CN206379370U - UV chip lead rack modules - Google Patents
UV chip lead rack modules Download PDFInfo
- Publication number
- CN206379370U CN206379370U CN201720003928.4U CN201720003928U CN206379370U CN 206379370 U CN206379370 U CN 206379370U CN 201720003928 U CN201720003928 U CN 201720003928U CN 206379370 U CN206379370 U CN 206379370U
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- China
- Prior art keywords
- functional areas
- sides
- substrate
- division board
- coat
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Abstract
The utility model discloses a kind of UV chip lead racks module, the multiple Polygonal ceramic bowls extended including wire frame body, the multiple substrates being arranged in wire frame body and by substrate, the two bottom sides of each Polygonal ceramic bowl are respectively equipped with the functional areas of bonding flip-chip, and are fixedly connected between both sides functional areas and substrate by articulamentum；The surface of both sides functional areas, which is electroplate with after being metallized by way of magnetron sputtering between the coat of metal, both sides functional areas, is provided with division board, and both sides functional areas are isolated by division board；The positive electrode back bonding of UV chips on the functional areas of side, and UV chips negative electrode back bonding on opposite side functional areas after, UV chips, the coat of metal, articulamentum and substrate are sequentially connected electrically.The division of the utility model functional areas and division board effectively reduces light decay, adds the reliability of product；Polygonal ceramic bowl is conducive to increasing bowl depth, lifting angle and brightness, and moisture effect is good.
Description
Technical field
The utility model is related to LED lead frame technical fields, more particularly to a kind of UV chip lead racks module.
Background technology
With the arrival in various electronic devices integrated epoch, complete electronic set to circuit miniaturization, high density, multifunctionality,
High reliability, high speed and high-power propose higher requirement, because burning multilayer ceramic substrate altogether disclosure satisfy that electronics is whole
Many requirement of the machine to circuit, so being obtained a wide range of applications in recent years.Burning multilayer ceramic substrate can be divided into high temperature and be total to altogether
Burn two kinds of multi-layer ceramics (HTCC) substrate and low temperature co-fired multi-layer ceramics (LTCC) substrate.HTCC and low temperature co-fired pottery
Porcelain, which is compared, has the advantages that high mechanical strength, wiring density height, stable chemical performance, coefficient of heat transfer are high and the cost of material is low,
Thermal stability requirement is higher, high-temperature volatile demand is smaller, sealing requirements are higher heating and encapsulation field, are obtained
More it is widely applied.HTCC ceramic heating plates are mainly replacement most popular B alloy wire electric heating element and PTC electricity now
Thermal element and its component.B alloy wire electric heating element exist high temperature easily aoxidize, short life, have that naked light is dangerous, the thermal efficiency is low plus
The shortcomings of heat is uneven;And the heating-up temperature of PTC electric heating elements typically only has 200 DEG C or so, heating-up temperature is higher than 120 DEG C
Lead orthoplumbate is then generally used, because lead tolerance greatly and just belongs to the product being eliminated.
Utility model content
For weak point present in above-mentioned technology, the utility model, which provides one kind, can increase carrier light reflectivity, drop
Low light attenuation, the UV chip lead rack modules for increasing reliability.
To achieve the above object, the utility model provides a kind of UV chip lead racks module, including wire frame body, setting
Multiple substrates in wire frame body and the multiple Polygonal ceramic bowls extended by substrate, each Polygonal ceramic bowl
Two bottom sides be respectively equipped with the functional areas of bonding flip-chip, it is and solid by articulamentum between both sides functional areas and substrate
Fixed connection；The surface of both sides functional areas is electroplate with the coat of metal, both sides functional areas after being metallized by way of magnetron sputtering
Between be provided with division board, and both sides functional areas are isolated by division board；The positive electrode back bonding of UV chips is in side functional areas
On, and UV chips negative electrode back bonding on opposite side functional areas after, UV chips, the coat of metal, articulamentum and substrate according to
Secondary electrical connection.
Wherein, thickness of the thickness of both sides functional areas than division board is big, and is formed between both sides functional areas and division board
Ledge structure.
Wherein, the thickness of the articulamentum and the coat of metal is 60-120 microns.
Wherein, the coat of metal is silver layer or layer gold, and the division board is PPA plastics, and the material of the substrate is oxygen
Change one kind in aluminium, aluminium nitride, EMC, SMC, copper or aluminium, and the material of the articulamentum is one kind in nickel, copper or gold.
Wherein, the Polygonal ceramic bowl is shaped as symmetrical quadrangle, pentagon, hexagon, heptagon or eight
One kind in the shape of side.
