CN205507355U - Two -sided exposure system of slope is directly write to laser of perpendicular linear array of DMD projection light path - Google Patents
Two -sided exposure system of slope is directly write to laser of perpendicular linear array of DMD projection light path Download PDFInfo
- Publication number
- CN205507355U CN205507355U CN201620060016.6U CN201620060016U CN205507355U CN 205507355 U CN205507355 U CN 205507355U CN 201620060016 U CN201620060016 U CN 201620060016U CN 205507355 U CN205507355 U CN 205507355U
- Authority
- CN
- China
- Prior art keywords
- dmd
- light path
- linear array
- pcb board
- board part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a two -sided exposure system of slope is directly write to laser of perpendicular linear array of DMD projection light path, include: DMD integrated component (2) and PCB plate (3) of base (4) upper surface are arranged in with inclination, DMD integrated component (2) are two sets, incline parallel symmetric distribution in PCB plate (3) both sides, wherein, cross -distribution a plurality of DMD device projection light path (1) are carried out parallel simultaneously to PCB plate (3) A, B face with the angle slope and are expose in the Z axle direction of DMD integrated component (2), the utility model discloses a can expose simultaneously by the tow sides of exposure work piece in two sets of DMD device projection light paths of PCB plate both sides slope parallel arrangement for the efficiency of work promotes the one time, better improvement the productivity, guaranteed the quality of product simultaneously.
Description
Technical field
This utility model relates to a kind of exposure system, and the laser direct-writing of a kind of DMD projecting light path vertical linear array tilts double-sided exposure system, belongs to direct-write type lithography machine quick scan exposure technical field.
Background technology
Write-through photoetching technique be development in recent years faster, to substitute the direct transfer techniques of image of the board-like photoetching technique of traditional mask, in quasiconductor and PCB production field, have increasingly consequence；Utilize this technology with shortened process, and production cost can be reduced.
The direct-write type lithography machine of main flow is scanned exposure in single work stage mode mostly in the market: after the most first having been exposed in the A face being exposed workpiece, then carries out reprint, is then exposed B face；In single workpiece table system, for exposure substrate upper plate, be directed at, expose, lower plate is carried out successively.
According to current structural system, each operating process has reached the time-consuming upper limit, is difficult to shorten the operating time of certain operating procedure again, and the direct-write type lithography machine of i.e. single work stage, due to the serial nature of each operating process, has been difficult to improve production capacity more.
Summary of the invention
The problem existed for above-mentioned prior art, this utility model provides the laser direct-writing of a kind of DMD projecting light path vertical linear array to tilt double-sided exposure system, this system can expose the tow sides being exposed workpiece simultaneously, improves work efficiency further, thus improves production capacity.
To achieve these goals, the technical solution adopted in the utility model is: the laser direct-writing of a kind of DMD projecting light path vertical linear array tilts double-sided exposure system, including:
Tilt to be placed in DMD integrated package and the pcb board part of base upper surface；
Described DMD integrated package is two sets, dip-parallel is symmetrically distributed in pcb board part both sides；Wherein, pcb board part A, B face that in the Z-direction of DMD integrated package, same angle is tilted by cross-distribution multiple DMD device projecting light path carries out parallel exposure simultaneously.
Described angle of inclination is 1 ° to 98 °.
Described DMD integrated package top and bottom the most all the time with on pcb board part, bottom concordant.
The detachable base upper surface that is fixed on bottom described DMD integrated package, pcb board part is moving exposure on direction, angle of inclination.
With slot or click on fashion or be fixed on base bottom described DMD integrated package.
It is additionally provided with gathering sill so that pcb board part accurate rectilinear translation on angle of inclination at described pcb board part and base contacts.
Compared with existing single work stage scan exposure form, this utility model is exposed the tow sides of workpiece in the pcb board part both sides dip-parallel Liang Tao of setting DMD device projecting light path by can expose simultaneously, make the improved efficiency one times of work, preferably improve production capacity, ensure that the quality of product simultaneously.
