CN205692865U - 反射镜式金属基板led封装结构 - Google Patents

反射镜式金属基板led封装结构 Download PDF

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Publication number
CN205692865U
CN205692865U CN201620543844.5U CN201620543844U CN205692865U CN 205692865 U CN205692865 U CN 205692865U CN 201620543844 U CN201620543844 U CN 201620543844U CN 205692865 U CN205692865 U CN 205692865U
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China
Prior art keywords
metallic plate
led
led wafer
type metal
metal basal
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Expired - Fee Related
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CN201620543844.5U
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English (en)
Inventor
黄琦
鲍量
黄强
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Hanshan Xingda Ductile Iron Plant
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Hanshan Xingda Ductile Iron Plant
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Priority to CN201620543844.5U priority Critical patent/CN205692865U/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种反射镜式金属基板LED封装结构，包括第一金属板、第二金属板、LED晶片、反射杯罩、荧光材料层，其特征在于：第一金属板和第二金属板之间设置绝缘材料填充槽，绝缘材料填充槽内填充绝缘材料，LED晶片设置在第二金属板上，LED晶片通过导线连接第一金属板，第一金属板和第二金属板的外侧设置反射杯罩，反射杯罩内填充荧光材料层，荧光材料层覆盖LED晶片和导线。本实用新型可提高反射率、散热效率，其方便封装。

Description

反射镜式金属基板LED封装结构
技术领域
本实用新型涉及一种LED封装结构，属于LED灯技术领域。
背景技术
LED是一个光电元件，其工作过程中只有10%-40%的电能转换成光能，其余的电能几乎都转换成热能，使LED的温度升高。LED升温是LED性能劣化及失效的主要原因。
在大功率LED中，散热是个大问题，如不加散热措施，则大功率LED的灯芯温度会急速上升，当其温度上升超过最大允许温度时（一般是150℃），大功率LED会因为过热而损坏。
为了使LED方便散热，LED模组具有一块基板，基板上设有LED发光元件，通常，基板为陶瓷基板或者金属基板。由于LED发光元件工作时产生大量的热量，因此，基板需要具备良好的导热、散热能力。因为方便散热的原因，铜基板在LED行业已经得到应用，但是现有技术的金属基板都是作为整个LED模组的基板，在金属基板上制作绝缘层和线路层，再在线路层上点胶安装LED芯片，现有技术从LED模组基板的角度解决散热问题，提高散热效果。但是现有技术中没有解决LED芯片点胶安装处的散热问题。
实用新型内容
为了进一步提高LED散热效果，延迟LED使用寿命，本实用新型提供了一种反射镜式金属基板LED封装结构，它采用金属基板作为LED晶片的支架，有助于提高LED散热效果。
本实用新型通过下述技术方案来实现。
一种反射镜式金属基板LED封装结构，包括第一金属板、第二金属板、LED晶片、反射杯罩、荧光材料层，其特征在于：第一金属板和第二金属板之间设置绝缘材料填充槽，绝缘材料填充槽内填充绝缘材料，LED晶片设置在第二金属板上，LED晶片通过导线连接第一金属板，第一金属板和第二金属板的外侧设置反射杯罩，反射杯罩内填充荧光材料层，荧光材料层覆盖LED晶片和导线。
第一金属板的上表面设有凹槽，第二金属板的上表面设有凹槽，反射杯罩的突出部分嵌入凹槽内。
进一步优选，第一金属板左下角设置缺口槽，第二金属板的右下角设置缺口槽。
本实用新型的技术效果：采用金属基板支撑LED晶片，能够辅助LED晶片散热，同时第一金属板与第二金属板还作为LED晶片的两个电极，采用反射杯罩提高反射率，从而提高亮度，并使得LED芯片与LED模组基板连接更为方便。本实用新型单元成本低、光通量单位成本低、高密度排列、高导热、可实现超薄封装、可根据需要选择单个产品的LED封装数量。
附图说明
图1为本实用新型的示意图。
具体实施方式
下面结合附图进一步说明本实用新型。
如图1所示，一种反射镜式金属基板LED封装结构，包括第一金属板1、第二金属板2、LED晶片5、反射杯罩6、荧光材料层3，第一金属板1和第二金属板2之间设置绝缘材料填充槽，绝缘材料填充槽内填充绝缘材料，LED晶片5设置在第二金属板2上，LED晶片5通过金线4连接第一金属板1，第一金属板1和第二金属板2的外侧设置反射杯罩6，反射杯罩6通过树脂成型获得，反射杯罩6提高反射率，可提高LED的亮度，反射杯罩6内填充荧光材料层3，荧光材料层3覆盖LED晶片5和金线4，其不但起到荧光效应，发出不同颜色的光，还起到固定LED晶片5和金线4的作用。
第一金属板1的上表面设有凹槽，第二金属板2的上表面设有凹槽，反射杯罩6的突出部分嵌入凹槽内，因为设置了凹槽状图形，可增大第一金属板1和第二金属板2与反射杯罩6的结合力，提高LED结构的稳定性。
所述第一金属板1和第二金属板2的材质为铜。第一金属板1和第二金属板2不但起到散热作用，还作为电极。
更特别的是，第一金属板1左下角设置缺口槽，第二金属板2的右下角设置缺口槽，便于后续LED模组封装。

Claims (3)

1.一种反射镜式金属基板LED封装结构，包括第一金属板、第二金属板、LED晶片、反射杯罩、荧光材料层，其特征在于：第一金属板和第二金属板之间设置绝缘材料填充槽，绝缘材料填充槽内填充绝缘材料，LED晶片设置在第二金属板上，LED晶片通过导线连接第一金属板，第一金属板和第二金属板的外侧设置反射杯罩，反射杯罩内填充荧光材料层，荧光材料层覆盖LED晶片和导线。
2.根据权利要求1所述的反射镜式金属基板LED封装结构，其特征在于：第一金属板的上表面设有凹槽，第二金属板的上表面设有凹槽，反射杯罩的突出部分嵌入凹槽内。
3.根据权利要求1所述的反射镜式金属基板LED封装结构，其特征在于：第一金属板左下角设置缺口槽，第二金属板的右下角设置缺口槽。
CN201620543844.5U 2016-06-07 2016-06-07 反射镜式金属基板led封装结构 Expired - Fee Related CN205692865U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10381281B2 (en) * 2016-01-22 2019-08-13 Kyocera Corporation Electronic component housing package, multi-piece wiring substrate, electronic apparatus, and electronic module having curved connection conductors

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10381281B2 (en) * 2016-01-22 2019-08-13 Kyocera Corporation Electronic component housing package, multi-piece wiring substrate, electronic apparatus, and electronic module having curved connection conductors
US10832980B2 (en) 2016-01-22 2020-11-10 Kyocera Corporation Electronic component housing package, multi-piece wiring substrate, electronic apparatus, and electronic module

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Granted publication date: 20161116

Termination date: 20170607