical with first lead frame, institute The other end for stating gold thread is connected with the side of chip.

Preferably, the quantity of the chip is multiple, and first lead frame facet corresponding to another chip is opened Equipped with card slot compatible with the second lead frame.

Preferably, the insulation thermal transfer plate is a kind of glass mat.

It preferably, is series connection between the chip.

Preferably, the type of circulating liquid is distilled water in the circulating slot.

Be compared with the prior art, the utility model have it is following the utility model has the advantages that

1, should be made based on the high voltage LED chip encapsulating structure connected in multi-chip by the way that refrigerating fluid is added in circulating slot The temperature for obtaining substrate reduces, so that the heat of chip is rapidly performed by by insulation thermal transfer plate conducts the temperature so that chip Rapid decrease ensure that the service life of LED chip, be transmitted heat by insulation thermal transfer plate, and by chip with Liquid in circulating slot insulate, and prevents from causing between chip and liquid that short circuit occurs between all chips.

2, should be based on the high voltage LED chip encapsulating structure connected in multi-chip, it can be by the first guide line by clamping groove The transmitting of electric power is carried out between bracket and the second lead frame of another chip and connection effect is preferable, it can not only by lens So that chip interior is sealed, and can increase the penetrability in chip light emitting time, increase the brightness of light source.

Detailed description of the invention

Fig. 1 is the utility model part-structure sectional view；

Fig. 2 is the utility model overall structure diagram.

In figure: 1, substrate；2, connectivity slot；3, lens；4, silica gel；5, fluorescent powder；6, clamping groove；7, the second lead frame； 8, solder；9, chip；10, gold thread；11, moulding compound；12, first lead frame；13, insulate thermal transfer plate；14, circulating slot.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Referring to FIG. 1-2, based on the high voltage LED chip encapsulating structure connected in multi-chip, including substrate 1, substrate 1 it is interior Portion offers circulating slot 14, and the type of circulating liquid is distilled water in circulating slot 14, and the top fixation of circulating slot 14 is communicated with The top of through slot 2, connectivity slot 2 is connected with the top of substrate 1, and the top of substrate 1 is fixedly installed with insulation thermal transfer plate 13, leads to It crosses and refrigerating fluid is added in circulating slot 14 temperature of substrate 1 is reduced, so that the thermal transfer plate 13 that insulate is by the heat of chip 9 Amount, which is rapidly performed by, conducts the temperature rapid decrease so that chip 9, ensure that the service life of LED chip, and insulate thermal transfer plate 13 be a kind of glass mat, and by insulating, thermal transfer plate 13 transmits heat, and will be in chip 9 and circulating slot 14 Liquid insulate, and prevents from causing between chip 9 and liquid that short circuit occurs between all chips 9, and insulate thermal transfer plate 13 Top be fixedly welded with solder 8, the top of solder 8 is fixedly welded with chip 9, and to be connected in series between chip 9, the heat that insulate is passed The side fixed bonding of guide plate 13 has moulding compound 11, and the inner surface of moulding compound 11 is in contact with the outer surface of chip 9, chip 9 Side fixed bonding has silica gel 4, and the top coating of chip 9 has fluorescent powder 5, and the top of substrate 1 is fixedly installed with first lead frame Frame 12, one end of first lead frame 12 are fixedly connected with gold thread 10, and the other end of gold thread 10 is connected with the side of chip 9, The top of substrate 1 is fixedly installed with lens 3, can not only to be sealed inside chip 9 by lens 3, and can increase The penetrability in concrete-cored 9 luminous time increases the brightness of light source, and the top of substrate 1 is fixedly installed with the second lead frame 7, the The other end of two lead frames 7 is fixedly connected with gold thread 10 identical with first lead frame 12, the other end and core of gold thread 10 The side of piece 9 is connected, and one end of the second lead frame 7 offers clamping groove 6, can be by the first guide line by clamping groove 6 The transmitting of electric power is carried out between bracket and the second lead frame 7 of another chip and connection effect is preferable, and the quantity of chip 9 is more A, the side of first lead frame 12 corresponding to another chip 9 offers card slot compatible with the second lead frame 7.

Working principle, the heat that chip 9 generates are transmitted to circulating slot 14 by connectivity slot 2 by insulation thermal transfer plate 13 Inside takes away the liquid inside circulating slot 14 by heat to radiate.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (6)

1. based on the high voltage LED chip encapsulating structure connected in multi-chip, including substrate (1), it is characterised in that: the substrate (1) inside offers circulating slot (14), and the top fixation of the circulating slot (14) is communicated with connectivity slot (2), the connectivity slot (2) it is connected at the top of top and substrate (1), insulation thermal transfer plate (13), institute is fixedly installed at the top of the substrate (1) It states and is fixedly welded with solder (8) at the top of insulation thermal transfer plate (13), be fixedly welded with chip (9) at the top of the solder (8), The side fixed bonding of insulation thermal transfer plate (13) has moulding compound (11), the inner surface and chip of the moulding compound (11) (9) outer surface is in contact, and the side fixed bonding of the chip (9) has silica gel (4), and the top coating of the chip (9) has Fluorescent powder (5) is fixedly installed with first lead frame (12) at the top of the substrate (1), the first lead frame (12) One end is fixedly connected with gold thread (10), and the other end of the gold thread (10) is connected with the side of chip (9), the substrate (1) Top be fixedly installed with lens (3), be fixedly installed with the second lead frame (7) at the top of the substrate (1), described second draws One end of wire frame (7) offers clamping groove (6).

2. according to claim 1 based on the high voltage LED chip encapsulating structure connected in multi-chip, it is characterised in that: institute The other end for stating the second lead frame (7) is fixedly connected with identical gold thread (10), the gold thread with first lead frame (12) (10) the other end is connected with the side of chip (9).

3. according to claim 1 based on the high voltage LED chip encapsulating structure connected in multi-chip, it is characterised in that: institute State chip (9) quantity be it is multiple, the side of first lead frame (12) corresponding to another chip (9) offers and the The compatible card slot of two lead frames (7).

4. according to claim 1 based on the high voltage LED chip encapsulating structure connected in multi-chip, it is characterised in that: institute Stating insulation thermal transfer plate (13) is a kind of glass mat.

5. according to claim 1 based on the high voltage LED chip encapsulating structure connected in multi-chip, it is characterised in that: institute It states between chip (9) as series connection.

6. according to claim 1 based on the high voltage LED chip encapsulating structure connected in multi-chip, it is characterised in that: institute The type for stating circulating slot (14) interior circulating liquid is distilled water.