Accompanying drawing explanation
Fig. 1 is this utility model system schematic.
In figure: 1, DMD device projecting light path, 2, DMD integrated package, 3, pcb board part, 4, base.
Detailed description of the invention
The utility model is described in further detail below in conjunction with the accompanying drawings.
Wherein, this utility model is on the basis of accompanying drawing 1, and left and right, upper and lower, the bottom of accompanying drawing 1, center, end are left and right, upper and lower, bottom of the present utility model, center, end.It should be noted that: unless specifically stated otherwise, positioned opposite, the numerical value etc. of the parts otherwise illustrated in the present embodiment is not limited to scope of the present utility model.
The laser direct-writing being illustrated in figure 1 a kind of DMD projecting light path vertical linear array tilts double-sided exposure system, including:
DMD integrated package 2 and the pcb board part 3 of base 4 upper surface it is placed in angle of inclination；
Described DMD integrated package 2 is two sets, dip-parallel is symmetrically distributed in pcb board part 3 both sides；Wherein, pcb board part 3A, B face that in the Z-direction of DMD integrated package 2, same angle is tilted by cross-distribution multiple DMD device projecting light path 1 carries out parallel exposure simultaneously, and A, B face here can also be called positive and negative.
Above-mentioned angle of inclination be angle of inclination be 1 ° to 98 °, concrete angle of inclination can be designed choosing according to practical situation.
Further, in order to ensure exposure rate, bottom described DMD integrated package 2 with top the most all the time with on pcb board part 3, bottom concordant.
Meanwhile, detachable bottom DMD integrated package 2 being fixed on base 4 upper surface, pcb board part 3 is moving exposure on direction, angle of inclination.
Above-mentioned detachable can be slot or click on fashion or be fixed on base 4, can select according to actual needs.
Simultaneously in order to ensure accurate rectilinear translation on pcb board part 3 is on angle of inclination, it is additionally provided with gathering sill at described pcb board part 3 with base 4 contact position.
In sum: compared with existing single work stage scan exposure form, this utility model is exposed the tow sides of workpiece on pcb board part 3 both sides by can expose with the dip-parallel Liang Tao of setting DMD device projecting light path 1 simultaneously, make the improved efficiency one times of work, preferably improve production capacity, ensure that the quality of product simultaneously.
It is obvious to a person skilled in the art that this utility model is not limited to the details of above-mentioned one exemplary embodiment, and in the case of without departing substantially from spirit or essential attributes of the present utility model, it is possible to realize this utility model in other specific forms.Therefore, no matter from the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, scope of the present utility model is limited by claims rather than described above, it is intended that all changes fallen in the implication of equivalency and scope of claim included in this utility model.Should not be considered as limiting involved claim by any reference in claim.
The above; it is only preferred embodiment of the present utility model; not in order to limit this utility model, every any trickle amendment, equivalent and improvement made above example according to technical spirit of the present utility model, within should be included in the protection domain of technical solutions of the utility model.
Claims (6)
1. the laser direct-writing of a DMD projecting light path vertical linear array tilts double-sided exposure system, it is characterised in that including:
DMD integrated package (2) and the pcb board part (3) of base (4) upper surface it is placed in angle of inclination；
Described DMD integrated package (2) is two sets, dip-parallel is symmetrically distributed in pcb board part (3) both sides；Wherein, pcb board part (3) A, B face that in the Z-direction of DMD integrated package (2), same angle is tilted by cross-distribution multiple DMD device projecting light path (1) carries out parallel exposure simultaneously.
The laser direct-writing of a kind of DMD projecting light path the most according to claim 1 vertical linear array tilts double-sided exposure system, it is characterised in that described angle of inclination is 1 ° to 98 °.
The laser direct-writing of a kind of DMD projecting light path the most according to claim 1 vertical linear array tilts double-sided exposure system, it is characterised in that described DMD integrated package (2) top and bottom, bottom parallel alignment upper with pcb board part (3) the most all the time.
