CN207800646U - A kind of high light efficiency LED encapsulating structure - Google Patents
A kind of high light efficiency LED encapsulating structure Download PDFInfo
- Publication number
- CN207800646U CN207800646U CN201820307205.8U CN201820307205U CN207800646U CN 207800646 U CN207800646 U CN 207800646U CN 201820307205 U CN201820307205 U CN 201820307205U CN 207800646 U CN207800646 U CN 207800646U
- Authority
- CN
- China
- Prior art keywords
- adhesive layer
- reflector
- ladder section
- light efficiency
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of high light efficiency LED encapsulating structure, including holder, LED chip, transparent adhesive layer and lens, holder is metallic support, cradle top surface is recessed inwardly the reflector to be formed for LED chip to be arranged, LED chip is set to the bottom of reflector, reflector is stepped and is divided into the first ladder section successively upwards by bottom, second-order bench and third ladder section, transparent adhesive layer is filled in first ladder section, fluorescent powder is filled in second-order bench, the fluorescent adhesive layer that spread powder and transparent colloid are mixed to form, lens are arranged in third ladder section and are sealed on the fluorescent adhesive layer, the bottom of reflector is provided through the through-hole of holder bottom face, the pin of LED encapsulation structure is locked in by insulating cement in through-hole, the electrode of LED chip is correspondingly connected with by lead and pin.A kind of high light efficiency LED encapsulating structure of the utility model volume, thermal diffusivity is good, light source space colour temperature uniformity, light efficiency and reliability are higher.
Description
Technical field
The utility model belongs to LED encapsulation technologies field more particularly to a kind of high light efficiency LED encapsulating structure.
Background technology
Existing high-power LED encapsulation is most of by the way of putting fluorescent glue in the reflector in holder, such envelope
Dress form fluorescent powder is closer apart from LED chip, since the heat that great power LED chip is sent out is bad compared with high-cooling property, can cause
The problems such as fluorescent powder launching efficiency is low, decaying is big, light efficiency is low, and there are the non-uniform problems of light source space colour temperature.When with this light
Source will appear the non-uniform phenomenon of light source space colour temperature when being used with secondary lens collocation and the aperture of yellow, application effect occurs
Difference seriously affects the use of client.
Utility model content
In order to solve the above technical problems, the purpose of this utility model is to provide a kind of high light efficiency LED encapsulating structure, dissipate
Hot good, light source space colour temperature uniformity, light efficiency and reliability are higher.
A kind of high light efficiency LED encapsulating structure of the utility model, including holder, LED chip, transparent adhesive layer and lens,
The holder is metallic support, and cradle top surface is recessed inwardly the reflector to be formed for LED chip to be arranged, and the LED chip is set
It is placed in the bottom of reflector, the reflector is stepped and is divided into the first ladder section, second-order bench successively upwards by bottom
With third ladder section, it is filled with transparent adhesive layer in the first ladder section of LED chip, fluorescence is filled in second-order bench
The fluorescent adhesive layer that powder, spread powder and transparent colloid are mixed to form, the lens are arranged in third ladder section and are sealed on described glimmering
On optical cement layer；It is provided through the through-hole of holder bottom face in the bottom of the reflector, the pin of LED encapsulation structure passes through exhausted
Edge glue is locked in the through-hole, and the electrode of LED chip is correspondingly connected with by lead and pin.
In the high light efficiency LED encapsulating structure of the utility model, the interface of the first ladder section and second-order bench
It is equipped with flange.
In the high light efficiency LED encapsulating structure of the utility model, the side wall of the first ladder section is in inclined-plane.
In the high light efficiency LED encapsulating structure of the utility model, the through-hole is equipped with one or two.
Two layers of glue sealing structure that the utility model is constituted using transparent adhesive layer and fluorescent adhesive layer, increase fluorescent adhesive layer with
The distance between LED chip can reduce due to LED chip heat dissipation caused by fluorescent powder launching efficiency is low, light efficiency is low, decaying greatly
Problem；A certain proportion of spread powder is mixed into fluorescent adhesive layer can effectively improve luminous flux simultaneously, keep light source space colour temperature uniform
Unanimously.The utility model uses metallic support, and the heat dissipation performance of product can be improved, and further solves fluorescence caused by chip fever
The problem that powder launching efficiency is low, light efficiency is low, decaying is big.
Description of the drawings
Fig. 1 is a kind of sectional view of high light efficiency LED encapsulating structure of the utility model.
Specific implementation mode
It is as shown in Figure 1 a kind of sectional view of high light efficiency LED encapsulating structure of the utility model, the LED encapsulation structure packet
Include holder 1, LED chip 2, transparent adhesive layer 3, fluorescent adhesive layer 4, lens 5 and pin 6.
Holder 1 is metallic support, and 1 top surface of holder is recessed inwardly the reflector 11 to be formed for LED chip 2 to be arranged.It is described
LED chip 2 is set to the bottom of reflector 11, and the reflector 11 is stepped and is divided into the first ladder successively upwards by bottom
Section 111, second-order bench 112 and third ladder section 113.It is filled with transparent envelope in the first ladder section 111 of LED chip 2
Glue-line 3, second-order bench 112 is interior to fill fluorescent adhesive layer 4, and the fluorescent adhesive layer 4 is mixed by fluorescent powder, spread powder and transparent colloid
It closes and is formed.The lens 5 are arranged in third ladder section 113 and are sealed on the fluorescent adhesive layer 4.The utility model is using transparent
Two layers of glue sealing structure that adhesive layer 3 and fluorescent adhesive layer 4 are constituted, increasing the distance between fluorescent adhesive layer 4 and LED chip 2 can subtract
The problem that fluorescent powder launching efficiency is low, light efficiency is low caused by being radiated less due to LED chip 2, decaying is big；Simultaneously in fluorescent adhesive layer 4
In be mixed into a certain proportion of spread powder and can effectively improve luminous flux, make light source space colour temperature uniformity.
It is provided through the through-hole 12 of 1 bottom face of holder in the bottom of reflector 11, the pin 6 of LED encapsulation structure passes through
Insulating cement 7 is locked in the through-hole 12.The electrode of LED chip 2 is correspondingly connected with by lead 21 and pin 6.The utility model
Using metallic support, the heat dissipation performance of product can be improved, further solve that fluorescent powder launching efficiency caused by chip fever is low, light
Imitate problem low, that decaying is big.
Flange 114 is equipped on the interface of the first ladder section 111 and second-order bench 112.First ladder section
111 side wall is in inclined-plane.The reflector of the utility model is using step-like design and is sequentially filled transparent adhesive layer 3, fluorescent glue
Layer 4 more preferably can closely connect with holder 1 and process simply, and while improving light efficiency, stair-stepping reflector can also improve production
Product water resistance, and can further be carried by the way that flange 114 is arranged on 112 interface of the first ladder section 111 and second-order bench
Rise waterproof effect.
When it is implemented, according to the type through-hole 12 of LED chip 2 can be equipped with one or two, the lead of LED chip 2 with
Pin 6 in through-hole 12 is correspondingly connected with.
The above is only the preferred embodiment of the present invention, the thought being not intended to limit the utility model, it is all
Within the spirit and principles of the utility model, it is new to should be included in this practicality for any modification, equivalent replacement, improvement and so on
Within the protection domain of type.
Claims (4)
1. a kind of high light efficiency LED encapsulating structure, including holder, LED chip, transparent adhesive layer and lens, it is characterised in that：
The holder is metallic support, and cradle top surface is recessed inwardly the reflector to be formed for LED chip to be arranged, the LED core
Piece is set to the bottom of reflector, and the reflector is stepped and is divided into the first ladder section, second-order successively upwards by bottom
Bench and third ladder section are filled with transparent adhesive layer in the first ladder section of LED chip, are filled in second-order bench
The fluorescent adhesive layer that fluorescent powder, spread powder and transparent colloid are mixed to form, the lens are arranged in third ladder section and are sealed on institute
It states on fluorescent adhesive layer；
It is provided through the through-hole of holder bottom face in the bottom of the reflector, the pin of LED encapsulation structure passes through insulating cement
It is locked in the through-hole, the electrode of LED chip is correspondingly connected with by lead and pin.
2. high light efficiency LED encapsulating structure as described in claim 1, which is characterized in that the first ladder section and the second ladder
The interface of section is equipped with flange.
3. high light efficiency LED encapsulating structure as described in claim 1, which is characterized in that the side wall of the first ladder section is in oblique
Face.
4. high light efficiency LED encapsulating structure as described in claim 1, which is characterized in that the through-hole is equipped with one or two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820307205.8U CN207800646U (en) | 2018-03-06 | 2018-03-06 | A kind of high light efficiency LED encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820307205.8U CN207800646U (en) | 2018-03-06 | 2018-03-06 | A kind of high light efficiency LED encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207800646U true CN207800646U (en) | 2018-08-31 |
Family
ID=63275518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820307205.8U Expired - Fee Related CN207800646U (en) | 2018-03-06 | 2018-03-06 | A kind of high light efficiency LED encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207800646U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111092140A (en) * | 2019-11-27 | 2020-05-01 | 芜湖锐拓电子有限公司 | Light emitting diode light source and display device |
-
2018
- 2018-03-06 CN CN201820307205.8U patent/CN207800646U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111092140A (en) * | 2019-11-27 | 2020-05-01 | 芜湖锐拓电子有限公司 | Light emitting diode light source and display device |
| CN111092140B (en) * | 2019-11-27 | 2021-12-14 | 安徽锐拓电子有限公司 | Light emitting diode light source and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105870303A (en) | Full-spectrum LED light source | |
| CN202094175U (en) | Far fluorescent powder LED encapsulating structure | |
| CN204204899U (en) | A kind of high-color rendering white-light exempts from packaged LED | |
| CN104505456A (en) | High-power white-light LED (Light-emitting Diode) excellent in heat radiation and manufacturing method thereof | |
| CN102748626B (en) | LED (Light-Emitting Diode) tube and manufacturing method thereof | |
| JP2016518724A (en) | LED module and manufacturing method thereof | |
| CN208521959U (en) | One kind having the twin-lens LED encapsulation structure of plug-in | |
| CN207800646U (en) | A kind of high light efficiency LED encapsulating structure | |
| CN203260639U (en) | High-luminous-efficiency and good-heat-dissipation COB light source | |
| CN202013881U (en) | Integrated packaging structure with vertically structured LED chips | |
| CN206947340U (en) | A kind of LED lamp bead of high brightness | |
| CN202118634U (en) | Light-emitting diode (LED) module light source with low thermal resistance and high lighting effect | |
| CN208256718U (en) | A kind of encapsulating structure of LED | |
| CN207651514U (en) | The integral type infrared LED encapsulating structure of anti-external source interference | |
| CN205752229U (en) | A kind of encapsulating structure of high-capacity LED | |
| CN103887299A (en) | High-voltage LED light source | |
| CN105870294B (en) | A kind of encapsulating method and structure of high-capacity LED | |
| CN202018990U (en) | High-power white-light LED light source encapsulating structure | |
| CN205877785U (en) | Use power built -in ball bubble lamp of 2 pi LED filaments | |
| CN204497262U (en) | A kind of good large power white light LED that dispels the heat | |
| CN104183581A (en) | LED module and manufacturing process thereof | |
| CN203589071U (en) | An LED support and an LED | |
| CN204088373U (en) | Bent LED silk and bulb structure thereof | |
| CN209026542U (en) | A kind of dual wavelength white LED lamp | |
| CN204497229U (en) | The large power white light LED of bright dipping time space aberration can be eliminated |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180831 Termination date: 20190306 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |