CN202268391U - Cob面光源封装结构 - Google Patents

Cob面光源封装结构 Download PDF

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Publication number
CN202268391U
CN202268391U CN2011203889372U CN201120388937U CN202268391U CN 202268391 U CN202268391 U CN 202268391U CN 2011203889372 U CN2011203889372 U CN 2011203889372U CN 201120388937 U CN201120388937 U CN 201120388937U CN 202268391 U CN202268391 U CN 202268391U
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metal substrate
encapsulating structure
area source
cob
structure according
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CN2011203889372U
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杨军
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HANGZHOU YOUWANG TECHNOLOGY Co Ltd
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HANGZHOU YOUWANG TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本实用新型涉及一种COB面光源封装结构，包括金属基板，金属基板上设有塑料构件，金属基板与塑料构件构成一个向上的反射凹杯，塑料构件内封装有导电片，金属基板的底面固定有一个或多个LED芯片，LED芯片的电极通过导线与导电片连接，导电片连有引脚导电端，反射凹杯的空腔内设有填充树脂。实用新型有益的效果是：本实用新型直接在高导热率金属基板上使用小功率LED芯片集成封装，可以分散热量、改善出光效果，出光面一致性好、无色斑、无眩光、光衰小。

Description

COB面光源封装结构
技术领域
本实用新型涉及LED灯领域，尤其是一种COB面光源封装结构。
背景技术
LED作为绿色、节能光源虽然在这几年得到大力的发展，但其光电转换效率不是很高，大部分的电能被转换为热能，随着LED功率的提高，其发热量也逐渐的增大，如果产生的热量不能及时地散发将极大的影响LED的正常工作，缩短其使用寿命。目前市场传统的COB封装结构主要是采用将大功率或小功率LED芯片集成封装在基板上的方式，基板分为金属和陶瓷基板，在金属基板上进行大功率和小功率LED芯片集成封装的方式中，由于大功率LED芯片发热量大、热量集中，以及金属基板上有一介电层(绝缘层)，因而存在散热较差等问题，这些问题最终导致基板发黄发黑、光效降低及光衰增大，从而造成LED产品不能使用；陶瓷基板虽然无上述问题，但成本较高，光效较低。另外，市场上还有一种将贴片LED焊接在基板上的应用方式，此种方式散热较差，因为贴片LED产生的热量必须先传到基板上，再由基板传导到散热装置上；热在传导过程中经过了两层介质的传导，其热传导效率受到了很大的递减；同时，此种方式还存在有明显的暗区及光斑等问题，这就需要安装扩散光线的外壳以抑制眩光，但对于眩光的抑制会造成光损耗。
发明内容
本实用新型要解决上述现有技术的缺点，提供一种分散热量，出光面一致性好的COB面光源封装结构。
本实用新型解决其技术问题采用的技术方案：这种COB面光源封装结构，包括金属基板，金属基板上设有塑料构件，金属基板与塑料构件构成一个向上的反射凹杯，塑料构件内封装有导电片，金属基板的底面固定有一个或多个LED芯片，LED芯片的电极通过导线与导电片连接，导电片连有引脚导电端，反射凹杯的空腔内设有填充树脂。
作为优选，所述金属基板上设有用于固定散热片的固定螺孔。
作为优选，所述金属基板的底面与LED芯片通过导热介质连接。
作为优选，金属基板采用铜、铝或高导热率合金制成。
作为优选，填充树脂采用环氧树脂、硅胶或其混合物。
作为优选，导线采用金线、银线或具导电好、延展性好的合金线制成。
作为优选，多个LED芯片可自由串、并组合。通过调整串、并组合方式对驱动电流、额定电压、标称功率作相应的调整。
实用新型有益的效果是：本实用新型直接在高导热率金属基板上使用小功率LED芯片集成封装，可以分散热量、改善出光效果，出光面一致性好、无色斑、无眩光、光衰小；且无须另外制作PCB板，不仅能减少制造工艺及其成本，在应用上可以节省模组制作和二次配光的成本，减少光损，适用于如射灯、球泡灯、筒灯等各类应用产品上。
附图说明
图1是本实用新型的俯视图；
图2是本实用新型的正面结构示意图；
附图标记说明：LED芯片1，导线2，填充树脂3，导热介质4，金属基板5，导电片6，引脚导电端7，固定螺孔8，反射凹杯9，塑料构件10。
具体实施方式
下面结合附图对本实用新型作进一步说明：
实施例：如图1、2，这种COB面光源封装结构，包括金属基板5，金属基板5上设有塑料构件10，金属基板5与塑料构件10构成一个向上的反射凹杯9，塑料构件10内封装有导电片6，金属基板5的底面设有通过导热介质4固定的LED芯片1，LED芯片1的电极通过导线2与导电片6连接，导电片6连有引脚导电端7，反射凹杯9的空腔内设有填充树脂3。LED芯片1工作时产生的热量通过其底部的导热介质4传递给金属基板5。
金属基板5材料采用铜、铝或高导热率合金制成。填充树脂3材质采用环氧树脂、硅胶或其混合物。导线2采用是金线、银线或合金线制成。多个LED芯片1可根据不同数量自由串、并组合，可以通过调整串、并组合方式对驱动电流、额定电压、标称功率作相应的调整。
在实际应用时，首先在引脚导电端7焊接两根导线连到驱动电源，然后用螺丝通过固定螺孔8固定在灯具散热片上即可使用。
除上述实施例外，本实用新型还可以有其他实施方式。凡采用等同替换或等效变换形成的技术方案，均落在本实用新型要求的保护范围。

Claims (7)

1.一种COB面光源封装结构，包括金属基板(5)，其特征是：金属基板(5)上设有塑料构件(10)，金属基板(5)与塑料构件(10)构成一个向上的反射凹杯(9)，塑料构件(10)内封装有导电片(6)，金属基板(5)的底面固定有一个或多个LED芯片(1)，LED芯片(1)的电极通过导线(2)与导电片(6)连接，导电片(6)连有引脚导电端(7)，反射凹杯(9)的空腔内设有填充树脂(3)。
2.根据权利要求1所述的COB面光源封装结构，其特征是：所述金属基板(5)上设有用于固定散热片的固定螺孔(8)。
3.根据权利要求1所述的COB面光源封装结构，其特征是：所述金属基板(5)的底面与LED芯片(1)通过导热介质(4)连接。
4.根据权利要求1所述的COB面光源封装结构，其特征是：所述金属基板(5)采用铜、铝或高导热率合金制成。
5.根据权利要求1所述的COB面光源封装结构，其特征是：所述填充树脂(3)采用环氧树脂、硅胶或其混合物。
6.根据权利要求1所述的COB面光源封装结构，其特征是：所述导线(2)采用金线、银线或具导电好、延展性好的合金线制成。
7.根据权利要求1所述的COB面光源封装结构，其特征是：所述的多个LED芯片(1)可自由串、并组合。
CN2011203889372U 2011-10-13 2011-10-13 Cob面光源封装结构 Expired - Fee Related CN202268391U (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103925568A (zh) * 2014-04-16 2014-07-16 深圳市得润电子股份有限公司 一种cob灯具防护支架
CN104037300A (zh) * 2013-03-08 2014-09-10 群创光电股份有限公司 发光二极管装置及显示装置及电子设备
CN112709937A (zh) * 2020-12-30 2021-04-27 深圳市新亿光光电有限公司 一种cob灯珠

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104037300A (zh) * 2013-03-08 2014-09-10 群创光电股份有限公司 发光二极管装置及显示装置及电子设备
CN103925568A (zh) * 2014-04-16 2014-07-16 深圳市得润电子股份有限公司 一种cob灯具防护支架
CN112709937A (zh) * 2020-12-30 2021-04-27 深圳市新亿光光电有限公司 一种cob灯珠

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