CN205959972U

CN205959972U - Polymorphic type LED chip composite PACKER MODULE

Info

Publication number: CN205959972U
Application number: CN201620594639.1U
Authority: CN
Inventors: 熊大曦
Original assignee: SUZHOU KEYI-SKY SEMICONDUCTOR TECHNOLOGIES Inc
Current assignee: SUZHOU KEYI-SKY SEMICONDUCTOR TECHNOLOGIES Inc
Priority date: 2016-06-18
Filing date: 2016-06-18
Publication date: 2017-02-15
Anticipated expiration: 2026-06-18

Abstract

The utility model discloses a polymorphic type LED chip composite PACKER MODULE, include: including LED chip and base plate, LED chip number is two or more, and the encapsulation is in on the base plate, have on the base plate to constitute the current loop of connecting the LED chip, two or more LED chips include two kinds in plane chip, face down chip, positive polarity vertical stratification chip and the reversed polarity vertical stratification chip at least, the utility model discloses at least, adopt two kinds in four kinds of above -mentioned chips, mainly in order to solve the big or big shortcoming of operating current of present high -power LED luminous area to can produce better light emitting area shape, perhaps form the advantage of high voltage low current, thereby provide the ultra -large -power semiconductor LED light source design of a compact.

Description

A kind of polymorphic type LED chip assembled package module

Technical field

This utility model is related to semiconductor light source encapsulation and semiconductor chip manufactures field.

Background technology

LED chip structure has vertical stratification, planar structure, three kinds of inverted structure at present.

Thin-film LED electrode is up-down structure, according to the relative position up and down of both positive and negative polarity, positive polarity can be divided into hang down Straight chip and reversed polarity vertical chip, heat conductivity is good, and also ratio is larger for light-emitting area, but on needing series-parallel circuit design no Method meets the requirement of a lot of light fixtures, also cannot be fabricated to high voltage low current chip, and price is higher.

Planar structure chip needs both positive and negative polarity is made in same light-emitting area, electric current horizontal mobility, and advantage is easy for collecting Become encapsulation, but electric current density is uneven, the local easily producing chip burns out, and does not resolve high efficiency and heat radiation problem, uncomfortable Preferably high-power integrated packaging.

Inverted structure chip is to design in Different Plane by luminous zone and electrode district, at this moment then by electrode district facing to lamp Cup bottom is mounted, and can save this operation of bonding wire, but the required precision to die bond technique is higher, yields is relatively low.

In current high-power LED light source encapsulation technology, how using pottery or copper base, by above-mentioned LED chip Plant encapsulation on the substrate, thus forming high-efficiency heat radiation structure, such as COB encapsulation, will bare chip conduction or non-conductive adhesive Adhesion on the substrate, then carries out wire bonding and realizes its electrical connection.

Content of the invention

A kind of LED chip of polymorphic type assembled package module that this utility model provides at least includes planar chip, upside-down mounting In chip, positive polarity thin-film LED and reversed polarity thin-film LED two kinds, using the advantage of different chips, can solve The certainly current shortcoming that high-power LED light source light-emitting area is big or operating current is big, produces more preferable light-emitting area shape, and has The advantage of high voltage low current.

A kind of polymorphic type LED chip assembled package module, including LED chip and substrate it is characterised in that：On described substrate Have and constitute the current loop connecting LED chip, described LED chip quantity is two or more, be encapsulated in accordingly on described substrate；

Preferably, described two or multiple LED chips at least include planar chip, flip-chip, positive polarity vertical stratification Two or more in chip and reversed polarity thin-film LED；

Preferably, described baseplate material is pottery or metal.

Preferably, the substrate of described module uses surface-adhered type substrate or plate above formula substrate or mixing knot Structure；

Preferably, the optional single colored chip in 150-2000nm of the emission wavelength range of the plurality of LED chip, or Scribble the chip of fluorescent material, or white chip.

Brief description：

Fig. 1 is the LED modular structure schematic diagram of flip-chip and vertical chip assembled package

Fig. 2 is the LED modular structure schematic diagram of flip-chip and planar chip assembled package

Fig. 3 is the LED modular structure schematic diagram of vertical chip and planar chip assembled package

Fig. 4 is the LED modular structure schematic diagram of positive polarity vertical chip and reversed polarity vertical chip assembled package

Fig. 5 is that the LED modular structure that positive polarity vertical chip, reversed polarity vertical chip and plane chip portfolio encapsulate is illustrated Figure

Main element description of symbols：

1st, positive polarity vertical chip

11st, reversed polarity vertical chip

2nd, flip-chip

3rd, planar chip

4th, bonding wire

5th, substrate

Specific embodiment：

Below by embodiment, and combine accompanying drawing, the technical solution of the utility model is specifically described.

