CN208548349U - Heart rate sensor - Google Patents
Heart rate sensor Download PDFInfo
- Publication number
- CN208548349U CN208548349U CN201821293700.4U CN201821293700U CN208548349U CN 208548349 U CN208548349 U CN 208548349U CN 201821293700 U CN201821293700 U CN 201821293700U CN 208548349 U CN208548349 U CN 208548349U
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- CN
- China
- Prior art keywords
- heart rate
- rate sensor
- semiconductor chip
- signal processing
- photodiode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012545 processing Methods 0.000 claims abstract description 34
- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 14
- 241000218202 Coptis Species 0.000 claims abstract description 10
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 10
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 claims description 10
- 238000001746 injection moulding Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 8
- 230000002950 deficient Effects 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 201000010099 disease Diseases 0.000 description 4
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000005622 photoelectricity Effects 0.000 description 3
- 239000003814 drug Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 208000024172 Cardiovascular disease Diseases 0.000 description 1
- 206010020772 Hypertension Diseases 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000001684 chronic effect Effects 0.000 description 1
- 208000029078 coronary artery disease Diseases 0.000 description 1
- 230000037213 diet Effects 0.000 description 1
- 235000005911 diet Nutrition 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Abstract
The utility model discloses a kind of heart rate sensors, belong to technical field of electronic products, including substrate and fixed shell on the substrate, it is successively arranged photodiode from top to bottom in the shell, semiconductor chip and signal processing chip, the bottom of the semiconductor chip position opposite with the signal processing chip is equipped with groove, the signal processing chip is arranged in the cavity that the semiconductor chip and the substrate are formed, the design avoids gold thread in encapsulation process and is collapsed or breaks, reduce the fraction defective of encapsulation, it avoids repeatedly going up core, glue film, which is not needed, in the design simultaneously carrys out adhesive means, reduce process complexity, working efficiency can be effectively improved.
Description
Technical field
The utility model belongs to technical field of electronic equipment, and in particular to a kind of heart rate sensor.
Background technique
Due to life style, unreasonable, part the cardiovascular disease such as hypertension, coronary heart disease of diet structure in modern society
Etc. the common disease and frequently-occurring disease being increasingly becoming on clinical medicine, these diseases more belong to chronic burst disease, can only control mostly and
It can not cure, need patient that hospital is periodically gone to check and take drugs, but still not be avoided that the generation of emergency situations, institute in this way
To need the changes in heart rate of real-time monitoring patient, to find the problem in time.And with the improvement of living standards, more and more
The common people begin through science movement to keep fit, for guarantee amount of exercise reasonability and movement effect, use the heart
The exercise program that rate equipment monitoring heart rate is suitble to rational.
The wearable product of current wrist accurately measures heart rate signal such as smartwatch or Intelligent bracelet to reach, the heart
Rate sensor mostly uses large-sized photodiode 5 (as shown in Fig. 1), for by signal processing chip 3 and photodiode 5
It is packaged together, since 3 size of signal processing chip is small, places gasket 8 in the side of signal processing chip 3 to increase plane meter
It is very little, so that the sum of area of signal processing chip 3 and gasket 8 is close or larger than the size of photodiode 5, is convenient for subsequent placement light
Electric diode 5, but this method needs repeatedly upper core, and glue film 9 is arranged to bond other on signal processing chip 3 and gasket 8
The gold thread 7 that device and protection signal processing chip 3 are electrically connected, but glue film technique is not easy to control, easily occur gold thread collapse line, broken string and
Glue film deformation etc. is bad.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of heart rate sensors, can reduce process complexity, keep away
Exempt from occur collapsing line, broken string in encapsulation process, reduces the fraction defective of encapsulation.
In order to solve the above technical problems, the technical solution of the utility model is:
Heart rate sensor is successively set in the shell from top to bottom including substrate and fixed shell on the substrate
There are photodiode, semiconductor chip and signal processing chip, the bottom of the semiconductor chip is opposite with the signal processing chip
Position be equipped with groove, the signal processing chip is arranged in the cavity that the semiconductor chip and the substrate are formed.
Further, the inner surface of the recess sidewall is inclined-plane.
Further, the photodiode, the semiconductor chip and the signal processing chip pass through respectively gold thread with
The substrate electrical connection.
Further, conductive glue, two pole of photoelectricity are coated between the semiconductor chip and the photodiode
Pipe is electrically connected by the conductive glue with the semiconductor chip.
Further, the semiconductor chip is back gold silicon piece.
Further, light transmitting sheet is equipped with above the photodiode.
Further, the shell is by Shooting Technique machine-shaping.
Further, the light transmitting sheet is glass transmission piece.
Further, the light transmitting sheet is injection molding light transmitting sheet.
Further, the shell is structure as a whole with the light transmitting sheet.
After above-mentioned technical proposal, the beneficial effects of the utility model are:
Due to the heart rate sensor of the utility model, including substrate and the shell being fixed on substrate, in shell on to
Under be successively arranged photodiode, semiconductor chip and signal processing chip, the bottom of semiconductor chip is opposite with signal processing chip
Position be equipped with groove, signal processing chip is arranged in the cavity that semiconductor chip and substrate are formed, and semiconductor chip can be to signal
The case where processing chip plays a protective role, and prevents the line that collapses, broken string, reduces the fraction defective of encapsulation, and do not need more
Secondary upper core and use glue film technique, reduce the complexity of technique, effectively improve working efficiency.
Detailed description of the invention
Fig. 1 is the schematic cross-sectional view of sensing heart rate in the prior art；
Fig. 2 is the schematic cross-sectional view of the first embodiment of the utility model heart rate sensor；
Fig. 3 is the schematic cross-sectional view of second of embodiment of the utility model heart rate sensor；
In figure, 1- substrate, 2- shell, 3- signal processing chip, 4- back gold silicon piece, 5- photodiode, 6- light transmitting sheet, 7-
Gold thread, 8- gasket, 9- glue film, 10- conductive glue.
Specific embodiment
The present invention will be further described with reference to the accompanying drawings and examples.
The orientation being related in this specification is subject to shown in attached drawing, and relative positional relationship is only represented, and is not represented absolutely
Positional relationship.
Embodiment one:
As Fig. 2 and Fig. 3 jointly shown in, heart rate sensor, including substrate 1 and fixed toroidal shell 2 on substrate 1, base
Plate 1 is pcb board, is successively arranged photodiode 5, semiconductor chip and signal processing chip 3 from top to bottom in shell 2.Photoelectricity two
The optical signal received is converted into electric signal by pole pipe 5, be transferred to signal processing chip 3, and signal processing chip 3 will receive
Electric signal is handled and is transferred to MCU and display equipment (being not drawn into attached drawing), and user is facilitated to check.Signal processing chip 3,
Semiconductor chip and photodiode 5 are electrically connected by gold thread 7 with substrate 1 respectively, and wherein the anode of photodiode 5 is connected with gold
The cathode of line 7, photodiode 5 is electrically connected by semiconductor chip with substrate 1.Semiconductor chip can be by doping boron or the silicon wafer of phosphorus
Circle is made, and preferred semiconductor piece is back gold silicon piece 4 in present embodiment.The setting for carrying on the back gold silicon piece 4 can be effectively by two pole of photoelectricity
The cathode of pipe 5 is drawn, and guarantees the normal work of heart rate sensor.
As Fig. 2 and Fig. 3 jointly shown in, carry on the back the bottom position opposite with signal processing chip 3 of gold silicon piece 4 equipped with groove,
Signal processing chip 3 is arranged in the cavity that back gold silicon piece 4 and substrate 1 are formed, and signal processing chip 3 is fixed on substrate 1.Back
Gold silicon piece 4 can play a protective role to signal processing chip 3, and the gold thread 7 that signal processing chip 3 connects is located in the cavity, keep away
Exempt to occur collapsing when encapsulation line, broken string the case where, to improve product yield.Wherein, the inner surface of recess sidewall is inclined-plane, is convenient for
Processing preparation.Conductive glue 10 is coated between back gold silicon piece 4 and photodiode 5, photodiode 5 passes through conductive glue 10
It is electrically connected with back gold silicon piece 4.
