CN208400834U - A kind of chip diode - Google Patents
A kind of chip diode Download PDFInfo
- Publication number
- CN208400834U CN208400834U CN201820760666.0U CN201820760666U CN208400834U CN 208400834 U CN208400834 U CN 208400834U CN 201820760666 U CN201820760666 U CN 201820760666U CN 208400834 U CN208400834 U CN 208400834U
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- CN
- China
- Prior art keywords
- chip
- lead frame
- metal lead
- plastic casing
- reflection groove
- Prior art date
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Abstract
The utility model discloses a kind of chip diodes, including plastic casing, chip, the first packing colloid and metal lead frame, and the reflection groove of indent is arranged on the position of fixed chip on plastic casing, and the chip is fixed in the reflection groove；Metal lead frame is mounted on the bottom of plastic casing, and the metal lead frame is electrically connected by the conductor wire and chip for passing through plastic casing；The chip and conductor wire pass through the first packing colloid and are fixed in the reflection groove.The utility model realizes the reflection groove by the way that indent is arranged in plastic casing, so as to which chip emission or received light are carried out light gathering reflector, improves light extraction efficiency and photoelectric conversion efficiency.
Description
Technical field
The utility model relates to the encapsulating structure of semiconductor product more particularly to a kind of chip diodes.
Background technique
In general, encapsulation is to carry chip using bracket (also known as metal lead frame), is connected using elargol or metal
Line carries out the electrical connection of inside and outside, and outside carries out protection and optical perspective application using colloid.Encapsulation is for semiconductor product
For be it is necessary, play the role of protection and increase photoelectric properties.But plane formula knot is all made of in the structure of bracket at present
Structure can not further increase the effect of optical property.
Utility model content
For overcome the deficiencies in the prior art, the purpose of this utility model is to provide a kind of chip diode, energy
Enough solve the problems, such as that the encapsulating structure of the semiconductor product of the prior art leads to poor optical properties using planar configuration.
The purpose of this utility model adopts the following technical scheme that realization:
A kind of chip diode, comprising: plastic casing, chip, the first packing colloid and metal lead frame, in plastic casing
The reflection groove of indent is set on the position of fixed chip on body, and the chip is fixed in the reflection groove；Metal lead frame
It is mounted on the bottom of plastic casing, the metal lead frame is electrically connected by the conductor wire and chip for passing through plastic casing；Institute
It states chip and conductor wire passes through the first packing colloid and is fixed in the reflection groove.
Further, the inner wall surface of the transmitting slot is shiny surface or is cloudy surface.
Further, the plastic casing is equipped with corresponding back-shaped profile slot, and each metal lead frame is installed in
In corresponding back-shaped profile slot.
Further, the reflection groove is bowl shape, ellipse or circle.
Further, first packing colloid is epoxy resin colloid or silica gel colloid.
Further, the metal lead frame is two to six.
Further, the metal lead frame is equipped at least one location hole, and metal lead frame is fixed by location hole
It is mounted on plastic casing.
Further, the metal lead frame is equipped with moisture-proof slot.
Further, the top of the reflection groove, which is equipped with, plays the role of the second packing colloid of optical perspective, and described second
Light that packing colloid is used to issue chip or the light being irradiated in reflection groove are filtered.
Further, the shape of second packing colloid is spherical, ellipse or tower-shaped.
Compared with prior art, the utility model has the beneficial effects that:
The utility model by the position of the fixed chip of original plane formula encapsulating structure be arranged indent reflection groove,
Chip is placed in the reflection groove, the light that chip is issued/received can carry out light gathering reflector by the surface of the reflection groove,
Efficiency is changed to improve light extraction efficiency and photoelectricity dress, is solved and is packaged and causes using planar configuration in the prior art
The problem of poor optical properties, while energy consumption can be substantially reduced.
Detailed description of the invention
Fig. 1 is the left view sectional view of chip diode provided by the utility model；
Fig. 2 is the top view of chip diode provided by the utility model；
Fig. 3 is the main view sectional view of chip diode provided by the utility model；
Fig. 4 is the bottom view of chip diode provided by the utility model；
Fig. 5 is the overall structure figure of chip diode provided by the utility model.
In figure: 1, reflection groove；2, plastic casing；3, metal lead frame；4, location hole；5, chip；6, moisture-proof slot；7, it encapsulates
Colloid.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the utility model, it should be noted that
Under the premise of not colliding, it can be formed in any combination between various embodiments described below or between each technical characteristic new
Embodiment.
The utility model provides a kind of chip diode, is the plane formula encapsulation knot in existing semiconductor product
It is improved on structure, can be applied to the luminous points reception pipe product such as visible light/infrared ray/ultraviolet emissioning tube.This is practical new
Type is that the position of the fixed chip 5 on the plastic casing 2 of original plane formula encapsulating structure is arranged to the reflection groove 1 of indent, by core
Piece 5 is placed in reflection groove 1, and it is anti-that the light that such chip 5 is issued/received can carry out optically focused by the surface of the reflection groove 1
It penetrates, to improve light extraction efficiency and photoelectric conversion efficiency, reduces energy consumption.In addition, in order to realize better light gathering reflector, it can
Further smooth surface is set by the inner wall surface of reflection groove.
Wherein, chip 5 can be the devices such as visible light/infrared/ultraviolet emission chip, photoelectric receiving diode, IC.Separately
Outside, which is such as the shape of bowl, the shape of cup, ellipse, circle etc., as long as guaranteeing that the inner wall of the reflection groove 1 is light
Sliding structure can realize light gathering reflector, to improve light extraction efficiency and photoelectric conversion efficiency, and then improve optical characteristics.Its
Middle plastic casing 2 is generally using plastic cement materials such as PPA.
The utility model further includes at least one metal lead frame 3 and corresponding conductor wire.One end of each conductor wire with
Chip 5 is electrically connected, and the other end is electrically connected by plastic casing 2 with corresponding metal lead frame 3.Conductor wire can be conduction
Colloid, wire etc..Conductor wire and chip 5 are encapsulated in reflection groove 1 by the first packing colloid.First packing colloid
It can be epoxy resin, silica gel isocolloid.
Plastic casing 2 is equipped with back-shaped profile slot, and each metal lead frame 3 is each attached in corresponding back-shaped profile slot,
In other words metal lead frame 3 can increase the combination between metal lead frame 3 and plastic casing 2 using the shape of back-shaped structure
Power.
In addition, the utility model is also by doing roughening treatment for the metal lead frame being bonded with plastic casing 23 on one side,
To increase heat-resisting/cold ability of metal lead frame 3 and plastic casing 2, increase the knot between plastic casing 2 and metal lead frame 3
With joint efforts.
In addition, being additionally provided at least one location hole 4 on metal lead frame 3, by metal lead frame 3 and moulded by location hole 4
Rubber shell body 2 is fixedly connected.Moisture-proof slot 6 is additionally provided on metal lead frame 3, when having steam infiltration on metal lead frame 3 or plastic casing 2
When saturating, steam can be blocked by the moisture-proof slot 6, prevent metal lead frame 3 and reflection groove 1 from making moist.
The utility model, can also be by reflection groove in order to increase the binding force between the first packing colloid and plastic casing 2
Inner wall surface is made into cloudy surface.In this way, transmitting slot 1 inner wall surface some be to be sealed by the first packing colloid, will emit
The inner wall surface of slot does cloudy surface processing.Be from the point of view of in the entire surface of reflection groove it is smooth, have transmitting light the problem of；Simultaneously
In process, specially treated is done on the surface of plastic mould, the inner wall surface of reflection groove is seen under the microscope of high power lens
It is cloudy surface, and then the binding force between the first packing colloid and plastic casing 2 can be increased.In addition, under illustrating herein, this is practical
It is novel it is middle the inner wall surface of reflection groove is made into shiny surface or cloudy surface light extraction efficiency and photoelectric conversion efficiency can be improved, improve
Optical property.
In addition, the second packing colloid 7 is also arranged in the utility model on plastic casing, so that the second packing colloid 7
Positioned at the top of reflection groove 1.Second packing colloid 7 can to the light or the light that is irradiated in reflection groove 1 that chip 5 issues into
Row filtering.
In addition, after reflection groove 1 is processed by precision equipment, the position of fixed chip 5 can in actual process
It is more accurate with the design than primary plane formula, it can be ensured that 7 optical centre consistency of the second packing colloid.
Epoxy resin/silicones class light-transmitting materials can be used in second packing colloid 7, and then play the role of optical lens,
Shape is including but not limited to spherical, oval, tower-shaped etc..Second packing colloid 7 can limit the light allowed through different-waveband,
Be applicable in outside Different Red/ultraviolet emission and receive application, for example may be set to 0nm~1100nm, 400nm~800nm, 760nm
The different-wavebands such as~1100nm, 850nm~1100nm.
When in use, the light that chip issues can be emitted to outside by the first packing colloid, the second packing colloid 7, or
Person's chip receives the light by the second packing colloid 7, the first packing colloid.
In addition, 3 more than just one of metal lead frame employed in the utility model, attachable electrical property pin increases,
The compatibility for optimizing this bracket improves the reliability that user uses pcb board to weld, and significantly facilitates the simultaneous of subscriber's line circuit design
Capacitive.Meanwhile in actual production process, also metal lead frame 3 is in U-shape shape by bending technique, is answered with meeting difference
With the connection requirement of circuit.In the actual use process, by welding the pin of the metal lead frame 3 of each stamp-mounting-paper diode
It is connected on pcb board.
Above embodiment is only preferred embodiments of the present invention, cannot be protected with this to limit the utility model
Range, the variation of any unsubstantiality that those skilled in the art is done on the basis of the utility model and replacement belong to
In the utility model range claimed.
Claims (10)
1. a kind of chip diode, characterized by comprising: plastic casing, chip, the first packing colloid and metal lead frame,
The reflection groove of indent is set on the position of fixed chip on plastic casing, and the chip is fixed in the reflection groove；Metal
Lead frame is mounted on the bottom of plastic casing, and the metal lead frame is electrically connected by passing through the conductor wire of plastic casing with chip
It connects；The chip and conductor wire pass through the first packing colloid and are fixed in the reflection groove.
2. chip diode as described in claim 1, it is characterised in that: the inner wall surface of the reflection groove be shiny surface or
Person is cloudy surface.
3. chip diode as described in claim 1, it is characterised in that: the plastic casing is equipped with corresponding back-shaped wheel
Wide slot, each metal lead frame are installed in corresponding back-shaped profile slot.
4. chip diode as described in claim 1, it is characterised in that: the reflection groove be bowl shape, ellipse or
It is round.
5. chip diode as described in claim 1, it is characterised in that: first packing colloid is epoxy resin colloid
Or silica gel colloid.
6. chip diode as described in claim 1, it is characterised in that: the metal lead frame is two to six.
7. chip diode as described in claim 1, it is characterised in that: the metal lead frame is fixed equipped at least one
Position hole, metal lead frame are fixedly mounted on plastic casing by location hole.
8. chip diode as described in claim 1, it is characterised in that: the metal lead frame is equipped with moisture-proof slot.
9. chip diode as described in claim 1, it is characterised in that: the top of the reflection groove is equipped with and plays optical lens
The second packing colloid being regarded as, the light that second packing colloid is used to issue chip or the light being irradiated in reflection groove
Line is filtered.
10. chip diode as claimed in claim 9, it is characterised in that: the shape of second packing colloid be it is spherical,
It is oval or tower-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820760666.0U CN208400834U (en) | 2018-05-21 | 2018-05-21 | A kind of chip diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820760666.0U CN208400834U (en) | 2018-05-21 | 2018-05-21 | A kind of chip diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208400834U true CN208400834U (en) | 2019-01-18 |
Family
ID=65136802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820760666.0U Active CN208400834U (en) | 2018-05-21 | 2018-05-21 | A kind of chip diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208400834U (en) |
-
2018
- 2018-05-21 CN CN201820760666.0U patent/CN208400834U/en active Active
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