CN208922003U - Full-automatic COG binds machine - Google Patents
Full-automatic COG binds machine Download PDFInfo
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- CN208922003U CN208922003U CN201821806119.8U CN201821806119U CN208922003U CN 208922003 U CN208922003 U CN 208922003U CN 201821806119 U CN201821806119 U CN 201821806119U CN 208922003 U CN208922003 U CN 208922003U
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Abstract
The utility model provides a kind of full-automatic COG binding machine comprising pedestal platform, feeding platform, cleaning device, ACF adhering device, prepressing device, this pressure device, outfeed platforms and scheduling institution；Wherein, cleaning device includes cleaning platform, power roll assembly and the cleaning strap being wound on power roll assembly, cleaning platform drives rotation to clean the glass substrate on cleaning platform for receiving the glass substrate from feeding platform, cleaning strap by power roller.The full-automatic COG binding machine of the utility model passes through setting cleaning device, cleaning strap on cleaning device is by sliding on two cleaning collets, two sides so as to the connecting pin to glass substrate is efficiently cleaned, and each glass substrate is cleaned by one section of completely new cleaning strap, guarantee the finish of glass substrate, scrub effect is good, so that IC chip has preferable Nian Jie binding effect with glass substrate.
Description
Technical field
The utility model relates to display screen manufacturing equipment field, in particular to a kind of full-automatic COG binds machine.
Background technique
COG is the abbreviation of chip on glass, i.e. chip is directly bound on glass, small size liquid crystal display at present
Product uses COG mode to drive liquid crystal display panel substantially, by original IC chip (Integrated Circuit,
Integrated circuit board) circuit drives mode become IC chip binding on the glass substrate, specially formed on bare chip convex
After point, directly it is connected on the glass substrate with the lead of liquid crystal display；Wherein, COG bound device in the prior art is deposited
Scrub process is being carried out to glass substrate due to not handled or being reused wiper block to the miscellaneous dirt on glass substrate, so that
Glass substrate what the processing of miscellaneous dirt it is not in place, and then cause IC chip adhesive effect poor, the binding of IC chip is of poor quality, it is subsequent easily
The problem of damage.
Therefore need to provide a kind of full-automatic COG binding machine to solve above-mentioned technical problem.
Utility model content
The utility model provides a kind of full-automatic COG binding machine, the cleaning by the way that cleaning device is arranged, on cleaning device
Strap is efficient clear so as to the two sides progress of the connecting pin to glass substrate by sliding on two cleaning collets
It washes, guarantees the finish of glass substrate, exist to solve COG bound device in the prior art due to not on glass substrate
Miscellaneous dirt handled or reused wiper block to glass substrate carry out scrub process so that glass substrate what miscellaneous dirt processing not
In place, and then cause IC chip adhesive effect poor, the binding of IC chip is of poor quality, subsequent problem easy to damage.
In order to solve the above technical problems, the technical solution of the utility model are as follows: a kind of full-automatic COG binding machine comprising:
Pedestal platform, including the rack being vertically provided at the top of the pedestal platform；
One end of the pedestal platform is arranged in, for inputting glass substrate in feeding platform；
Cleaning device is arranged on the pedestal platform, including cleaning platform, power roll assembly and is wound on the power roller
Cleaning strap on component, the cleaning platform is for receiving the glass substrate from the feeding platform, the cleaning strap
Rotation is driven to clean the glass substrate on the cleaning platform by the power roller；
ACF adhering device is arranged in the rack, for ACF conductive adhesive film to be overlayed to the glass substrate to cleaning
On；
Prepressing device is arranged in the rack, for IC chip to be pressed in the ACF conductive adhesive film of glass substrate in advance；
This pressure device is arranged in the rack, for carrying out pressing, this pressure device phase to the IC chip on glass substrate
It is that there is different pressing temperature and different pressing time compared with prepressing device；
Outfeed platforms, are arranged in the other end of the pedestal platform, the glass substrate for having IC chip for exporting pressing；
Scheduling institution, it is the feeding platform, the cleaning device, the ACF adhering device, the prepressing device, described
This pressure device and the outfeed platforms are successively arranged in a word, and the scheduling institution is used for glass substrate is flat in the charging
Between platform, the cleaning device, the ACF adhering device, the prepressing device, described pressure device and the outfeed platforms
It is transported.