The beneficial effects of the utility model are：Compared with prior art, the UV chip lead rack moulds that the utility model is provided
Separated between group, it is adaptable to which UV flip-chips are bonded on functional areas, two functional areas by division board, back bonding is in function
Mode in area causes thermoelectricity to separate, and effectively reduces light decay, and adds the reliability of product, facilitates secondary optical lens group
Dress；The coat of metal, the side of magnetron sputtering are electroplate with after being metallized on the surface of both sides functional areas by way of magnetron sputtering
Formula causes functional areas surface metalation, beneficial to the plating coat of metal, is effectively increased the light reflectivity of functional areas；Polygonal ceramic bowl
Cup is conducive to increasing bowl depth, lifting angle and brightness, and moisture effect is good.
Brief description of the drawings
Fig. 1 is the stereogram of the single substrate of UV chip lead racks module of the present utility model；
Fig. 2 is the top view of the single substrate of UV chip lead racks module of the present utility model；
Fig. 3 is the first sectional view of the single substrate of UV chip lead racks module of the present utility model；
Fig. 4 is the second sectional view of the single substrate of UV chip lead racks module of the present utility model.
Main element symbol description is as follows：
1st, substrate 2, Polygonal ceramic bowl
3rd, the coat of metal 4, articulamentum
21st, functional areas 22, division board.
Embodiment
In order to more clearly state the utility model, the utility model is further described below in conjunction with the accompanying drawings.
Refer to Fig. 1-4, UV chip lead racks module of the present utility model, including wire frame body（It is not shown）, set
Multiple substrates 1 in wire frame body and the multiple Polygonal ceramic bowls 2 extended by substrate 1, each Polygonal ceramic
The two bottom sides of bowl 2 are respectively equipped with the functional areas 21 of bonding flip-chip, and lead between both sides functional areas 21 and substrate 1
Articulamentum 4 is crossed to be fixedly connected；The surface of both sides functional areas 21 is electroplate with metal-plated after being metallized by way of magnetron sputtering
Division board 22 is provided between layer 3, both sides functional areas 21, and both sides functional areas 21 are isolated by division board 22；The positive electricity of UV chips
Pole back bonding on side functional areas 21, and UV chips negative electrode back bonding on opposite side functional areas 21 after, UV cores
Piece, the coat of metal 3, articulamentum 4 and substrate 1 are sequentially connected electrically.Multiple substrates 1, to design in flakes, are beneficial in wire frame body
Improve production efficiency.
The mode of magnetron sputtering is exactly in the prior art by introducing magnetic field in target cathode surface, using magnetic field to band electrochondria
The constraint of son come improve etc. from electronics during accelerating to fly to substrate by electronics during accelerating to fly to substrate by
To the constraint of magnetic field Loulun magnetism, concentrate in the heating region of target surface, and surround target surface under the influence of a magnetic field
Circle, the motion path of the electronics is very long, constantly being collided in motion process with ar atmo ionizes out largely
Argon ion bombardment target, the energy of electronics is gradually reduced after multiple impacts, breaks away from the constraint of the magnetic line of force away from target figure,
Principle of magnetron-sputtering, is eventually deposited on substrate 1, and daughter density is to increase the method for sputtering raste.
Compared with prior art, the UV chip lead rack modules that the utility model is provided, it is adaptable to which UV flip-chips are bonded
On functional areas 21, separated between two functional areas 21 by division board 22, mode of the back bonding on functional areas 21 causes
Thermoelectricity is separated, and effectively reduces light decay, and adds the reliability of product, facilitates secondary optical lens to assemble；In both sides functional areas
21 surface is electroplate with the coat of metal 3 after being metallized by way of magnetron sputtering, the mode of magnetron sputtering causes functional areas
21 surface metalations, beneficial to the plating coat of metal 3, are effectively increased the light reflectivity of functional areas 21；Polygonal ceramic bowl 2 is favourable
In increase bowl depth, lifting angle and brightness, moisture effect are good.
Refer to Fig. 1 and Fig. 3, the thickness of the thickness of both sides functional areas 21 than division board 22 is big, and both sides functional areas 21
Ledge structure is formed between division board 22.The functional areas 21 of ledge structure and division board 22 cause the lead frame module to be easy to two
The assembling of secondary optical lens.
In the present embodiment, the thickness of articulamentum 4 and the coat of metal 3 is 60-120 microns.Articulamentum 4 and the coat of metal 3
Realized by plating mode, thickness is 60-120 microns, articulamentum 4 firmly to connect between functional areas 21 and substrate 1, gold
Category coating 3 causes functional areas 21 to be easy to die bond.