As Fig. 2 and Fig. 3 jointly shown in, above photodiode 5 be equipped with light transmitting sheet 6, convenient for photodiode 5 receive light,
Light transmitting sheet 6 is made of clear material, and preferred light transmitting sheet 6 is glass transmission piece or injection molding light transmitting sheet in present embodiment, and shell 2 can
Shooting Technique machine-shaping is passed through by black plastic material.
Embodiment two:
Present embodiment is basically the same as the first embodiment, the difference is that:
As shown in figure 3, light transmitting sheet 6 is injection molding light transmitting sheet, light transmitting sheet 6 and shell 2 are passed through by transparent plastic material is molded work
Skill is integrally machined molding.
The heart rate sensor of the utility model in the semiconductor chip bottom position opposite with signal processing chip by being arranged
Groove props up space for the gold thread that signal processing chip is connected with substrate, avoids gold thread in encapsulation process and be collapsed or break,
The fraction defective for reducing encapsulation, avoids repeatedly going up core, while not needing glue film in the design and carrying out adhesive means, reduces complex process
Degree, can effectively improve working efficiency.
Although the foregoing describe specific embodiment of the present utility model, it should be appreciated by those skilled in the art,
Described embodiment is only a part of the embodiment of the utility model, and instead of all the embodiments, these are only to lift
Example explanation, the protection scope of the utility model is limited by described claims.Those skilled in the art is without departing substantially from this
It, can be to these embodiments under any creative labor of no process under the premise of the principle and essence of utility model
Various changes or modifications are made, but these change and modification each fall within the protection scope of the utility model.
Claims (10)
1. heart rate sensor is successively arranged in the shell from top to bottom including substrate and fixed shell on the substrate
Photodiode, semiconductor chip and signal processing chip, which is characterized in that the bottom of the semiconductor chip and the signal processing
The opposite position of chip is equipped with groove, and the cavity that the semiconductor chip and the substrate are formed is arranged in the signal processing chip
It is interior.
2. heart rate sensor according to claim 1, which is characterized in that the inner surface of the recess sidewall is inclined-plane.
3. heart rate sensor according to claim 2, which is characterized in that the photodiode, the semiconductor chip and
The signal processing chip is electrically connected with the substrate by gold thread respectively.
4. heart rate sensor according to claim 3, which is characterized in that the semiconductor chip and the photodiode it
Between be coated with conductive glue, the photodiode is electrically connected by the conductive glue with the semiconductor chip.
5. heart rate sensor according to claim 4, which is characterized in that the semiconductor chip is back gold silicon piece.
6. heart rate sensor according to claim 1, which is characterized in that be equipped with light transmitting sheet above the photodiode.
7. heart rate sensor according to claim 6, which is characterized in that the shell is by Shooting Technique machine-shaping.
8. heart rate sensor according to claim 7, which is characterized in that the light transmitting sheet is glass transmission piece.
9. heart rate sensor according to claim 7, which is characterized in that the light transmitting sheet is injection molding light transmitting sheet.
10. heart rate sensor according to claim 9, which is characterized in that the shell and the light transmitting sheet are integrated knot
Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821293700.4U CN208548349U (en) | 2018-08-10 | 2018-08-10 | Heart rate sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821293700.4U CN208548349U (en) | 2018-08-10 | 2018-08-10 | Heart rate sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208548349U true CN208548349U (en) | 2019-02-26 |
Family
ID=65426225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821293700.4U Active CN208548349U (en) | 2018-08-10 | 2018-08-10 | Heart rate sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208548349U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111009475A (en) * | 2019-11-22 | 2020-04-14 | 青岛歌尔智能传感器有限公司 | Packaging structure and packaging method of optical module |
-
2018
- 2018-08-10 CN CN201821293700.4U patent/CN208548349U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111009475A (en) * | 2019-11-22 | 2020-04-14 | 青岛歌尔智能传感器有限公司 | Packaging structure and packaging method of optical module |
| CN111009475B (en) * | 2019-11-22 | 2021-08-27 | 青岛歌尔智能传感器有限公司 | Packaging structure and packaging method of optical module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200617 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |