CN207097817U - A kind of deep ultraviolet LED light source module - Google Patents
A kind of deep ultraviolet LED light source module Download PDFInfo
- Publication number
- CN207097817U CN207097817U CN201720572962.3U CN201720572962U CN207097817U CN 207097817 U CN207097817 U CN 207097817U CN 201720572962 U CN201720572962 U CN 201720572962U CN 207097817 U CN207097817 U CN 207097817U
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- deep ultraviolet
- ultraviolet led
- ceramic substrate
- light source
- source module
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Abstract
The utility model discloses a kind of deep ultraviolet LED light source module, including semicircle quartz lens (3), deep ultraviolet LED chip (4), sealant (5), cover copper ceramic substrate (2) and hexagonal copper base (1)；Wherein, hexagonal copper base (1) surface is provided with gold-plated welding position, and the copper ceramic substrate (2) that covers is welded on the gold-plated welding position；The quantity for covering copper ceramic substrate (2) is more, and the surface that copper ceramic substrate (2) is covered described in each is coated with golden tin layers, for being welded as eutectic；The deep ultraviolet LED chip (4) is encapsulated in described cover at the welding position of copper ceramic substrate (2) by eutectic welding, the semicircle quartz lens (3) is bonded in the surface of the deep ultraviolet LED chip (4) by the sealant (5), forms waterproof oxygen sealing structure.Light source module group of the present utility model, the luminous power of product is substantially increased, reduce thermal resistance, control junction temperature, increase life-span and reliability.
Description
Technical field
The utility model belongs to the sterilization of deep ultraviolet light source and curing technology field, more particularly, to a kind of deep ultraviolet LED
Light source module group.
Background technology
Based on the ultraviolet LED of group III nitride material sterilizing, glue curing, biochemical detection, non line of sight communication and
The fields such as special lighting have broad application prospects, and receive more and more attention and pay attention in recent years.More than past ten
Nian Li, ultraviolet LED achieve significant progress, and the ultraviolet LED between 400~210nm of emission wavelength is successively developed, short
Only surpass 10% in 360nm deep ultraviolet LED external quantum efficiency (EQE) best result, compared with the blue-light LED chip of maturation also
Differ greatly.
At present, traditional mercury lamp is mainly in occupation of deep ultraviolet sterilization and curing light source field, and the mercury element in mercury lamp is to ring
The shortcomings of border is simultaneously unfriendly, and preheating time length be present, and wave band is not single, it is not preferable deep ultraviolet light source.By extension material
Material growth limitation, the deep ultraviolet LED photovoltaic transformation efficiency of 280nm wave bands is less than 5%, exist luminous quantity deficiency, heating it is serious,
The problems such as light decay is too fast, deep ultraviolet LED popularization and application are had a strong impact on, do not met the theory for building Green China instantly.
Utility model content
For the disadvantages described above or Improvement requirement of prior art, the utility model provides a kind of deep ultraviolet LED light source module,
Its object is to combine multilayer copper-clad aluminium nitride substrate and uvioresistant sealant, the luminous power of product can be greatly improved, is reduced
Thermal resistance, junction temperature is controlled, increase life-span and reliability.
To achieve the above object, a kind of deep ultraviolet LED light source module of the utility model offer, including semicircle quartz lens,
Deep ultraviolet LED chip, sealant, cover copper ceramic substrate and hexagonal copper base；
Wherein, the copper-based plate surface of the hexagonal is provided with gold-plated welding position, and the copper ceramic substrate that covers is welded on the plating gold solder
On position；The quantity for covering copper ceramic substrate is more, and the surface that copper ceramic substrate is covered described in each is coated with golden tin layers, is used
Welded in as eutectic；
The deep ultraviolet LED chip by eutectic welding be encapsulated in it is described cover at the welding position of copper ceramic substrate, it is described
Semicircle quartz lens is bonded in the surface of the deep ultraviolet LED chip by the sealant, forms waterproof oxygen sealing structure.