The laser direct-writing of a kind of DMD projecting light path the most according to claim 2 vertical linear array tilts double-sided exposure system, it is characterized in that, described detachable base (4) upper surface that is fixed in DMD integrated package (2) bottom, pcb board part (3) moving exposure on direction, angle of inclination.
The laser direct-writing of a kind of DMD projecting light path the most according to claim 3 vertical linear array tilts double-sided exposure system, it is characterised in that described DMD integrated package (2) bottom with slot or click on fashion or is fixed on base (4).
The laser direct-writing of a kind of DMD projecting light path the most according to claim 3 vertical linear array tilts double-sided exposure system, it is characterized in that, described pcb board part (3) and base (4) contact position are additionally provided with gathering sill so that pcb board part (3) accurate rectilinear translation on angle of inclination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620060016.6U CN205507355U (en) | 2016-01-22 | 2016-01-22 | Two -sided exposure system of slope is directly write to laser of perpendicular linear array of DMD projection light path |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620060016.6U CN205507355U (en) | 2016-01-22 | 2016-01-22 | Two -sided exposure system of slope is directly write to laser of perpendicular linear array of DMD projection light path |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205507355U true CN205507355U (en) | 2016-08-24 |
Family
ID=56722226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620060016.6U Active CN205507355U (en) | 2016-01-22 | 2016-01-22 | Two -sided exposure system of slope is directly write to laser of perpendicular linear array of DMD projection light path |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205507355U (en) |
-
2016
- 2016-01-22 CN CN201620060016.6U patent/CN205507355U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104375388B (en) | A kind of multi-work piece platform direct-write photoetching system | |
| CN102681363B (en) | Multi-stage exchange system and exchange method for multi-station silicon wafer stage | |
| CN212433581U (en) | Photoetching system and substrate handover system thereof | |
| CN103913955A (en) | Double-sided photoetching machine and double-sided photoetching method | |
| CN205539926U (en) | Perpendicular two -sided exposure system is directly write to laser of perpendicular linear array of DMD projection optical path | |
| CN103635034A (en) | BGA (ball grid array) chip bonding pad printing solder paste positioning jig | |
| CN205507355U (en) | Two -sided exposure system of slope is directly write to laser of perpendicular linear array of DMD projection light path | |
| CN109240048A (en) | A kind of multistation work stage single exposure molding direct-write photoetching system | |
| CN104698769A (en) | Splicing and exposure method of sapphire substrate | |
| CN102890430A (en) | Device and method for adjusting power uniformity of exposure surface of direct-writing exposure machine | |
| TWI704431B (en) | Projection exposure device, projection exposure method, projection exposure control program, and exposure mask | |
| CN215219413U (en) | Photoetching machine | |
| CN105629681A (en) | Bearing base station, exposure device and exposure method | |
| CN113848683A (en) | Multi-station digital photoetching device and method based on vertical double-mesa structure | |
| KR101098927B1 (en) | Exposure apparatus | |
| CN205608391U (en) | Two -sided exposure system is directly write to projected laser of multirow cross arrangement DMD | |
| CN115392181B (en) | Layout design method based on external frame design, chip and terminal | |
| CN109075185A (en) | Micro- LED array is as irradiation source | |
| CN114077162A (en) | Photoetching system, substrate handover system and exposure method | |
| CN210803974U (en) | Exposure machine | |
| CN205539921U (en) | Two -sided exposure device of slope is directly write to laser | |
| CN205539922U (en) | Perpendicular two -sided exposure device is directly write to laser | |
| CN205539927U (en) | Two -sided exposure system of slope is directly write to DMD projection optical path laser | |
| CN105068387A (en) | Laser direct writing vertical double-sided exposure system | |
| CN111221223A (en) | Inner-layer plate exposure machine and marking method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 221000 west side of Hengshan Road, Pizhou City, Xuzhou City, Jiangsu Province Patentee after: Jiangsu Yingsu integrated circuit equipment Co., Ltd Address before: 221600 Huashan Road, Pizhou Economic Development Zone, Xuzhou, Jiangsu Patentee before: JIANGSU YINGSU PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address |