CN208655660U - A kind of bipod patch type blood oxygen transducer receiving device - Google Patents
A kind of bipod patch type blood oxygen transducer receiving device Download PDFInfo
- Publication number
- CN208655660U CN208655660U CN201821460660.8U CN201821460660U CN208655660U CN 208655660 U CN208655660 U CN 208655660U CN 201821460660 U CN201821460660 U CN 201821460660U CN 208655660 U CN208655660 U CN 208655660U
- Authority
- CN
- China
- Prior art keywords
- golden circuit
- plating golden
- receiving device
- plating
- blood oxygen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The utility model discloses a kind of bipod patch type blood oxygen transducer receiving device, including pcb board, the first plating golden circuit and the second plating golden circuit are provided on the pcb board, PD, which is provided with, on the first plating golden circuit receives tube chip, the second plating golden circuit is arranged in PD and receives the side of tube chip and be connected by gold thread, the bottom of the pcb board is provided with gold-plated double welding legs, it includes symmetrically arranged third plating golden circuit and the 4th plating golden circuit, the side of the pcb board offers semicircular first conductive hole for extending through the first plating golden circuit and third plating golden circuit and the second plating golden circuit and the 4th plating golden circuit, second conductive hole.The utility model is easy to produce, at low cost, high production efficiency, has the characteristics that anti-oxidant, high temperature resistant, good appearance, small in size, and solving that existing infrared diode receiving device sensitive volume is wide, anti-interference and problem that filter clutter ability is weak enhances its anti-interference and filter clutter ability.
Description
Technical field
The utility model relates to medical instruments fields, and in particular to a kind of bipod patch type blood oxygen transducer receiving device.
Background technique
Infrared receiver device is the semiconductor devices that infrared ray signal is become to electric signal, its core component is one
The PN junction of a special material is compared with general-purpose diode, big change is taken in structure, infrared receiver tube is in order to more
It is greater area of to receive into electric current then increases with it.
Blood oxygen diode reception pipe is widely used in BOLD contrast at present.
Defects in the prior art:
1, existing infrared diode receiving device is transparent epoxy resin glue, the received wide 400-1100nm of wave-length coverage；
2, existing bipod patch type infrared diode receiving device is anti-interference and filter clutter ability is weak；
3, the silicon wafer of existing bipod patch type infrared diode receiving device induction 7030-1000nm is at high cost.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide it is a kind of small in size, it is easy to produce, it is at low cost,
High production efficiency, and enhance anti-interference and filter clutter ability bipod patch type blood oxygen transducer receiving device.
The technical solution of the utility model is as follows:
It is gold-plated to be provided with first on the pcb board for a kind of bipod patch type blood oxygen transducer receiving device, including pcb board
Route and second plates golden circuit, and PD is provided on the first plating golden circuit and receives tube chip, the second plating golden circuit setting
The side of tube chip is received in the PD and is connected by gold thread, the bottom of the pcb board is provided with gold-plated double welding legs,
Golden circuit and the 4th plating golden circuit are plated including symmetrically arranged third, the side of the pcb board, which offers, extends through described the
Semicircular first conductive hole of one plating golden circuit and third plating golden circuit and the second plating golden circuit and the 4th plating golden circuit,
Second conductive hole.
Wherein, the pcb board uses BT substrate.
Wherein, the first plating golden circuit, the second plating golden circuit, PD receive tube chip and use black epoxy rubber moulding pressure
Formula encapsulation.
Wherein, the range of receiving that the PD receives tube chip is controlled in 730-1000nm or more.
Wherein, the shape of the bipod patch type blood oxygen transducer receiving device is the rectangle of 6*5*1.1mm.