In the present invention, the power roll assembly includes emptying roller, material receiving roller, multiple guide rollers and two cleanings
Collet, two cleaning collets are located at the two sides of glass substrate one end, the cleaning strap from the emptying roller blowing,
The cleaning strap is slided through the guiding of the guide roller wound on the cleaning collet, and the cleaning strap is by the material receiving roller
It is furled, slides glass base of the cleaning strap on two cleaning collets to two between the cleaning collet
Plate is cleaned.
Further, the cleaning device further includes the support frame being fixed on the pedestal platform, the emptying roller,
The material receiving roller and multiple guide rollers are rotatably arranged on support frame as described above, one or two described cleaning collet sliding
It is arranged on support frame as described above, two cleaning collet opposite directions are close to clean to glass substrate in clamping, backwards to separate pine
The clamping to glass substrate is opened to clean.
Wherein, the direction of motion of the cleaning strap on two cleaning collets in glass substrate one side is consistent, fortune
Dynamic direction is mobile to the direction far from glass substrate.
In addition, the cleaning device further includes alcohol container and the quantitative pump housing, perforation is provided on the cleaning collet
Hole, the cleaning strap are applied in the through hole, are additionally provided with and are connected in the through hole on the cleaning collet
Delivery outlet, the alcohol container be connected to by hose with the quantitative pump housing, it is described quantify the pump housing by hose with it is described defeated
Portal connection.
In the present invention, the full-automatic COG binding machine further includes plasma blower, and the plasma blower is located at
Top between the cleaning device and the ACF adhering device and positioned at glass substrate, the plasma blower are ion wind
Machine, the plasma blower are to be become by being allowed to ionization to the enough energy of gas application as plasmoid.
In the present invention, it is provided in the end side of the feeding platform transporting direction for correction unit, it is described
Correction unit carries out the glass substrate on the feeding platform by mobile to squeeze contact positioning；
The first ccd sensor is provided between the feeding platform and cleaning device, first ccd sensor is located at
The lower section of the motion track of the glass substrate of first manipulator crawl, the first manipulator grab the glass base on the feeding platform
Plate simultaneously carries out mobile contraposition according to glass substrate of the photographing signals of first ccd sensor to crawl；
The second ccd sensor, the 2nd CCD are provided between the plasma blower and the ACF adhering device
Sensor is located at the lower section of the motion track of the glass substrate of the second manipulator crawl, and the second manipulator grabs the cleaning platform
On glass substrate and mobile contraposition is carried out according to glass substrate of the photographing signals of second ccd sensor to crawl.
In the present invention, the cleaning platform is slidably arranged on the pedestal platform；
The ACF adhering device include the first supporting table for receiving the glass substrate from the cleaning platform and
For attaching the press mold component of ACF conductive adhesive film, first support on the glass substrate above first supporting table
Platform is slidably arranged on the pedestal platform；
The prepressing device includes the second supporting table and position for receiving the glass substrate for being pasted with ACF conductive adhesive film
The preload component on ACF conductive adhesive film above second supporting table for IC chip to be pressed in glass substrate in advance, it is described
Second supporting table is slidably arranged on the pedestal platform；
Described pressure device includes third supporting table for receiving the pre- glass substrate for being pressed with IC chip and is located at institute
It states above third supporting table for carrying out this pressure component of pressing, the third supporting table sliding to the IC chip on glass substrate
It is arranged on the pedestal platform；
The power roll assembly, the press mold component, the preload component and described pressure component are arranged side by side, described
Cleaning platform, first supporting table, the glide direction of second supporting table and the third supporting table are consistent.
Further, the scheduling institution includes the first manipulator, the second manipulator, third manipulator, the 4th manipulator
And the 5th manipulator, first manipulator is for transporting the glass substrate on the feeding platform to the cleaning platform
On, second manipulator is used to transport the glass substrate on the cleaning platform to first supporting table, and described the
Three manipulators are for transporting the glass substrate in first supporting table to second supporting table, the 4th manipulator
For transporting the glass substrate in second supporting table to the third supporting table, the 5th manipulator is used for institute
It states the glass substrate in third supporting table to transport to the outfeed platforms, first manipulator, second manipulator, institute
Third manipulator, the 4th manipulator and the 5th manipulator is stated to be slidably arranged on same track.
