CN209232779U - 一种新型的两片式sma产品的400型框架 - Google Patents
一种新型的两片式sma产品的400型框架 Download PDFInfo
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- CN209232779U CN209232779U CN201920059799.XU CN201920059799U CN209232779U CN 209232779 U CN209232779 U CN 209232779U CN 201920059799 U CN201920059799 U CN 201920059799U CN 209232779 U CN209232779 U CN 209232779U
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- sma
- frame
- lower frame
- upper frame
- novel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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Abstract
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Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920059799.XU CN209232779U (zh) | 2019-01-15 | 2019-01-15 | 一种新型的两片式sma产品的400型框架 |
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CN201920059799.XU CN209232779U (zh) | 2019-01-15 | 2019-01-15 | 一种新型的两片式sma产品的400型框架 |
Publications (1)
Publication Number | Publication Date |
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CN209232779U true CN209232779U (zh) | 2019-08-09 |
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CN201920059799.XU Active CN209232779U (zh) | 2019-01-15 | 2019-01-15 | 一种新型的两片式sma产品的400型框架 |
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CN (1) | CN209232779U (zh) |
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2019
- 2019-01-15 CN CN201920059799.XU patent/CN209232779U/zh active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A new type of 400 frame for two piece SMA products Effective date of registration: 20201225 Granted publication date: 20190809 Pledgee: Jining Yanzhou sub branch of laishang Bank Co.,Ltd. Pledgor: SHANDONG XINNUO ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2020980009985 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220505 Granted publication date: 20190809 Pledgee: Jining Yanzhou sub branch of laishang Bank Co.,Ltd. Pledgor: SHANDONG XINNUO ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2020980009985 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: 400 frame of a new two-piece SMA product Effective date of registration: 20221230 Granted publication date: 20190809 Pledgee: Jining Yanzhou sub branch of laishang Bank Co.,Ltd. Pledgor: SHANDONG XINNUO ELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2022980029423 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |