CN202042518U - LED (Light Emitting Diode) package structure - Google Patents
LED (Light Emitting Diode) package structure Download PDFInfo
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- CN202042518U CN202042518U CN2011201242762U CN201120124276U CN202042518U CN 202042518 U CN202042518 U CN 202042518U CN 2011201242762 U CN2011201242762 U CN 2011201242762U CN 201120124276 U CN201120124276 U CN 201120124276U CN 202042518 U CN202042518 U CN 202042518U
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- led
- encapsulating structure
- optical lens
- base plate
- led encapsulating
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Abstract
The embodiment of the utility model relates to an LED (Light Emitting Diode) package structure, which comprises an LED package bracket unit and an LED chip, wherein the LED package bracket unit comprises a single-chip metal bottom plate and a single-chip insulating seat which is formed on the single-chip metal bottom plate; and an optical lens covers the LED chip. The light emitting angle of the LED package structure can be adjusted through the optical lens covering the LED chip, and the light emitting surface of the LED package structure can be expanded, so that the display quality and the watching effect of lookers are improved.
Description
Technical field
The utility model relates to the LED field, relates in particular to a kind of LED encapsulating structure.
Background technology
Light-emitting diode (Light Emitting Diode, LED) be a kind of solid-state semiconductor device that electric energy can be converted into visible light, it is widely used in fields such as display screen, traffic signal, display light source, lamps for vehicle, LED-backlit source, lighting source.
The inventor finds that there is following technical problem at least in prior art in implementing the utility model process:
Because the LED encapsulating structure generally adopts the encapsulating structure of LED package support monomer and led chip, its lighting angle is less like this, has influenced its display effect, causes beholder's viewing effect to descend.
The utility model content
The utility model embodiment technical problem to be solved is, a kind of LED encapsulating structure is provided, and to improve display quality, improves beholder's viewing effect.
For solving the problems of the technologies described above, a kind of LED encapsulating structure is provided, comprise LED package support monomer and be arranged at led chip on the described LED package support monomer, described LED package support monomer comprises the unitary piece of metal base plate, and take shape in monolithic insulating base on the described unitary piece of metal base plate, be covered with optical lens on the described led chip.
Further, described optical lens is a silica-gel lens.
Further, cave in to described led chip direction in described optical lens top.
Further, described optical lens is a hemisphere or cylindrical.
Further, described monolithic insulating base adopts thermosets.
Further, described thermosets is epoxy resin, silica gel or silicones.
Further, described unitary piece of metal base plate is silver-plated or gold-plated high heat-conducting copper base plate or alloyed copper base plate.
Further, described led chip links to each other with pin on the described LED package support monomer by gold thread.
Further, also be coated with fluorescent glue on the described LED encapsulating structure.
Technique scheme has following beneficial effect at least:
By a kind of LED encapsulating structure is provided, it comprises LED package support monomer and led chip, LED package support monomer comprises the unitary piece of metal base plate, and the monolithic insulating base on moulding and the unitary piece of metal base plate, be covered with optical lens on the led chip, can adjust the rising angle of LED encapsulating structure, enlarge its light-emitting area by the optical lens that is covered with on the led chip, thereby improved display quality, improved beholder's viewing effect.
Description of drawings
Fig. 1 is the stereogram of the LED encapsulating structure of the utility model embodiment.
Fig. 2 is the front view of the LED encapsulating structure of the utility model embodiment.
Fig. 3 is the schematic diagram that the LED encapsulating structure of the utility model embodiment does not contain optical lens 6.
Embodiment
As shown in Figure 1 to Figure 3, the LED encapsulating structure of the utility model embodiment includes LED package support monomer 1 and is arranged at led chip 2 on the LED package support monomer 1, what know easily is, form corresponding circuit structure on the LED package support monomer 1, and led chip 2 can be connected with the circuit structure respective pins by gold thread 3, and also be coated with fluorescent glue on the LED encapsulating structure, LED package support monomer 1 mainly comprises unitary piece of metal base plate 4, and take shape in monolithic insulating base 5 on the unitary piece of metal base plate 4, and monolithic insulating base 5 adopts thermosets, be generally the purpose that reaches the indeformable even embrittlement of 350 degree high temperature, thermosets can be selected epoxy resin for use, silica gel or silicones etc.And unitary piece of metal base plate 4 can be silver-plated or gold-plated high heat-conducting copper base plate, alloyed copper base plate or other high-thermal conductive metal base plates, thereby guarantees LED encapsulating structure radiating effect in use.On led chip 2, be covered with optical lens 6, it can adopt other transparent materials such as silica gel, thus optical lens 6 can the rising angle of LED encapsulating structure be adjusted, enlarge its light-emitting area, thereby improved display quality, improved beholder's viewing effect.
As a kind of execution mode, the top of optical lens 6 is to led chip 2 directions depressions, evenly bright dipping, thereby it is more even that the whole LED product is shown, further height display quality, further improved beholder's viewing effect.
As a kind of execution mode, optical lens 6 can be hemisphere or cylindrical, all can reach above-mentioned technique effect.
The above is an embodiment of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also are considered as protection range of the present utility model.
Claims (9)
1. LED encapsulating structure, comprise LED package support monomer and be arranged at led chip on the described LED package support monomer, it is characterized in that, described LED package support monomer comprises the unitary piece of metal base plate, and take shape in monolithic insulating base on the described unitary piece of metal base plate, be covered with optical lens on the described led chip.
2. LED encapsulating structure as claimed in claim 1 is characterized in that, described optical lens is a silica-gel lens.
3. LED encapsulating structure as claimed in claim 1 is characterized in that, caves in to described led chip direction in described optical lens top.
4. LED encapsulating structure as claimed in claim 1 is characterized in that, described optical lens is a hemisphere or cylindrical.
5. LED encapsulating structure as claimed in claim 1 is characterized in that, described monolithic insulating base adopts thermosets.
6. LED encapsulating structure as claimed in claim 5 is characterized in that, described thermosets is epoxy resin, silica gel or silicones.
7. LED encapsulating structure as claimed in claim 1 is characterized in that, described unitary piece of metal base plate is silver-plated or gold-plated high heat-conducting copper base plate or alloyed copper base plate.
8. LED encapsulating structure as claimed in claim 1 is characterized in that, described led chip links to each other with pin on the described LED package support monomer by gold thread.
9. as each described LED encapsulating structure in the claim 1 to 7, it is characterized in that, also be coated with fluorescent glue on the described LED encapsulating structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201242762U CN202042518U (en) | 2011-04-25 | 2011-04-25 | LED (Light Emitting Diode) package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201242762U CN202042518U (en) | 2011-04-25 | 2011-04-25 | LED (Light Emitting Diode) package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202042518U true CN202042518U (en) | 2011-11-16 |
Family
ID=44969951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201242762U Expired - Lifetime CN202042518U (en) | 2011-04-25 | 2011-04-25 | LED (Light Emitting Diode) package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202042518U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104482473A (en) * | 2014-11-19 | 2015-04-01 | 奇瑞汽车股份有限公司 | LED (light-emitting diode) light source of automotive headlamp |
-
2011
- 2011-04-25 CN CN2011201242762U patent/CN202042518U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104482473A (en) * | 2014-11-19 | 2015-04-01 | 奇瑞汽车股份有限公司 | LED (light-emitting diode) light source of automotive headlamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171024 Address after: The Town Lake Anxi County of Quanzhou City, Fujian province 362411 Photoelectric Industrial Park Patentee after: FUJIAN LIGHTNING OPTOELECTRONIC CO., LTD. Address before: Nanshan District Xili Town, Shenzhen city Guangdong province 518000 new village Shiling Industrial District eight building 5 floor Patentee before: Lighting Optoectronic(SZ) Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111116 |