Further, the deep ultraviolet LED chip is square or rectangular inverted structure, and its back surfaces is provided with one layer
Golden tin layers, for carrying out eutectic welding with the copper ceramic substrate that covers.
Further, the height of the golden tin layers is 80~120um, and its surface roughness root mean square is less than 400nm.
Preferably, the quantity for covering copper ceramic substrate is four.
Further, the surface of the hexagonal copper base is additionally provided with gold-plated electrode, for connecting extraneous positive and negative polarity wire.
Preferably, the sealant is high ultraviolet permeability silica gel or full-inorganic fluorine glue.
In general, by the contemplated above technical scheme of the utility model compared with prior art, can obtain down
Row beneficial effect：
(1) deep ultraviolet LED light source module of the present utility model, it is close by combining multilayer copper-clad aluminium nitride substrate and uvioresistant
Agent is sealed, substantially increases the luminous power of product, reduces thermal resistance, controls junction temperature, increases life-span and reliability.
(2) deep ultraviolet LED light source module of the present utility model, light extraction efficiency, increase are improved using uvioresistant sealant
Electricity conversion, the application and industrialization of high-power highlight extract efficiency ultraviolet sterilizing light source are realized, in addition, using uvioresistant
Sealant can avoid the harmful effect that sealant aging is brought.
Brief description of the drawings
Fig. 1 is a kind of deep ultraviolet LED light source module top view of the utility model embodiment；
Fig. 2 is a kind of front view of deep ultraviolet LED light source module of the utility model embodiment.
In all accompanying drawings, same reference represents identical structure and part, wherein：1- hexagonal copper bases, 2- cover
Copper ceramic substrate, 3- semicircle quartz lens, 4- deep ultraviolet LED chips, 5- sealants, 6-SAC305 tin creams.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining this
Utility model, it is not used to limit the utility model.It is in addition, involved in each embodiment of the utility model disclosed below
As long as and to technical characteristic each other do not form conflict can be mutually combined.
Fig. 1 is a kind of deep ultraviolet LED light source module top view of the utility model embodiment；Fig. 2 is implemented for the utility model
A kind of front view of deep ultraviolet LED light source module of example.As depicted in figs. 1 and 2, the light source module group includes semicircle quartz lens 3, close
Envelope agent 5, deep ultraviolet LED chip 4, cover copper ceramic substrate 2, hexagonal copper base 1.
As shown in figure 1, the hexagonal copper base 1 is located at bottom, its surface is designed with gold-plated electrode and 2 × 2 gold-plated welding positions,
Welding position uses series system, and hexagonal copper base 1 has high heat conduction characteristic and high mechanical properties, suitable for high-power packaging environment.
Cover copper ceramic substrate 2 to make using the multilayer co-firing aluminium nitride ceramics of low thermal resistance high intensity, cover copper ceramic substrate just
Golden tin layers have been done in face, and it is 100 μm that coating is highly preferred or 80um or 120um, its surface roughness rms are small
In 400nm, copper ceramic substrate 2 is covered by the reflow soldering of SAC305 tin creams 6 on the gold-plated welding position of hexagonal copper base 1.
In utility model preferred embodiment, cover copper ceramic substrate 2 and share four, each covers copper ceramic substrate 2
Surface is coated with golden tin layers, is welded for eutectic；
It is inverted structure as shown in figure 1, deep ultraviolet LED chip 4 peak wavelength 280nm, dimensional structure 1mm × 1mm, core
There are one layer 3 μm of golden tin layers on piece back electrode surface, for carrying out eutectic welding, deep ultraviolet LED with the copper ceramic substrate that covers
Chip 4 is encapsulated at the welding position for covering copper ceramic substrate 2 by eutectic welding；
The semicircle quartz lens of semicircle quartz lens 3, there is high ultraviolet permeability, especially in deep ultraviolet band (220nm-
310nm) there is more than 95% transmitance.Semicircle quartz lens 3 is bonded in deep ultraviolet LED chip 4 by the sealant 5
Surface, form the sealing of waterproof oxygen.
In preferred embodiment of the present utility model, sealant 5 can use high ultraviolet permeability silica gel and full-inorganic fluorine
A variety of colloids such as glue, it can select to use according to working environment.
The utility model covers copper ceramic substrate and advanced golden tin while packaging density is improved, by using low thermal resistance
Eutectic flip chip technology, deep ultraviolet LED chip junction temperature can be effectively controlled, improve luminous power and the life-span of deep ultraviolet LED chip, and adopted
With uvioresistant sealant, the harmful effect that sealant aging can be avoided to bring.
Through actual test, in the environment of natural heat dissipation, during electric current 350mA, voltage 30V, optical power intensity can reach
60mW, and light decay is less than 10% every 500 hours under normal operation.Its structure fabrication processes flow is simple, suitable for scale
Production, has boundless application prospect in fields such as deep ultraviolet germicidal light source, curing light sources.
As it will be easily appreciated by one skilled in the art that preferred embodiment of the present utility model is the foregoing is only, not
For limiting the utility model, any modification of all made within spirit of the present utility model and principle, equivalent substitution and change
Enter, should be included within the scope of protection of the utility model.
Claims (6)
- A kind of 1. deep ultraviolet LED light source module, it is characterised in that including semicircle quartz lens (3), deep ultraviolet LED chip (4), Sealant (5), cover copper ceramic substrate (2) and hexagonal copper base (1)；Wherein, hexagonal copper base (1) surface is provided with gold-plated welding position, it is described cover copper ceramic substrate (2) be welded on it is described gold-plated On welding position；The quantity for covering copper ceramic substrate (2) is more, and the surface that copper ceramic substrate (2) is covered described in each is coated with Golden tin layers, for being welded as eutectic；The deep ultraviolet LED chip (4) by eutectic welding be encapsulated in it is described cover at the welding position of copper ceramic substrate (2), institute The surface that semicircle quartz lens (3) is bonded in the deep ultraviolet LED chip (4) by the sealant (5) is stated, waterproof is formed and prevents Oxygen sealing structure.
- A kind of 2. deep ultraviolet LED light source module according to claim 1, it is characterised in that the deep ultraviolet LED chip (4) it is square or rectangular inverted structure, its back surfaces is provided with one layer of golden tin layers, for covering copper ceramic substrate with described (2) eutectic welding is carried out.
- A kind of 3. deep ultraviolet LED light source module according to claim 1 or 2, it is characterised in that the height of the golden tin layers For 80~120um, its surface roughness root mean square is less than 400nm.
- 4. a kind of deep ultraviolet LED light source module according to claim 1 or 2, it is characterised in that described to cover copper ceramic substrate (2) quantity is four.
- 5. a kind of deep ultraviolet LED light source module according to claim 1, it is characterised in that the hexagonal copper base (1) Surface is additionally provided with gold-plated electrode, for connecting extraneous positive and negative polarity wire.
- 6. a kind of deep ultraviolet LED light source module according to claim 1, it is characterised in that the sealant (5) is high purple Outer transmitance silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720572962.3U CN207097817U (en) | 2017-05-22 | 2017-05-22 | A kind of deep ultraviolet LED light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720572962.3U CN207097817U (en) | 2017-05-22 | 2017-05-22 | A kind of deep ultraviolet LED light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207097817U true CN207097817U (en) | 2018-03-13 |
Family
ID=61550950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720572962.3U Active CN207097817U (en) | 2017-05-22 | 2017-05-22 | A kind of deep ultraviolet LED light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207097817U (en) |
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2017
- 2017-05-22 CN CN201720572962.3U patent/CN207097817U/en active Active
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