Fig. 1 is the LED modular structure illustrating flip-chip and vertical chip assembled package, and wherein middle chip is Flip-chip 2, that is, front is luminous zone, and the back side is electrode district, and wherein electrode district is mounted facing to substrate 5, and that is, bonding wire is equal Carry out in the contact surface of chip and substrate, such that it is able to save the link that intermediate chip welded by bonding wire 4 it is not necessary to right The chip of central area is electrically connected by very long bonding wire, and the positive polarity vertical chip 1 of surrounding, electrode is to tie up and down Chip positive pole is easily connected with anode by structure by bonding wire 4, and chip negative pole directly passes through substrate circuit layer and negative electrode phase Connect.Shown positive polarity vertical chip 1 or reversed polarity vertical chip 11, do not affect the application of the present embodiment.This reality Apply example and enormously simplify the bonding wire of LED module and the encapsulation process that a lot of chips of needs are packaged, and be with whole chips The structure of flip-chip is compared, and has more preferable heat dissipation characteristics.

Fig. 2 is the LED modular structure illustrating flip-chip and planar chip assembled package, and wherein middle is flip-chip 2, wherein electrode district is mounted facing to substrate 5, and that is, bonding wire is all carried out in the contact surface of chip and substrate, such that it is able to save The link that intermediate chip is welded by bonding wire 4 is it is not necessary to be electrically connected by very long bonding wire to the chip of central area Connect, the embodiment that its effect is shown with Fig. 1 is identical.Surrounding is planar chip 3, and the both positive and negative polarity of planar chip is located at same lighting On face, such that it is able to easily adjacent planar chip 3 be connected by bonding wire 4, simplify bonding wire flow process, and for Planar chip forms low current and high-tension power supply mode, reduces the requirement to outside high current constant-current circuit.

Fig. 3 is the LED modular structure of vertical chip and planar chip assembled package, centre is not easy to the plane of bonding wire Chip 3, by the way of similar Fig. 2 embodiment, adjacent plane chip 3 is connected, and forms the planar chip of cascaded structure, also may be used To carry out parallel connection, planar chip in parallel can form low current and high-tension power supply mode, reduce to outside high current The requirement of constant-current circuit.Using positive polarity vertical chip 1 it is easy to carry out wire-bonding operations, it is many that this embodiment is provided surrounding Kind of bonding wire compound mode, improves encapsulation motility, simplifies wire bonding process, and forms that global shape is rounded or other shapes Flexible chip package pattern.

Fig. 4 illustrates the LED modular structure of positive polarity vertical chip and reversed polarity vertical chip assembled package, i.e. positive polarity Vertical chip 1 is connected with reversed polarity vertical chip 11, compares than using the structure of same vertical chip, the letter of bonding wire flow process Change, easily form less light-emitting area it is possible to accept low current and high-tension power supply mode.

Fig. 5 illustrates the LED module knot of positive polarity vertical chip, reversed polarity vertical chip and the encapsulation of plane chip portfolio Structure, that is, positive polarity vertical chip 1 connected with reversed polarity vertical chip 11, then again with plane chip-in series, ratio using with A kind of structure of chip is compared, bonding wire process simplification, easily forms less light-emitting area, and forms low current and high-tension confession Electrically.

Above five kinds of embodiments, also have a beneficial effect, can also pass through the LED chip of different emission wavelengths Described embodiment flexible combination, forms the LED module of multiple different-waveband combinations, improves the rich of LED emission wavelength.

Embodiments above is only that this technology design and feature are described, its object is to allow person skilled in the art to understand Content of the present utility model is simultaneously carried out, and can not limit protection domain of the present utility model with this, all smart according to this patent God essence done etc. little change or modify be encompassed by protection domain of the present utility model.

Claims

1. a kind of polymorphic type LED chip assembled package module, including LED chip and substrate it is characterised in that：Have on described substrate Constitute the current loop connecting LED chip, described LED chip quantity is two or more, and encapsulation is on the substrate.

2. polymorphic type LED chip assembled package module according to claim 1 it is characterised in that：Described two or multiple LED chip at least includes two in planar chip, flip-chip, positive polarity thin-film LED and reversed polarity thin-film LED Kind.

3. polymorphic type LED chip assembled package module according to claim 1 it is characterised in that：Described baseplate material is Pottery or metal.

4. polymorphic type LED chip assembled package module according to claim 1 it is characterised in that：Described substrate adopts It is surface-adhered type substrate or plate above formula substrate or mixed structure.

5. polymorphic type LED chip assembled package module according to claim 1 it is characterised in that：The plurality of LED chip The single colored chip optional in 150-2000nm of emission wavelength range, or scribble the chip of fluorescent material, or white chip.