In the present invention, the full-automatic COG binding machine include the cleaning device set gradually side by side,
One ACF adhering device, a prepressing device and three described pressure devices.
The utility model compared to the prior art, passes through it has the advantage that: the full-automatic COG of the utility model binds machine
Cleaning device is set, and the cleaning strap on cleaning device is by sliding on two cleaning collets, so as to glass base
The two sides of the connecting pin of plate is efficiently cleaned, and is wiped by one section of completely new cleaning strap each glass substrate
It washes, guarantees the finish of glass substrate, scrub effect is good, so that IC chip has preferable Nian Jie binding with glass substrate
Effect.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below in embodiment
Required attached drawing is briefly described, and the accompanying drawings in the following description is only that the section Example of the utility model is corresponding
Attached drawing.
Fig. 1 is the structure of block diagram schematic diagram that the full-automatic COG of the utility model binds the preferred embodiment of machine.
Fig. 2 is that the full-automatic COG of the utility model binds the schematic perspective view of machine.
Fig. 3 is the structural schematic diagram that the full-automatic COG of the utility model binds another visual angle of machine.
Fig. 4 is the structural schematic diagram that the full-automatic COG of the utility model binds the cleaning device of machine.
Fig. 5 is the partial enlarged view in Fig. 4 at G.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those skilled in the art are obtained without making creative work
The every other embodiment obtained, fall within the protection scope of the utility model.
COG bound device in the prior art exists since the miscellaneous dirt on glass substrate is not handled or being reused
Wiper block carries out scrub process to glass substrate so that glass substrate what the processing of miscellaneous dirt it is not in place, and then cause IC chip viscous
Connect that effect is poor, the binding of IC chip is of poor quality, subsequent problem easy to damage.
It the following is a kind of preferred reality of full-automatic COG binding machine that can solve the above technical problem provided by the utility model
Apply example.
Fig. 1, Fig. 2 and Fig. 3 are please referred to, wherein Fig. 1 is that the full-automatic COG of the utility model binds the preferred embodiment of machine
Structure of block diagram schematic diagram, Fig. 2 are that the full-automatic COG of the utility model binds the schematic perspective view of machine, and Fig. 3 is that this is practical new
The structural schematic diagram at another visual angle of the full-automatic COG binding machine of type.
The similar unit of structure is to be given the same reference numerals in the figure.
The preferred embodiment of full-automatic COG binding machine provided by the utility model are as follows: a kind of full-automatic COG binding machine,
It is flat including pedestal platform 11, feeding platform 12, cleaning device 13, ACF adhering device 15, prepressing device 16, this pressure device 17, discharging
Platform 18 and scheduling institution, feeding platform 12, cleaning device 13, ACF adhering device 15, prepressing device 16, this pressure device 17 with
And outfeed platforms 18 are successively arranged in a word；
Full-automatic COG binding machine in the present embodiment includes 13, the ACF patches of a cleaning device set gradually side by side
15, prepressing devices 16 of adsorption device and three this pressure devices 17, since the time for originally pressing through journey is longer, and cleaning process,
ACF attaches process and the time of pre-compaction process is then shorter, and setting in this way can make the working efficiency of machine higher.
In the present embodiment, pedestal platform 11 includes the rack 111 for being vertically provided at 11 top of pedestal platform, and rack 111 is not only
Can be used for being arranged ACF adhering device 15, prepressing device 16 and this pressure device 17, can be also used for being arranged electrical control unit and
The objects such as display；
One end of pedestal platform 11 is arranged in feeding platform 12, for inputting glass substrate；
Cleaning device 13 is arranged on pedestal platform 11, including cleaning platform 131, power roll assembly and is wound on power roller group
Cleaning strap 26 on part, cleaning platform 131 clean strap 26 by power for receiving the glass substrate from feeding platform 12
Roller strap turn is dynamic to clean the glass substrate on cleaning platform 131；
ACF adhering device 15 is arranged in rack 111, for ACF conductive adhesive film to be overlayed to the glass substrate to cleaning
On；
Prepressing device 16 is arranged in rack 111, for IC chip to be pressed in the ACF conductive adhesive film of glass substrate in advance；
This pressure device 17 is arranged in rack 111, for carrying out pressing to the IC chip on glass substrate；
The other end of pedestal platform 11 is arranged in outfeed platforms 18, the glass substrate for having IC chip for exporting pressing, wherein
Precompressed needs to draw IC chip and then carries out pressing, and the effect of direct pressing is poor, therefore is divided into precompressed and this pressure pressing twice, and
Main pressing is carried out by this pressure device, can obtain best pressing effect；
Scheduling institution is used for glass substrate in feeding platform 12, cleaning device 13, ACF adhering device 15, prepressing device
16, it is transported between this pressure device 17 and outfeed platforms 18；
In addition, being additionally provided with IC charging tray 191, transfer platform 19 and switchover mechanical hand 192 in the side of prepressing device 16.
Specifically, cleaning platform 131 is slidably arranged on pedestal platform 11；
ACF adhering device 15 include the first supporting table 151 for receiving the glass substrate from cleaning platform 131 and
For attaching the press mold component of ACF conductive adhesive film, the first supporting table 151 on the glass substrate above the first supporting table 151
It is slidably arranged on pedestal platform 11；
Prepressing device 16 include the second supporting table 161 for receiving the glass substrate for being pasted with ACF conductive adhesive film and
The preload component on ACF conductive adhesive film above the second supporting table 161 for IC chip to be pressed in glass substrate in advance, second
Supporting table 161 is slidably arranged on pedestal platform 11；
This pressure device 17 includes third supporting table 171 for receiving the pre- glass substrate for being pressed with IC chip and is located at the
For carrying out this pressure component of pressing to the IC chip on glass substrate above three supporting tables 171, the sliding of third supporting table 171 is set
It sets on pedestal platform 11；
Power roll assembly, press mold component, preload component and this pressure component are arranged side by side, and cleaning platform 131, first supports
The glide direction of platform 151, the second supporting table 161 and third supporting table 171 is consistent.
Scheduling institution includes the first manipulator 1B, the second manipulator 1C, third manipulator 1D, the 4th manipulator 1E and the
Five manipulator 1F, the first manipulator 1B are for transporting the glass substrate on feeding platform 12 to cleaning platform 131, the second machine
Tool hand 1C is used to transport the glass substrate on cleaning platform 131 to the first supporting table 151, and third manipulator 1D is used for the
Glass substrate in one supporting table 151 is transported to the second supporting table 161, and the 4th manipulator 1E is used for the second supporting table 161
On glass substrate transport to third supporting table 171, the 5th manipulator 1F is used for the glass substrate in third supporting table 171
Transport is on outfeed platforms 18, the first manipulator 1B, the second manipulator 1C, third manipulator 1D, the 4th manipulator 1E and the
Five manipulator 1F are slidably arranged on same track.
Glass substrate is entered by the feeding platform 12 of one end, and transports tune between corresponding each platform by each manipulator
Degree, each platform then pass through sliding and are moved to the every processing of progress below corresponding device, finally transported by manipulator to discharging
It is exported on platform 18；
Wherein, switchover mechanical hand 192 grabs the IC chip on IC charging tray 191 one by one and transport is placed into transfer platform 19
On, transfer platform 19 carries the lower section that IC chip is moved to prepressing device 16, by prepressing device 16 preloading block to IC chip into
Row is drawn, and then transfer platform 19 is retracted, and the second supporting table 161 carries the lower section that glass substrate is moved to prepressing device 16, in advance
The IC chip of absorption is depressed on glass substrate by the preloading block of pressure device 16 in advance.
Referring to figure 4. and Fig. 5, wherein Fig. 4 is that the full-automatic COG of the utility model binds the structure of the cleaning device of machine and shows
It is intended to, Fig. 5 is the partial enlarged view in Fig. 4 at G.
Power roll assembly in the present embodiment includes emptying roller 23, material receiving roller 25, multiple guide rollers 24 and two cleanings
Collet 28, two cleaning collets 28 are located at the two sides of glass substrate one end, and cleaning strap 26 is cleaned from 23 blowing of emptying roller
Wound on cleaning collet 28, cleaning strap 26 is furled by material receiving roller 25, is slided for guiding sliding of the strap 26 through guide roller 24
The glass substrate that the cleaning strap 26 cleaned on collet 28 wound on two cleans between collet 28 two is cleaned.
Wherein, cleaning device 13 further includes the support frame 27 being fixed on pedestal platform 11, emptying roller 23, material receiving roller 25
And multiple guide rollers 24 are rotatably arranged on support frame 27, one or two settable cleaning collet 28 passes through corresponding connection
Part 281 is slidably arranged on support frame 27, and connector 281 is driven by cylinder 29 and slided, because visual angle stops only to show one in figure
The sliding trace of connector 281, two cleaning collets 28 is coaxial, and two cleaning collets 28 are by opposite close sliding to glass
Substrate is cleaned in clamping, by cleaning backwards to far from sliding release to the clamping of glass substrate.
Preferably, the direction of motion of the cleaning strap 26 on two cleaning collets 28 in glass substrate one side is consistent,
The direction of motion is mobile to the direction far from glass substrate, enables cleaning strap 26 preferably by the miscellaneous dust lane on glass substrate
It walks, and is not easy to remain on glass substrate.
In addition, cleaning device 13 further includes 22 body of alcohol container 21 and constant displacement pump, perforation is provided on cleaning collet 28
Hole 283, cleaning strap 26 be applied in through hole 283, cleaning collet 28 on be additionally provided be connected to it is defeated in through hole 283
Portalling 282, alcohol container 21 is connected to by hose with 22 body of constant displacement pump, and 22 body of constant displacement pump passes through hose and is connected to delivery outlet 282,
The cleaning for enabling cleaning strap 26 to carry out more preferable effect to glass substrate after alcohol is sprayed on cleaning strap 26.
Full-automatic COG binding machine in this preferred embodiment further includes plasma blower 14, and plasma blower 14 is located at clear
Top between cleaning device 13 and ACF adhering device 15 and positioned at glass substrate, plasma blower 14 are ion blower 14, drying
While glass substrate after cleaning, glass substrate can be carried out to destatic processing, plasma blower 14 is by applying gas
Add enough energy to be allowed to ionization to become as plasmoid.
In the present embodiment, it is provided in the end side of 12 transporting direction of feeding platform for correction unit 121, correction unit
121 by mobile squeeze contact positioning to the glass substrate on feeding platform 12, primary position of correction unit 121 can be into
The index point of one step made on glass substrate is in the taking pictures in range of the first ccd sensor 1A1；
Meanwhile first ccd sensor 1A1 be arranged between feeding platform 12 and cleaning device 13, the first ccd sensor
1A1 is located at the lower section of the motion track of the glass substrate of the first manipulator 1B crawl, and the first manipulator 1B grabs feeding platform 12
On glass substrate and mobile contraposition is carried out according to glass substrate of the photographing signals of the first ccd sensor 1A1 to crawl, it is secondary
Positioning can guarantee that the attaching of the ACF on glass substrate is more accurate；
The second ccd sensor 1A, the second ccd sensor are provided between plasma blower 14 and ACF adhering device 15
1A is located at the lower section of the motion track of the glass substrate of the second manipulator 1C crawl, and the second manipulator 1C grabs cleaning platform 131
On glass substrate and mobile contraposition is carried out according to glass substrate of the photographing signals of the second ccd sensor 1A to crawl, second
The setting of ccd sensor 1A makes it possible to position glass substrate three times, can prevent glass substrate from existing by plasma blower
14 blow askew, will affect subsequent pre- press operation and the accuracy of this press operation.
The position of first ccd sensor 1A1 and the second ccd sensor 1A in Fig. 2, which is blocked, to be not shown, and position can join
According to Fig. 1.
It should be noted that the vertical direction (being set as Y-direction) in the orientation along Fig. 1 of correction unit 121 carries out glass substrate
Positioning correcting, therefore the first manipulator 1B crawl glass substrate is substantially carried out orientation in Fig. 1 after the first ccd sensor 1A1 takes pictures
Horizontal direction (being set as X-direction) positioning correcting, therefore the first manipulator 1B only needs to meet and has X-direction and Z-direction (vertical
The direction of Fig. 1 plane) movement.
The movement of the settable X-direction of second manipulator 1C, Y-direction and Z-direction to glass substrate carries out mobile transport
And correction positioning.
The movement of X-direction and Z-direction can be only arranged in third manipulator 1D, the 4th manipulator 1E and the 5th manipulator 1F
To carry out mobile transport to glass substrate.
Working principle of the utility model is: glass substrate is inputted by feeding platform 12, glass substrate first passes through correction
The extruding positioning correcting in portion 121, then transported by the first manipulator 1B crawl to cleaning platform 131, the first machine during crawl
Tool hand 1B carries out mobile contraposition to the glass substrate of crawl according to the photographing signals of the first ccd sensor 1A1, places again after contraposition
Onto cleaning platform 131；
Cleaning platform 131 carries the lower section that glass substrate is moved to cleaning device 13, and glass substrate needs to connect IC core
One end of piece is located between two cleaning collets 28, herein can by inductor being arranged by sensing glass substrate, so as to
Cleaning collet 28 is controlled by cylinder 29 and clamps glass substrate, while passing through operating and the constant displacement pump of emptying roller 23 and material receiving roller 25
22 control alcohol injection, enable cleaning collet 28 on be stained with spirituous cleaning strap 26 to glass substrate carry out efficiently it is clear
It washes；
After the completion of cleaning, two cleaning collets 28 unclamp the clamping to glass substrate, and cleaning platform 131 is retracted, the second machine
Glass substrate on tool hand 1C crawl cleaning platform 131 is transported to the first supporting table 151, the second manipulator 1C during crawl
Mobile contraposition is carried out according to glass substrate of the photographing signals of the second ccd sensor 1A to crawl, is placed into first after contraposition again
In supporting table 151；
First supporting table 151 carries glass substrate and is moved to the lower section of ACF adhering device by ACF adhering device for ACF glue
Film pushing is pasted on glass substrate, and then the first supporting table 151 is retracted, and third manipulator 1D grabs the glass substrate of pad pasting
To the second supporting table 161；
On the other hand, switchover mechanical hand 192 grabs the IC chip on IC charging tray 191 and transport is placed into transfer platform 19
On, transfer platform 19 carries the lower section that IC chip is moved to prepressing device 16, by prepressing device 16 preloading block to IC chip into
Row is drawn, and then transfer platform 19 is retracted；
Later, the second supporting table 161 carries the lower section that glass substrate is moved to prepressing device 16, and being pushed by preloading block will inhale
The IC chip taken is depressed on glass substrate in advance, and then the second supporting table 161 is retracted, and the 4th manipulator 1E will be pressed with IC chip in advance
Glass substrate is grabbed to third supporting table 171, and third supporting table 171 is moved to the lower section of this pressure device, by this pressure device pair
IC chip keeps the pressing of set temperature and setting time, and then third supporting table 171 is retracted, and the 5th manipulator 1F has pressing
The glass substrate of IC chip is grabbed to being exported on outfeed platforms.
The binding procedure of the full-automatic COG binding machine of this preferred embodiment is completed in this way.
Cleaning cloth band logical of the full-automatic COG binding machine of this preferred embodiment by the way that cleaning device is arranged, on cleaning device
Sliding is crossed on two cleaning collets, the two sides so as to the connecting pin to glass substrate is efficiently cleaned, and right
Each glass substrate is cleaned by one section of completely new cleaning strap, guarantees the finish of glass substrate, and scrub effect is good, into
And make IC chip that there is preferable Nian Jie binding effect with glass substrate.
Although above preferred embodiment is not used in conclusion the utility model is disclosed above with preferred embodiment
To limit the utility model, those skilled in the art can make without departing from the spirit and scope of the utility model
It is various to change and retouch, therefore the protection scope of the utility model subjects to the scope of the claims.
Claims (10)
1. a kind of full-automatic COG binds machine characterized by comprising
Pedestal platform, including the rack being vertically provided at the top of the pedestal platform；
One end of the pedestal platform is arranged in, for inputting glass substrate in feeding platform；
Cleaning device is arranged on the pedestal platform, including cleaning platform, power roll assembly and is wound on the power roll assembly
On cleaning strap, the cleaning platform is for receiving the glass substrate from the feeding platform, and the cleaning strap is by institute
Stating power roller drives rotation to clean the glass substrate on the cleaning platform；
ACF adhering device is arranged in the rack, for ACF conductive adhesive film to be overlayed to the glass substrate to cleaning；
Prepressing device is arranged in the rack, for IC chip to be pressed in the ACF conductive adhesive film of glass substrate in advance；
This pressure device is arranged in the rack, for carrying out pressing to the IC chip on glass substrate；
Outfeed platforms, are arranged in the other end of the pedestal platform, the glass substrate for having IC chip for exporting pressing；
Scheduling institution, the feeding platform, the cleaning device, the ACF adhering device, the prepressing device, described pressure
Device and the outfeed platforms are successively arranged in a word, the scheduling institution be used for by glass substrate the feeding platform,
Between the cleaning device, the ACF adhering device, the prepressing device, described pressure device and the outfeed platforms into
Row transport.
2. full-automatic COG according to claim 1 binds machine, which is characterized in that the power roll assembly include emptying roller,
Material receiving roller, multiple guide rollers and two cleaning collets, two cleaning collets are located at the two sides of glass substrate one end,
The cleaning strap is slided through the guiding of the guide roller wound on the cleaning from the emptying roller blowing, the cleaning strap
Collet, the cleaning strap are furled by the material receiving roller, slide the cleaning strap on two cleaning collets
Glass substrate between two cleaning collets is cleaned.
3. full-automatic COG according to claim 2 binds machine, which is characterized in that the cleaning device further includes that fixation is set
The support frame on the pedestal platform is set, the emptying roller, the material receiving roller and multiple guide rollers are rotatably arranged on institute
It states on support frame, one or two described cleaning collet is slidably arranged on support frame as described above, and two cleaning collets are opposite
Close to be cleaned to glass substrate in clamping, cleaned backwards to far from the clamping unclamped to glass substrate.
4. full-automatic COG according to claim 2 binds machine, which is characterized in that close to glass on two cleaning collets
The direction of motion of cleaning strap in glass substrate side is consistent, and the direction of motion is mobile to the direction far from glass substrate.
5. full-automatic COG according to claim 2 binds machine, which is characterized in that the cleaning device further includes that alcohol holds
Device and the quantitative pump housing are provided with through hole on the cleaning collet, and the cleaning strap is applied in the through hole, in institute
State and be additionally provided with the delivery outlet being connected in the through hole on cleaning collet, the alcohol container by hose with it is described quantitative
Pump housing connection, the quantitative pump housing are connected to by hose with the delivery outlet.
6. full-automatic COG according to claim 1 binds machine, which is characterized in that the full-automatic COG binds machine and further includes
Plasma blower, the plasma blower is between the cleaning device and the ACF adhering device and is located at glass substrate
Top, the plasma blower be ion blower.
7. full-automatic COG according to claim 6 binds machine, which is characterized in that in the feeding platform transporting direction
End side is provided with for correction unit, and the correction unit is by mobile to squeeze to the glass substrate on the feeding platform
Press contacts positioning；
The first ccd sensor is provided between the feeding platform and cleaning device, first ccd sensor is located at first
The lower section of the motion track of the glass substrate of manipulator crawl, the first manipulator grab the glass substrate on the feeding platform simultaneously
Mobile contraposition is carried out according to glass substrate of the photographing signals of first ccd sensor to crawl；
The second ccd sensor, the 2nd CCD sensing are provided between the plasma blower and the ACF adhering device
Device is located at the lower section of the motion track of the glass substrate of the second manipulator crawl, and the second manipulator grabs on the cleaning platform
Glass substrate simultaneously carries out mobile contraposition according to glass substrate of the photographing signals of second ccd sensor to crawl.
8. full-automatic COG according to claim 1 binds machine, which is characterized in that the cleaning platform is slidably arranged in institute
It states on pedestal platform；
The ACF adhering device includes the first supporting table for receiving the glass substrate from the cleaning platform and is located at
For attaching the press mold component of ACF conductive adhesive film on the glass substrate above first supporting table, first supporting table is sliding
It is dynamic to be arranged on the pedestal platform；
The prepressing device includes the second supporting table for receiving the glass substrate for being pasted with ACF conductive adhesive film and is located at institute
State the preload component above the second supporting table for being pressed in IC chip in advance on the ACF conductive adhesive film of glass substrate, described second
Supporting table is slidably arranged on the pedestal platform；
Described pressure device includes third supporting table for receiving the pre- glass substrate for being pressed with IC chip and is located at described the
For carrying out this pressure component of pressing, the third supporting table sliding setting to the IC chip on glass substrate above three supporting tables
On the pedestal platform；
The power roll assembly, the press mold component, the preload component and described pressure component are arranged side by side, the cleaning
Platform, first supporting table, the glide direction of second supporting table and the third supporting table are consistent.
9. full-automatic COG according to claim 8 binds machine, which is characterized in that the scheduling institution includes first mechanical
Hand, the second manipulator, third manipulator, the 4th manipulator and the 5th manipulator, first manipulator be used for will it is described into
Glass substrate on material platform is transported to the cleaning platform, and second manipulator is used for the glass on the cleaning platform
On glass substrate transport to first supporting table, the third manipulator is used to transport the glass substrate in first supporting table
It transports in second supporting table, the 4th manipulator is for transporting the glass substrate in second supporting table to described
In third supporting table, the 5th manipulator is for transporting the glass substrate in the third supporting table to the outfeed platforms
On, first manipulator, second manipulator, the third manipulator, the 4th manipulator and the 5th machine
The dynamic setting of tool rubber sleeve is on the same track.
10. full-automatic COG according to claim 1 binds machine, which is characterized in that the full-automatic COG binds machine and includes
A cleaning device, an ACF adhering device, a prepressing device and three institutes set gradually side by side
State this pressure device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201821806119.8U CN208922003U (en) | 2018-11-03 | 2018-11-03 | Full-automatic COG binds machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201821806119.8U CN208922003U (en) | 2018-11-03 | 2018-11-03 | Full-automatic COG binds machine |
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| CN208922003U true CN208922003U (en) | 2019-05-31 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110493975A (en) * | 2019-08-02 | 2019-11-22 | 深圳市华亚信科技有限公司 | A kind of outer pin binding fully-automatic production device |
| CN111025693A (en) * | 2019-11-25 | 2020-04-17 | 深圳鼎晶科技有限公司 | COF integrated circuit packaging cleaning line body |
| CN111605283A (en) * | 2020-06-24 | 2020-09-01 | 深圳市鑫三力自动化设备有限公司 | Machine is bound in wearing of dysmorphism curved surface duplex position |
| CN114033779A (en) * | 2021-11-11 | 2022-02-11 | 深圳市凯达扬自动化有限公司 | Integrated machine for back glue and frame glue |
-
2018
- 2018-11-03 CN CN201821806119.8U patent/CN208922003U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110493975A (en) * | 2019-08-02 | 2019-11-22 | 深圳市华亚信科技有限公司 | A kind of outer pin binding fully-automatic production device |
| CN111025693A (en) * | 2019-11-25 | 2020-04-17 | 深圳鼎晶科技有限公司 | COF integrated circuit packaging cleaning line body |
| CN111025693B (en) * | 2019-11-25 | 2022-05-10 | 深圳鼎晶科技有限公司 | COF integrated circuit packaging cleaning line body |
| CN111605283A (en) * | 2020-06-24 | 2020-09-01 | 深圳市鑫三力自动化设备有限公司 | Machine is bound in wearing of dysmorphism curved surface duplex position |
| CN111605283B (en) * | 2020-06-24 | 2023-07-18 | 深圳市鑫三力自动化设备有限公司 | Wearing binding machine of dysmorphism curved surface duplex position |
| CN114033779A (en) * | 2021-11-11 | 2022-02-11 | 深圳市凯达扬自动化有限公司 | Integrated machine for back glue and frame glue |
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