Compared with the existing technology, the utility model has the beneficial effects that:
For the utility model using BT substrate as carrier, " BT " is a kind of resin of Mitsubishi gas chemical company production
Commodity chemical name, it is by bismaleimide (Bismaleimide, BMI) and cyanate (cyanate ester, CE) resin
Made from synthesis, BT resin base copper-clad plate (abbreviation BT plate) is because having very high high glass transition temperature (Tg), outstanding dielectricity
The performances such as energy, low thermal expansion rate, good mechanical characteristics can make it in currently gradually popular high density interconnection (HDI) multilayer
It is widely used in printed board and base plate for packaging, relative to ceramic substrate, is easily molded, easily cuts, not easily broken, cost
It is low, easy customized, easy typesetting；
2, the utility model is wide in order to solve existing infrared diode receiving device sensitive volume, anti-interference and filter clutter energy
The weak problem of power is encapsulated using black epoxy glue, and range of receiving is controlled in 730-1000nm or more, is no longer received visible
Light, anti-interference and filter clutter ability enhancing；
3, it is encapsulated using press moulding mode, every mould is allowed to put 4 planks, every plate has 200 blood oxygen transducer receivers
Part, a mould clamp time 7 seconds can be 800 with output, and the production process of molding simplifies life relative to direct insertion production process
Process is produced, production efficiency is greatly improved；
4, the bipod patch type blood oxygen transducer receiving device small volume, a batch is big, can effectively reduce life
Produce cost.
Detailed description of the invention
Fig. 1 is the top view of the utility model；
Fig. 2 is the lower view of the utility model；
Fig. 3 is the side view of the utility model；
Fig. 4 is the circuit diagram of the utility model.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Fig. 1~4 are please referred to, the present embodiment provides a kind of bipod patch type blood oxygen transducer receiving device, including pcb board 1,
It is provided with the first plating golden circuit 2 and the second plating golden circuit 3 on pcb board 1, is provided with PD on the first plating golden circuit 2 and receives tube chip
4, the second plating golden circuit 3 is arranged in PD and receives the side of tube chip 4 and be connected by gold thread, and the bottom of pcb board 1 is provided with gold-plated
Double welding legs comprising symmetrically arranged third plating golden circuit 51 and the 4th plating golden circuit 52, the side of pcb board 1 offers
Extend through the semicircle of the first plating golden circuit 2 with third plating golden circuit 51 and the second plating golden circuit 3 and the 4th plating golden circuit 52
The first conductive hole 6, the second conductive hole 7.
In the present embodiment, the pcb board 1 uses BT substrate.It relative to ceramic substrate, is easily molded, easily cuts, it is non-friable
It splits, at low cost, easy customized, easy typesetting.The first plating golden circuit 2 and the second plating gold thread are formed using electroplating gold mode on BT substrate
Road 3, it is not oxidizable.
The first plating golden circuit 2, second plates golden circuit 3, PD is received tube chip 4 and is molded using black epoxy glue 8
Formula encapsulation.Good, intact to be combined with BT substrate, the high temperature resistant of pressing property, it is not easy to break.By encapsulating material by transparent epoxy
Resin glue is changed to black epoxy 8, so that the range of receiving that PD receives tube chip 4 is controlled in 730-1000nm or more, no longer
Receive visible light, anti-interference and filter clutter ability enhancing.
The bipod patch type blood oxygen transducer receiving device is gold-plated by the PD reception plating golden circuit 2, second of tube chip 4, first
Route 3, BT upper surface of base plate pad by mould pressing process be encapsulated in one it is intracavitary, bottom there are two metal welding foot, outside
Shape is the rectangle of 6*5*1.1mm, with diode-transducer perfect matching.
It is encapsulated as diode-transducer using press moulding mode, and every mould is allowed to put 4 planks, and every plate has 200
A blood oxygen transducer receiving device, a mould clamp time 7 seconds can be 800 with output, and the production process of molding is relative to straight cutting
Formula production process simplifies production procedure, greatly improves production efficiency.
Due to the bipod patch type blood oxygen transducer receiving device small volume, a batch is big, can effectively reduce
Production cost.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (5)
1. a kind of bipod patch type blood oxygen transducer receiving device, it is characterised in that: including pcb board, be provided on the pcb board
First plating golden circuit and second plates golden circuit, is provided with PD on the first plating golden circuit and receives tube chip, described second is gold-plated
Route is arranged in the PD and receives the side of tube chip and be connected by gold thread, and the bottom of the pcb board is provided with gold-plated double welderings
Leg structure comprising symmetrically arranged third plating golden circuit and the 4th plating golden circuit, the side of the pcb board offers to be passed through respectively
It wears the first plating golden circuit and third plating golden circuit and the second plating golden circuit and plates semicircular the of golden circuit with the 4th
One conductive hole, the second conductive hole.
2. a kind of bipod patch type blood oxygen transducer receiving device according to claim 1, it is characterised in that: the PCB
Plate uses BT substrate.
3. a kind of bipod patch type blood oxygen transducer receiving device according to claim 1, it is characterised in that: described first
Golden circuit, the second plating golden circuit, PD is plated to receive tube chip and encapsulate using black epoxy rubber moulding pressure type.
4. a kind of bipod patch type blood oxygen transducer receiving device according to claim 1, it is characterised in that: the PD connects
The range of receiving of closed tube chip is controlled in 730-1000nm or more.
5. a kind of bipod patch type blood oxygen transducer receiving device according to claim 1, it is characterised in that: two hem facing
The shape of chip blood oxygen transducer receiving device is the rectangle of 6*5*1.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821460660.8U CN208655660U (en) | 2018-09-07 | 2018-09-07 | A kind of bipod patch type blood oxygen transducer receiving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821460660.8U CN208655660U (en) | 2018-09-07 | 2018-09-07 | A kind of bipod patch type blood oxygen transducer receiving device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208655660U true CN208655660U (en) | 2019-03-26 |
Family
ID=65792262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821460660.8U Active CN208655660U (en) | 2018-09-07 | 2018-09-07 | A kind of bipod patch type blood oxygen transducer receiving device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208655660U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111653557A (en) * | 2020-06-11 | 2020-09-11 | 广西永裕半导体科技有限公司 | Paster type infrared receiving sensor |
| CN114760765A (en) * | 2022-06-16 | 2022-07-15 | 深圳市惠利电子科技有限公司 | Dry-type circuit board chemical etching equipment |
-
2018
- 2018-09-07 CN CN201821460660.8U patent/CN208655660U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111653557A (en) * | 2020-06-11 | 2020-09-11 | 广西永裕半导体科技有限公司 | Paster type infrared receiving sensor |
| CN114760765A (en) * | 2022-06-16 | 2022-07-15 | 深圳市惠利电子科技有限公司 | Dry-type circuit board chemical etching equipment |
| CN114760765B (en) * | 2022-06-16 | 2022-09-02 | 深圳市惠利电子科技有限公司 | Dry-type circuit board chemical etching equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100590779C (en) | Surface mount multi-channel optocoupler | |
| US7183588B2 (en) | Light emission device | |
| CN208655660U (en) | A kind of bipod patch type blood oxygen transducer receiving device | |
| TWI528508B (en) | Method for manufacturing ceramic package structure of high power light emitting diode | |
| TW201032319A (en) | Semiconductor optoelectronic device and quad flat non-leaded optoelectronic device | |
| CN108461615B (en) | Patch type diode | |
| US8748209B2 (en) | Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same | |
| CN106058031B (en) | A kind of integrated form high power ultraviolet LED heat sink | |
| CN214123875U (en) | Infrared receiving head | |
| CN212848471U (en) | Small-angle light-emitting device | |
| CN208548349U (en) | Heart rate sensor | |
| CN208939002U (en) | A kind of electrodeless blood oxygen saturated diode sensor of bipod patch type | |
| CN207353288U (en) | A kind of paster LED bracket | |
| CN208835057U (en) | A kind of LED light | |
| CN201884982U (en) | Novel LED (light-emitting diode) light source module encapsulation structure | |
| CN111969089A (en) | Small-angle light-emitting device and manufacturing method thereof | |
| US20110018018A1 (en) | Semiconductor chip package structure for achieving electrical connection without using wire-bonding process and method for making the same | |
| CN208400834U (en) | A kind of chip diode | |
| CN215988830U (en) | High-temperature-resistant light-emitting diode | |
| CN201407516Y (en) | Light emitting diode reflect ring and combined structure with base plate thereof | |
| CN201298549Y (en) | A package structure of an LED constant current driving integrated circuit | |
| CN207602618U (en) | EMC enclosure support structures, EMC package supports monomer and LED based on ceramic substrate | |
| CN201623133U (en) | Packaging structure of printed circuit board with flip chip and rectangular radiating block with locking hole | |
| CN205428998U (en) | Chip level LED packaging hardware | |
| CN206379370U (en) | UV chip lead rack modules |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |