CN205943624U - Integrated passive component of piece formula - Google Patents
Integrated passive component of piece formula Download PDFInfo
- Publication number
- CN205943624U CN205943624U CN201620909412.1U CN201620909412U CN205943624U CN 205943624 U CN205943624 U CN 205943624U CN 201620909412 U CN201620909412 U CN 201620909412U CN 205943624 U CN205943624 U CN 205943624U
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- CN
- China
- Prior art keywords
- substrate
- electrode
- thick film
- integrated passive
- heat
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses an integrated passive component of piece formula, include the body and set up in the inside substrate of body, substrate bottom symmetry is equipped with the mounting groove, the substrate left side is connected with the first electrode, the substrate right side is connected with the second electrode, first electrode and second electrode bottom all are equipped with the cardboard, just cardboard and mounting groove correspond the setting, the substrate top is connected with the thick film resistor layer, thick film resistor layer top left and right sides symmetry is equipped with first protection film and second protection film. This integrated passive component of piece formula reasonable in design, use convenient operation, the stable performance, the reliability is high, realizes the effective protection to the substrate through a protection film and second protection film, through heat -conducting plate and heat radiation fins's design, realizes the heat dissipation function, prolongs the life on thick film resistor layer, has very high practicality, guarantees its result of use and utilization benefit, is fit for extensively promoting.
Description
【Technical field】
The utility model is related to a kind of passive element, particularly to a kind of chip integrated passive components.
【Background technology】
Passive element integration not only can solve the passive element bottleneck problem that electronic product microminaturization runs into, and
Assembly efficiency can be improved, reduce passive element installation cost, improve the whole electronic system ratio of performance to price and reliability,
Thus it is subject to the extensive concern of industrial circle.It is continually striving to through scientific and technological circle and business circles, in recent years in passive element integration skill
Art aspect has had remarkable progress, and a part of technology has been carried out commercialization, also has some technology to explore.Dimension limit
Under and the requirement of multifunction light, little, thin in electronic product, the package dimension of slice component is less and less.With package dimension
Constantly reduce, the manufacturing to slice component and surface mounting technology are proposed stern challenge, mounting technique difficulty
Increase made the package dimension of discrete slice component close to the limit, to improve packing density further must be requested that no
Source element is to integrated development.Installation cost develops to multifunction with electronic product, the electricity comprising in each electronic product
Sub- component number is continuously increased, so that so many components and parts are placed together spent assembly cost problem just highlighting
Out.According to statistics, passive element size reduction leads to installation cost significantly to rise, and one of effective ways of solution are exactly passive
Integrated.Highly reliable require under the overall situation of economic globalization, Market competition.The high reliability pursuing electronic product becomes
The important means of market competition.Passive integration is as the advantage that integrated circuit comes out then, it is possible to reduce solder joint, shortens even
Line, and the resistivity to moist, oxidation, burn into shock and vibration can be improved.
Resistor is commonly referred to resistance, is through commonly used passive element, chip integrated resistor of the prior art makes
Used time is easily damaged, and service life is short, lacks protection device it is impossible to meet the market demand.
【Utility model content】
Main purpose of the present utility model is to provide a kind of chip integrated passive components, a kind of this chip integrating passive unit
Part is reasonable in design, is suitable for being widely popularized using easy to operate, can be with the problem in effectively solving background technology.
For achieving the above object, the technical scheme that the utility model is taken is：
A kind of chip integrated passive components, including body and the substrate being arranged at body interior, described substrate bottom is symmetrical
It is provided with mounting groove, on the left of described substrate, is connected with first electrode, on the right side of described substrate, be connected with second electrode, described first electrode
It is equipped with clamp with second electrode bottom, and described clamp and mounting groove are correspondingly arranged, described substrate is connected with thick film electricity
Resistance layer, is symmetrically arranged on two with the first diaphragm and the second diaphragm about described thick film resistive layer top.
Further, it is provided with through hole inside described substrate, and described through-hole diameter is not more than 2/3rds of substrate width.
Further, described first electrode and second electrode are provided with solder layer in the junction with substrate.
Further, described thick film resistive layer top is provided with heat-conducting plate, and described heat-conducting plate top is provided with radiating fin.
Further, described thick film resistive layer bottom is additionally provided with heater.
Compared with prior art, the utility model has the advantages that：A kind of this chip integrated passive components design
Rationally, using easy to operate, substrate is high-purity mangesium oxide aluminum, stable performance, and reliability is high, by the design of through hole, drops
Low material cost, realizes the effective protection to substrate by the first diaphragm and the second diaphragm, by heat-conducting plate and dissipate
The design of hot fin, realizes heat sinking function, extends the service life of thick film resistive layer, and resistance value is variable, and conformability is good, very
The use of suitable modern factories, has very high practicality, greatly improves a kind of this use work(of chip integrated passive components
Energy property, it is ensured that its using effect and utilization benefit, is suitable for being widely popularized.
【Brief description】
Fig. 1 is a kind of overall structure diagram of the utility model chip integrated passive components.
In figure：1st, body；2nd, first electrode；3rd, solder layer；4th, through hole；5th, the first diaphragm；6th, heat-conducting plate；7th, heat radiating fin
Piece；8th, the second diaphragm；9th, thick film resistive layer；10th, heater；11st, substrate；12nd, second electrode；13rd, mounting groove；14th, clamp.
【Specific embodiment】
Technological means, creation characteristic, reached purpose and effect for making the utility model realize are easy to understand, below
In conjunction with specific embodiment, the utility model is expanded on further.
As shown in figure 1, a kind of chip integrated passive components, including body 1 and the substrate 11 being arranged within body 1, institute
State substrate 11 bottom symmetrical and be provided with mounting groove 13, on the left of described substrate 11, be connected with first electrode 2, described substrate 11 right side connects
Second electrode 12, described first electrode 2 and second electrode 12 bottom is had to be equipped with clamp 14, and described clamp 14 and mounting groove 13
It is correspondingly arranged, described substrate 11 top is connected with thick film resistive layer 9, is symmetrically arranged on two with about described thick film resistive layer 9 top
First diaphragm 5 and the second diaphragm 8.
Wherein, it is provided with through hole 4 inside described substrate 11, and the three of described through hole 4 diameter no more than substrate 11 width/
Two.
Wherein, described first electrode 2 and second electrode 12 are provided with solder layer 3 in the junction with substrate 11.
Wherein, described thick film resistive layer 9 top is provided with heat-conducting plate 6, and described heat-conducting plate 6 top is provided with radiating fin 7.
Wherein, described thick film resistive layer 9 bottom is additionally provided with heater 10.
It should be noted that the utility model is a kind of chip integrated passive components, during work, by first electrode 2 He
Second electrode 12 connects with external circuit respectively, and substrate 11 is high-purity mangesium oxide aluminum, stable performance, and reliability is high, passes through
First diaphragm 5 and the second diaphragm 8 realizing the effective protection to substrate 11, by setting of heat-conducting plate 6 and radiating fin 7
Have, realize heat sinking function, change the temperature of thick film resistive layer 9 by heater 10, thus realizing thick film resistive layer 9 resistance value
Changeability it is ensured that a kind of this utilization benefit of chip integrated passive components.
Of the present utility model general principle and principal character and of the present utility model advantage have been shown and described above.One's own profession
The technical staff of industry it should be appreciated that the utility model is not restricted to the described embodiments, described in above-described embodiment and specification
Principle of the present utility model is simply described, on the premise of without departing from the utility model spirit and scope, the utility model is also
Have various changes and modifications, these changes and improvements both fall within the range of claimed the utility model.The utility model
Claimed scope is by appending claims and its equivalent thereof.
Claims (4)
1. a kind of chip integrated passive components, including body（1）Be arranged at body（1）Internal substrate（11）, its feature exists
In：Described substrate（11）Bottom symmetrical is provided with mounting groove（13）, described substrate（11）Left side is connected with first electrode（2）, described
Substrate（11）Right side is connected with second electrode（12）, described first electrode（2）And second electrode（12）Bottom is equipped with clamp
（14）, and described clamp（14）And mounting groove（13）It is correspondingly arranged, described substrate（11）Top is connected with thick film resistive layer（9）,
Described thick film resistive layer（9）It is symmetrically arranged on two with the first diaphragm about top（5）With the second diaphragm（8）.
2. a kind of chip integrated passive components according to claim 1 it is characterised in that：Described substrate（11）Inside is provided with
Through hole（4）, and described through hole（4）Diameter is not more than substrate（11）2/3rds of width.
3. a kind of chip integrated passive components according to claim 1 it is characterised in that：Described first electrode（2）With
Two electrodes（12）And substrate（11）Junction be provided with solder layer（3）.
4. a kind of chip integrated passive components according to claim 1 it is characterised in that：Described thick film resistive layer（9）Top
Portion is provided with heat-conducting plate（6）, described heat-conducting plate（6）Top is provided with radiating fin（7）, described thick film resistive layer（9）Bottom is additionally provided with
Heater（10）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620909412.1U CN205943624U (en) | 2016-08-22 | 2016-08-22 | Integrated passive component of piece formula |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620909412.1U CN205943624U (en) | 2016-08-22 | 2016-08-22 | Integrated passive component of piece formula |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205943624U true CN205943624U (en) | 2017-02-08 |
Family
ID=57948319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620909412.1U Expired - Fee Related CN205943624U (en) | 2016-08-22 | 2016-08-22 | Integrated passive component of piece formula |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205943624U (en) |
-
2016
- 2016-08-22 CN CN201620909412.1U patent/CN205943624U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170208 Termination date: 20170822 |