In the present embodiment, the coat of metal 3 is silver layer or layer gold, and division board 22 is PPA plastics, and the material of substrate 1 is oxidation
One kind in aluminium, aluminium nitride, EMC, SMC, copper or aluminium, and the material of articulamentum 4 is one kind in nickel, copper or gold.PPA plastics are
PPTA, its heat distortion temperature is up to more than 300 DEG C, and continuous temperature in use can meet institute up to 170 DEG C
The short-term and long-term hot property needed, and its superior mechanicalness can be kept within the scope of broad temperature and in high humidity environment
Characteristic, such as intensity, hardness, fatigue durability and creep resistance；EMC is epoxy resin, with good physics, chemical property, it
There is excellent adhesive strength to the surface of metal and nonmetallic materials, dielectric properties are good, and deformation retract rate is small, product size
Stability is good, and hardness is high, and pliability is preferable, to alkali and most of solvent-stable；SMC is silicones, is with highly cross-linked net
The polysiloxane of shape structure, has the double grading of organic resin and inorganic material concurrently, with unique physics, chemically
Energy.
In the present embodiment, Polygonal ceramic bowl 2 be shaped as symmetrical quadrangle, pentagon, hexagon, heptagon or
One kind in octagon.Polygonal ceramic bowl 2 is shaped such that the lighting angle of bowl reaches 110-120 degree, certainly, influence hair
The factor of angular also has deep cup, chamfering or plastic material etc..Symmetrical quadrangle, pentagon, hexagon, heptagon or eight sides
Shape is conducive to being evenly dividing for functional areas 21 and plastic areas, is conducive to electric heating to separate.And be conducive to die bond, bonding wire and process for filling colloid
Operation, be conducive to improve yields.
Advantage of the present utility model is：
1）Multiple substrates 1 are to design in flakes in wire frame body, beneficial to raising production efficiency；
2）The mode of magnetron sputtering causes the surface metalation of functional areas 21, beneficial to the plating coat of metal 3, is effectively increased function
The light reflectivity in area 21；
3）Polygonal ceramic bowl 2 is conducive to increasing bowl depth, lifting angle and brightness, and moisture effect is good；
4）Separated between two functional areas 21 by division board 22, mode of the back bonding on functional areas 21 causes thermoelectricity
Separation, effectively reduces light decay, and adds the reliability of product, facilitates secondary optical lens to assemble.
Disclosed above is only several specific embodiments of the present utility model, but the utility model is not limited to this,
The changes that any person skilled in the art can think of should all fall into protection domain of the present utility model.
Claims (5)
1. a kind of UV chip lead racks module, it is characterised in that including wire frame body, be arranged on it is multiple in wire frame body
Substrate and the multiple Polygonal ceramic bowls extended by substrate, the two bottom sides of each Polygonal ceramic bowl are respectively equipped with can
The functional areas of flip-chip are bonded, and are fixedly connected between both sides functional areas and substrate by articulamentum；Both sides functional areas
Surface, which is electroplate with after being metallized by way of magnetron sputtering between the coat of metal, both sides functional areas, is provided with division board, and two
Side functional areas are isolated by division board；The positive electrode back bonding of UV chips is on the functional areas of side, and the negative electrode of UV chips
After back bonding is on opposite side functional areas, UV chips, the coat of metal, articulamentum and substrate are sequentially connected electrically.
2. UV chip lead racks module according to claim 1, it is characterised in that the thickness of both sides functional areas is than isolation
The thickness of plate is big, and forms ledge structure between both sides functional areas and division board.
3. UV chip lead racks module according to claim 1, it is characterised in that the thickness of the articulamentum and the coat of metal
Degree is 60-120 microns.
4. UV chip lead racks module according to claim 1, it is characterised in that the coat of metal is silver layer or gold
Layer, the division board is PPA plastics, and the material of the substrate is one kind in aluminum oxide, aluminium nitride, EMC, SMC, copper or aluminium,
And the material of the articulamentum is one kind in nickel, copper or gold.
5. UV chip lead racks module according to claim 1, it is characterised in that the shape of the Polygonal ceramic bowl
For one kind in symmetrical quadrangle, pentagon, hexagon, heptagon or octagon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720003928.4U CN206379370U (en) | 2017-01-04 | 2017-01-04 | UV chip lead rack modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720003928.4U CN206379370U (en) | 2017-01-04 | 2017-01-04 | UV chip lead rack modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206379370U true CN206379370U (en) | 2017-08-04 |
Family
ID=59403726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720003928.4U Expired - Fee Related CN206379370U (en) | 2017-01-04 | 2017-01-04 | UV chip lead rack modules |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206379370U (en) |
-
2017
- 2017-01-04 CN CN201720003928.4U patent/CN206379370U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170804 Termination date: 20200104 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |