CN209418498U - A kind of novel patch formula high-power LED light source - Google Patents
A kind of novel patch formula high-power LED light source Download PDFInfo
- Publication number
- CN209418498U CN209418498U CN201920076111.9U CN201920076111U CN209418498U CN 209418498 U CN209418498 U CN 209418498U CN 201920076111 U CN201920076111 U CN 201920076111U CN 209418498 U CN209418498 U CN 209418498U
- Authority
- CN
- China
- Prior art keywords
- light source
- fixedly installed
- bowl
- smd
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of novel patch formula high-power LED light sources, including conductive and heat-conductive copper material substrate, the conductive and heat-conductive copper material substrate upper end is fixedly installed SMD light source bracket pin, PPA plastics fence is fixedly installed on the outside of the SMD light source bracket pin, the upper end surrounding of the PPA plastics fence is fixedly installed bowl, the inside side walls of the bowl are fixedly installed reflecting coating respectively, the upper center of the SMD light source bracket pin is fixedly installed LED blue light chip by fixed elargol, electric connection is realized by being bonded gold thread between the SMD light source bracket pin and LED blue light chip, the upper end of the bowl is fixedly installed yellow fluorescence glue film, fender bracket is fixedly installed on the outside of the upper end of the yellow fluorescence diaphragm.The utility model can be very good to solve the problems, such as that the heat that high-power patch-type light source generates in use causes to encapsulate fluorescence silica gel acutely expand to pull apart and be bonded gold thread, can greatly promote the reliability of high-power patch-type light source.
Description
Technical field
The utility model relates to technical field, specially a kind of novel patch formula high-power LED light source.
Background technique
Adopting surface mounted LED, that is, common SMD light source is a kind of LED point light source that size is light and short, widely applied various
Lighting area, it has also become the important component of general illumination LED light source, traditional SMD white light source have one in light source center
LED blue light chip is bound in functional areas by a rectangular light-emitting function area, using after gold thread bonding LED chip and bracket in bracket function
Energy area coats fluorescent glue, baking-curing molding.But this traditional paster light source encapsulating structure, using coating mixed fluorescent powder silicon
The method encapsulated moulding of glue, and the molecular structure of silica gel has very big gap, and the steam in source outer environment is caused to hold very much
Easily enter light source internal through gel permeation, causes the LED light source moisture absorption moisture absorption, and the usual large scale of powerful paster light source is high
The LED wafer of power encapsulates, and using large driven current density, LED wafer can distribute a large amount of heat while shining, in light source and its
In the case of the packaging silicon rubber moisture absorption moisture absorption, light source, which can be heated, sharply to be expanded, and pulls LED bonding gold thread and gold thread is caused to be broken, the dead lamp of LED
Failure.
Utility model content
The purpose of this utility model is to provide a kind of novel patch formula high-power LED light sources, to solve above-mentioned background skill
The problem of being proposed in art.
To achieve the above object, the utility model provides the following technical solutions: a kind of novel patch formula great power LED light
Source, including conductive and heat-conductive copper material substrate, the conductive and heat-conductive copper material substrate upper end are fixedly installed SMD light source bracket pin, institute
It states and is fixedly installed PPA plastics fence on the outside of SMD light source bracket pin, the upper end surrounding fixation of the PPA plastics fence is set
It is equipped with bowl, the inside side walls of the bowl are fixedly installed reflecting coating respectively, in the upper end of the SMD light source bracket pin
Portion is fixedly installed LED blue light chip by fixed elargol, passes through between the SMD light source bracket pin and LED blue light chip
It is bonded gold thread and realizes electric connection, the upper end of the bowl is fixedly installed yellow fluorescence glue film, the yellow fluorescence diaphragm
Upper end on the outside of be fixedly installed fender bracket, be fixedly installed cooling mechanism on the outside of the conductive and heat-conductive copper material substrate, it is described
Cooling mechanism includes mounting rack, thermally conductive sheet, cooling fin, and the mounting rack is mounted on the outside of bowl, and the thermally conductive sheet is mounted on
The inside shelved is close to the side of bowl, and the cooling fin is mounted on the outside of mounting rack, between the cooling fin and cooling fin
Form several heat dissipation channels, by cooling mechanism to device operation generate heat radiate, and then guarantee device it is long when
Between run.
Preferably, the yellow fluorescence diaphragm work is made by mixing by epoxy glue and yellow fluorescence arogel.
Preferably, the yellow fluorescence glue film is covered to light source bowl upper end and comprehensively by the neat attachment of patch device
Lid light source bowl.
Preferably, the yellow forms the closed hollow structure inside in side by fluorescence diaphragm and bowl, ultimately forms one
A patch type light source that great power LED wafer package may be implemented.
Preferably, the bowl bottom is metallic red copper material, carrying LED blue light chip, conduction and thermally conductive, the bowl
The red metal material of bottom extends to the external pads structure outside light source bracket as light source, and the driving circuit for connecting application end is real
Now it is electrically connected with light source.
