CN205141027U

CN205141027U - Ultraviolet LED encapsulates module

Info

Publication number: CN205141027U
Application number: CN201520997297.3U
Authority: CN
Inventors: 张建宝; 梁仁瓅; 胡聪
Original assignee: Wuhan Uv Ledtek Co Ltd
Current assignee: Wuhan Uv Ledtek Co Ltd
Priority date: 2015-12-07
Filing date: 2015-12-07
Publication date: 2016-04-06
Anticipated expiration: 2025-12-07

Abstract

The utility model discloses an ultraviolet LED encapsulates module, this structure includes the main part, the main part includes quartz lens, organic material, face down chip, attaches gold layer, ceramic substrate, face down chip attaches the gold layer and plates on ceramic substrate through the mode of electroplating on ceramic substrate, and organic material bonds at ceramic substrate with on attaching the gold layer through glue, and quartz lens bonds with glue on the step of organic material's hole groove. The utility model has the advantages of: replace traditional multilayer ceramic substrate with individual layer ALO or ALN ceramic substrate, replace one deck ceramic substrate topmost with organic material, it is easy to be more than punching on the ceramic plate to punch on organic material, the convenience also brought for subsequent maintenance. The utility model discloses a be international advance flip chip bonding technique, it is littleer than the thermal resistance of traditional golden soldering, can reduce the light decay of chip, and is reliable and stable moreover. Can very big degree reduce the manufacture craft of base plate and stability and the reliability that manufacturing cost can guarantee ultraviolet LED chip.

Description

A kind of ultraviolet LED encapsulation module

Technical field

The utility model relates to a kind of ultraviolet LED encapsulation module, especially a kind of module of ultraviolet LED encapsulation module.

Background technology

At present, the overwhelming majority needs the ceramic substrate of lid lens all to have multilayer material to be combined into, and uppermost ceramic material needs punching to place lens, this technique significantly increases manufacture craft difficulty and the production cost of plank, and this traditional ceramic substrate domestic can do little, our this ultraviolet LED encapsulation module is bonded by the ceramic substrate of individual layer and the organic material of layer of transparent, this transparent organic material needs to soak a period of time in the solution of antiultraviolet, to prevent transparent organic material variable color after Ultraviolet radiation, this method just can reduce the technique that the manufacture craft of plank and the traditional in addition ultraviolet LED encapsulation module of production cost are all tin cream technique or the positive welding equipment gold threads adopted greatly, tin cream technique is owing to there being one deck meson tin cream between chip and substrate, this can cause ultraviolet LED heat conduction to be affected thus affect light decay and the life-span of module, and positive welding equipment gold thread technique uses between chip and the both positive and negative polarity of substrate and the link of tiny gold thread, this gold thread is easy to disconnected and cost is higher, directly can affect the reliability of ultraviolet LED module, and the mode of our this eutectic UV LED chip and ceramic substrate is led to hypereutectic mode be fused together, the reliability that farthest can reduce thermal resistance therebetween and bonding is high.

Summary of the invention

The purpose of this utility model is to provide a kind of ultraviolet LED encapsulation module, the good heat dissipation effect of this ultraviolet LED encapsulation module, and can reduce production cost by high degree.

The technical solution of the utility model is: a kind of ultraviolet LED encapsulation module, and this structure comprises main body, and described main body comprises quartz lens, organic material, flip-chip, attached layer gold, ceramic substrate; Flip-chip is on ceramic substrate, and attached layer gold is plated on ceramic substrate by the mode of plating, and organic material is bonded in ceramic substrate and attached layer gold by glue, and quartz lens is bonding with glue on the hole slot step of organic material.

The utility model is intended to reduce the manufacture difficulty of traditional multilayer ceramic substrate, production cost and reliability, and traditional multilayer ceramic substrate, in order to ultraviolet chip being sealed, to need on the pottery of the superiors punching to place the effect that lens reach encapsulating chip; Pottery is very crisp, this brings great difficulty with regard to giving our punching, based on thinking above, if a kind of material can be found to replace uppermost one deck ceramic substrate for we and the heat radiation not affecting substrate just can reach and reduces the object that manufacture difficulty and production cost do not affect module reliability.

The utility model has the advantage of: replace traditional multilayer ceramic substrate with individual layer AlO or AlN ceramic; Replace one deck ceramic substrate topmost with organic material, punching is easy to many than punching on ceramic wafer on the organic material, the convenience also brought for follow-up maintenance.What the utility model adopted is international advanced face-down bonding technique, and it is less than the thermal resistance of traditional golden soldering, can reduce the light decay of chip, more reliable and more stable than traditional positive welding equipment gold thread.The manufacture craft of substrate and production cost can be reduced and ensure that it is reliable and stable by high degree.

Accompanying drawing explanation

Fig. 1 be the utility model structure blow structural representation;

Fig. 2 is ceramic substrate schematic diagram of the present utility model;

Fig. 3 is the utility model structure side view.

In figure:

1-quartz lens, 2-organic material, 3-flip-chip, the attached layer gold of 4-, 5-single-layer ceramic substrate.

Embodiment

A kind of ultraviolet LED encapsulation module, comprise main body, the quartz lens 1 that described main body comprises the light transmittance >90% of high printing opacity, organic material 2,385-405nm ultraviolet LED flip-chip 3, attached layer gold 4, individual layer AlO or the AlN ceramic 5 of soaking through special solution; Flip-chip 3 is at ceramic substrate 5, and attached layer gold 4 is plated on ceramic substrate 5 by the mode of plating, and organic material 2 glue is bonded in ceramic substrate 5 and attached layer gold 4, and quartz lens 1 is bonding with glue on the hole slot step of organic material 2.

385-405nm ultraviolet chip is led to hypereutectic mode to ultraviolet LED encapsulation module and golden tin layers is fused together, high degree reduces the thermal resistance of ultraviolet LED luminescence generation to the impact of light efficiency, and make traditional multilayer Al O or AlN ceramic into individual layer, and newly added on individual layer AlO or AlN ceramic one deck organic material be used for seal lens, this encapsulation mode can ensure that the sealing property of encapsulation module also can ensure that the light extraction efficiency of encapsulation module can also reduce manufacture craft difficulty greatly and become to produce cost, ensure that the reliability of ultraviolet LED module practicality.

Bonding one deck organic material above one way AlLO or AlN ceramic, this organic material, can not the variable color because of ultraviolet irradiation after the solution of antiultraviolet soaks, and can ensure the light extraction efficiency of ultraviolet light and practical stability simultaneously.

Can see in Fig. 23 chips and 5 individual layer AlO or AlN ceramic there is no gold thread link neither traditional tin cream technique, but have employed international advanced flip chip technology, by the attached layer gold on AlO or AlN ceramic under the protection of nitrogen and hydrogen, high temperature is melted at attached layer gold and UV LED chip is bonded together, and traditional method be with tin cream or gold thread by ultraviolet LED and ceramic substrate key with together with, the thermal resistance of traditional tin cream technique is comparatively large, and temperature has fatal impact to the life-span of LED and the decay of luminous flux; The thermal resistance that our this bonding pattern produces when farthest can reduce ultraviolet LED work is on the impact of ultraviolet LED light efficiency and can ensure the reliability of ultraviolet LED practicality.

In Fig. 3, quartz lens and organic material are sealed by AB glue 6, can play good sealing effectiveness, the light transmittance >90% of quartz lens, effectively can play the object 7 of optically focused, and reduce scattering and disappearing of luminous energy.

The flip-chip 3 of 385-405nm uses the mode die bond of eutectic on individual layer AlO or AlN ceramic 5 by ultraviolet LED encapsulation module, the thermal resistance of eutectic ratio tradition tin cream die bond is little, effectively can reduce the luminous flux attenuation of UV LED chip, and stablize than traditional positive welding equipment gold thread, because there is not the hidden danger of gold thread fracture in it, then organic material 2 is connected on ceramic substrate by AB is gluing, after last, quartz lens 1 is bonded in the encapsulation sealing ultraviolet LED in hole that organic material beats with AB glue, this encapsulation mode achieves the efficiency and production cost that also improve ultraviolet LED encapsulation while good level Hermetic Package improves the reliability of encapsulation and ensure that stability and the reliability of module, solve a ultraviolet LED encapsulation difficult problem.

Claims

1. a ultraviolet LED encapsulation module, is characterised in that: this structure comprises main body, and described main body comprises quartz lens (1), organic material (2), flip-chip (3), attached layer gold (4), ceramic substrate (5); Flip-chip (3) is on ceramic substrate (5), attached layer gold (4) is plated on ceramic substrate (5) by the mode of plating, organic material (2) is bonded in ceramic substrate (5) and attached layer gold (4) by glue, and quartz lens (1) is bonding with glue on the hole slot step of organic material (2).