Compared with prior art, the utility model has the beneficial effects that
1, the utility model SMD light source changes the method for the encapsulation LED white light of tradition coating yellow fluorescent glue, uses
In the scheme of light source functional areas surface mount yellow fluorescence diaphragm, it can be very good solution high-power patch-type light source and using
The heat generated in journey causes encapsulation fluorescence silica gel acutely to expand the problem of pulling apart bonding gold thread, can greatly be promoted high-power
The reliability of patch type light source, so that there is volume production feasibility using large scale high-capacity LED wafer package patch type light source；
2, the utility model, which changes conventional patch LED light source, can only use the mode of middle low power wafer package, this light
The encapsulation of high power large-sized wafer may be implemented in source, secondly using the epoxies glue production fluorescence diaphragm and close of high-air-tightness
The method being mounted on light source bracket makes light source functional areas form a closed hollow structure, has blocked water in lighting environment
Vapour and other harmful substances penetrate into inside LED light source, solve light source bracket functional areas by external environment steam and nocuousness
Substance erosion leads to the problem of LED light source nigrescence failure.
Detailed description of the invention
Fig. 1 is a kind of novel patch formula high-power LED light source overall structure diagram of the utility model；
Fig. 2 is a kind of novel patch formula high-power LED light source top view of the utility model；
Fig. 3 is the installation view of a kind of novel patch formula high-power LED light source cooling fin of the utility model, mounting rack.
In figure: 1, conductive and heat-conductive copper material substrate；2, SMD light source bracket pin；3, PPA plastics fence；4, bowl；5, reflective
Coating；6, LED blue light is brilliant；7, it is bonded gold thread；8, yellow fluorescence glue film；9, fender bracket；10, cooling mechanism；1001, it installs
Frame；1002, thermally conductive sheet；1003, cooling fin.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of novel patch formula high-power LED light source, packet
Conductive and heat-conductive copper material substrate 1 is included, 1 upper end of conductive and heat-conductive copper material substrate is fixedly installed SMD light source bracket pin 2, described
The outside of SMD light source bracket pin 2 is fixedly installed PPA plastics fence 3, and the upper end surrounding fixation of the PPA plastics fence 3 is set
Be equipped with bowl 4, the inside side walls of the bowl 4 are fixedly installed reflecting coating 5 respectively, the SMD light source bracket pin 2 it is upper
End middle part is fixedly installed LED blue light chip 6 by fixed elargol, the SMD light source bracket pin 2 and LED blue light chip 6 it
Between by bonding gold thread 7 realize be electrically connected, the upper end of the bowl 4 is fixedly installed yellow fluorescence glue film 8, the yellow
It is fixedly installed fender bracket 9 on the outside of the upper end of fluorescent glue diaphragm 8, the outside of the conductive and heat-conductive copper material substrate 1 is fixedly installed
Cooling mechanism 10, the cooling mechanism 10 include mounting rack 1001, thermally conductive sheet 1002, cooling fin 1003, the mounting rack 1001
It is mounted on 4 outside of bowl, the thermally conductive sheet 1002 is mounted on the inside of mounting rack 1001 close to the side of bowl 4, the heat dissipation
Piece 1003 is mounted on the outside of mounting rack 1001, forms several heat dissipation channels between the cooling fin 1003 and cooling fin 1003.
The work of yellow fluorescence glue film 8 is made by mixing by epoxy glue and yellow fluorescence arogel；The yellow fluorescence
To 4 upper end of the light source bowl and comprehensive covering light source bowl 4 by the neat attachment of patch device of glue film 8；The yellow is by glimmering
Light diaphragm and bowl 4 form the closed hollow structure inside in side, and ultimately forming one may be implemented great power LED wafer package
Patch type light source；4 bottom of bowl is metallic red copper material, carrying LED blue light chip, conduction and thermally conductive, the bowl 4
The red metal material of bottom extends to the external pads structure outside light source bracket as light source, and the driving circuit for connecting application end is real
Now it is electrically connected with light source.
Working principle: SMD light source changes the method for the encapsulation LED white light of tradition coating yellow fluorescent glue, using in light
The scheme of source functional areas surface mount yellow fluorescence glue film 8 can be very good solution high-power patch-type light source and use
The heat generated in journey causes encapsulation fluorescence silica gel acutely to expand the problem of pulling apart bonding gold thread 7, can greatly promote big function
The reliability of rate patch type light source, so that there is volume production feasibility using large scale high-capacity LED wafer package patch type light source,
The mode of middle low power wafer package can only be used by changing conventional patch LED light source, and the big ruler of high power may be implemented in this light source
Secondly very little wafer package makes fluorescence diaphragm using the epoxies glue of high-air-tightness and is closely mounted on doing on light source bracket
Method makes light source functional areas form a closed hollow structure, has blocked steam and the infiltration of other harmful substances in lighting environment
Into inside LED light source, solve light source bracket functional areas is caused LED light source to be sent out by external environment steam and harmful substance erosion
The problem of black failure.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of novel patch formula high-power LED light source, including conductive and heat-conductive copper material substrate (1), it is characterised in that: the conduction
Thermally conductive copper material substrate (1) upper end is fixedly installed SMD light source bracket pin (2), the outside of the SMD light source bracket pin (2)
It is fixedly installed PPA plastics fence (3), the upper end surrounding of the PPA plastics fence (3) is fixedly installed bowl (4), the bowl
The inside side walls of cup (4) are fixedly installed reflecting coating (5) respectively, and the upper center of the SMD light source bracket pin (2) passes through
Fixed elargol is fixedly installed LED blue light chip (6), leads between the SMD light source bracket pin (2) and LED blue light chip (6)
It crosses bonding gold thread (7) and realizes electric connection, the upper end of the bowl (4) is fixedly installed yellow fluorescence glue film (8), the Huang
It is fixedly installed fender bracket (9) on the outside of the upper end of color fluorescent glue diaphragm (8), the outside of the conductive and heat-conductive copper material substrate (1) is solid
Surely it is provided with cooling mechanism (10), the cooling mechanism (10) includes mounting rack (1001), thermally conductive sheet (1002), cooling fin
(1003), the mounting rack (1001) is mounted on the outside of bowl (4), and the thermally conductive sheet (1002) is mounted on mounting rack (1001)
Inside is mounted on the outside of mounting rack (1001), the cooling fin close to the side of bowl (4), the cooling fin (1003)
(1003) several heat dissipation channels are formed between cooling fin (1003).
2. a kind of novel patch formula high-power LED light source according to claim 1, it is characterised in that: the yellow fluorescence
Glue film (8) work is made by mixing by epoxy glue and yellow fluorescence arogel.
3. a kind of novel patch formula high-power LED light source according to claim 1, it is characterised in that: the yellow fluorescence
Glue film (8) is by the neat attachment of patch device to light source bowl (4) upper end and covering light source bowl (4) comprehensively.
4. a kind of novel patch formula high-power LED light source according to claim 1, it is characterised in that: the yellow is by glimmering
Light diaphragm and bowl (4) form the closed hollow structure inside in side.
5. a kind of novel patch formula high-power LED light source according to claim 1, it is characterised in that: bowl (4) bottom
Portion is metallic red copper material, and carrying LED blue light chip, conduction and thermally conductive, the red metal material of bowl (4) bottom extends to light
External pads structure of the source bracket outer as light source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920076111.9U CN209418498U (en) | 2019-01-17 | 2019-01-17 | A kind of novel patch formula high-power LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920076111.9U CN209418498U (en) | 2019-01-17 | 2019-01-17 | A kind of novel patch formula high-power LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209418498U true CN209418498U (en) | 2019-09-20 |
Family
ID=67943991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920076111.9U Active CN209418498U (en) | 2019-01-17 | 2019-01-17 | A kind of novel patch formula high-power LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209418498U (en) |
-
2019
- 2019-01-17 CN CN201920076111.9U patent/CN209418498U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201363572Y (en) | LED light source module | |
| CN104247061B (en) | Ceramic based light-emitting diode (LED) device, component and method | |
| KR101251821B1 (en) | Light emitting device package | |
| CN101749553B (en) | Packaging module of low-power light emitting diode (LED) luminescent chip | |
| CN204611579U (en) | Light-emitting device and Vehicular illumination device | |
| CN102610599B (en) | Light emitting device packaging piece and manufacture method thereof | |
| KR20070033801A (en) | Light emitting diode package and manufacturing method thereof | |
| TW200926445A (en) | Fabricating method of photoelectric device and packaging structure thereof | |
| TW200923262A (en) | High heat dissipation optic module for light emitting diode and its manufacturing method | |
| CN107665940A (en) | Light-emitting device and its manufacture method | |
| US20120043886A1 (en) | Integrated Heat Conductive Light Emitting Diode (LED) White Light Source Module | |
| CN101696790A (en) | High-power LED heat-dissipation packaging structure | |
| CN103500787A (en) | Ceramic COB (Chip-on-Board) packaged LED (light-emitting diode) light source with bottom capable of being directly soldered on heat sink | |
| CN211045465U (en) | High-power flip L ED packaging structure | |
| CN106972092B (en) | A kind of quantum spot white light LED of high-luminous-efficiency and preparation method thereof | |
| CN108091752A (en) | A kind of white light LEDs and preparation method thereof | |
| CN100342558C (en) | Ceramic package light-emitting diode an dits package method | |
| KR100634305B1 (en) | Light emitting diode and method for manufacturing the same | |
| CN206361437U (en) | LED filament and LEDbulb lamp | |
| TW201210093A (en) | LED package structure for increasing heat-dissipating efficiency and method of making the same | |
| CN103151445B (en) | Low thermal resistance LED (Light Emitting Diode) packaging structure and packaging method | |
| CN207353289U (en) | A kind of LED encapsulation structure and automobile dimming-distance lighting system for improving light efficiency | |
| CN104143600B (en) | One kind sealing LED lamp and preparation method thereof | |
| CN107123727B (en) | A kind of quantum spot white light LED of low operating temperature and preparation method thereof | |
| CN209418498U (en) | A kind of novel patch formula high-power LED light source |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |