CN204898063U - Niobium sputter pump and vacuum system - Google Patents
Niobium sputter pump and vacuum system Download PDFInfo
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- CN204898063U CN204898063U CN201520719593.7U CN201520719593U CN204898063U CN 204898063 U CN204898063 U CN 204898063U CN 201520719593 U CN201520719593 U CN 201520719593U CN 204898063 U CN204898063 U CN 204898063U
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Abstract
The utility model provides a niobium sputter pump and vacuum system belongs to the vacuum technique field, and vacuum system includes cavity, mechanical pump, molecular pump, ionic pump and niobium sputter pump, and the niobium sputter pump includes casing, direct current magnetron sputtering target rifle, inert gas entry and baffle, and direct current magnetron sputtering target rifle is the niobium target, is provided with the cavity in the casing, cavity and the cavity intercommunication of treating the evacuation, direct current magnetron sputtering target rifle is fixed on the casing and is stretched into the inside of casing, the work material of direct current magnetron sputtering target rifle is the niobium, and inert gas enters the mouth and runs through the casing and communicate with the cavity, and the gas outlet of inert gas entry sets up the one end near direct current magnetron sputtering target rifle at the cavity, the baffle sets up the inside at the casing. The niobium sputter pump adopts the magnetron sputtering principle to the niobium is the target, and through sputtering activated nanometer niobium membrane, gas such as oxygen in the chemisorption vacuum cavity and nitrogen effectively improves the vacuum of cavity.
Description
Technical field
The utility model relates to technical field of vacuum, in particular to a kind of niobium sputter pump and vacuum system.
Background technology
For vacuum system, vacuumize and maintain vacuum state pump used and be generally made up of multistage, be generally divided into: the first step is mechanical pump, highest attainable vacuum is 0.1Pa; The second stage is molecular pump, and be can entry into service molecular pump when mechanical pump is evacuated to below 10Pa, the highest attainable vacuum of molecular pump be 10
-6pa; The third stage is ionic pump, generally 10
-5can entry into service under the vacuum of Pa.These pumps with the use of the value that the vacuum of cavity just can be made to reach predetermined.Certainly, the vacuum pump of above-mentioned several rank can choice for use, might not all use.
The major cause that vacuum tightness is difficult to promote is that oxygen is difficult to be pumped, and is easily adsorbed onto on the wall of chamber.
Utility model content
The utility model provides a kind of niobium sputter pump and vacuum system, and the problems referred to above are improved, and effectively can improve the vacuum tightness of vacuum system.
The utility model is achieved in that
A kind of niobium sputter pump, comprising:
Housing, is provided with cavity in described housing, and described cavity is communicated with cavity to be vacuumized;
Magnetically controlled DC sputtering target rifle, described magnetically controlled DC sputtering target rifle is fixed on the housing and stretches into the inside of described housing, and described magnetically controlled DC sputtering target rifle adopts Nb target;
Inert gas entrance, described inert gas entrance run through described housing and with described cavity connects, the air outlet of described inert gas entrance is arranged on one end of the close described magnetically controlled DC sputtering target rifle of described cavity;
Baffle plate, described baffle plate is arranged on the inside of described housing.
Further, described baffle plate is rotatable baffle, and described rotatable baffle is connected with described housing into rotation, and described rotatable baffle is towards described magnetically controlled DC sputtering target rifle and can turn to towards described cavity.
Further, described housing is circular tube shaped, described magnetically controlled DC sputtering target rifle is arranged on one end away from described cavity of described housing, described rotatable baffle is arranged on one end of the close described cavity of described housing, described rotatable baffle is circular plate-like shape, the diameter of described rotatable baffle is less than the internal diameter of described housing, rotation axis is provided with in described housing, the axial line of described rotation axis is crossing with the axial line of described housing, and described rotatable baffle can do 360 degree of rotations around described rotation axis.
Further, described rotatable baffle manually control rotate or by Electronic control its rotate.
Further, described inert gas entrance is Ar gas entrance.
Further, described housing is provided with transparent viewing window, and described viewing window is embedded on the sidewall of described housing.
A kind of vacuum system, comprises cavity, mechanical pump, molecular pump, ionic pump and above-mentioned niobium sputter pump, and described cavity sealing, described mechanical pump, described molecular pump, described ionic pump are all communicated with described cavity with described niobium sputter pump.
Further, described mechanical pump is rotary vane mechanical pump or dry pump.
Further, described molecular pump is vertical molecular pump or horizontal molecular pump.
Compared with prior art, the beneficial effects of the utility model are: niobium sputter pump adopts principle of magnetron-sputtering, take niobium as target, by sputtering active nanometer niobium film, the gases such as the oxygen in chemisorption vacuum cavity and nitrogen, the vacuum tightness of effective raising cavity, with mechanical pump etc. with the use of the vacuumizing effect of vacuum system more excellent, effectively can improve the vacuum tightness of system after setting up niobium sputter pump in vacuum system.
Accompanying drawing explanation
The vacuum system schematic diagram that Fig. 1 provides for the utility model embodiment;
Fig. 2 is the principle of magnetron-sputtering schematic diagram of the niobium sputter pump of Fig. 1.
Cavity 101; Molecular pump 102; Mechanical pump 103; Ionic pump 104; Housing 105; Magnetically controlled DC sputtering target rifle 106; Inert gas entrance 107; Baffle plate 108; Viewing window 109.
Embodiment
The major cause that vacuum tightness is difficult to promote is that oxygen is difficult to be pumped, and is easily adsorbed onto on the wall of chamber.
The utility model provides a kind of niobium sputter pump, adopt principle of magnetron-sputtering, take niobium as target, oxygen in the nanometer niobium film energy chemisorption cavity sputtered and nitrogen, realize vacuumizing further cavity, with mechanical pump etc. with the use of the vacuumizing effect of vacuum pump set more excellent, effectively can improve the vacuum tightness of system after setting up niobium sputter pump in vacuum system.
For making the object of the utility model embodiment, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
As shown in Figure 1 and Figure 2, the utility model embodiment provides a kind of niobium sputter pump and vacuum system, vacuum system comprises cavity 101, mechanical pump 103, molecular pump 102, ionic pump 104 and niobium sputter pump, cavity 101 seals, and mechanical pump 103, molecular pump 102, ionic pump 104 are all communicated with cavity 101 with niobium sputter pump.
Niobium sputter pump preferably uses under the cooperation of mechanical pump 103 grade, and cavity 101 is generally spherical, and mechanical pump 103 grade forms vacuum attraction for niobium sputter pump, guarantees the work well of niobium sputter pump.
As the preferred version of this embodiment, mechanical pump 103 is rotary vane mechanical pump or dry pump.
Mechanical pump 103 is primarily of motor and pump housing two parts composition.Coventional type mechanical pump is rotated by belt drive pump shaft by motor, and direct linkage type mechanical pump is that motor is directly connected with pump shaft, eliminates intermediate transmission link.Mechanical pump 103 is the principles utilizing gas expansion, compression, discharge, what extract out in gas from vessel.Why be referred to as mechanical pump, be because it be utilize machinery method, the volume of suction muffler in periodic variation pump, makes the gas in container constantly expand in suction muffler by the inlet mouth of pump, then by compression and outside venting port overboard pump.
The mode changing suction muffler volume in pump has piston reciprocating type, stator formula and rotary vane type etc., be called reciprocating machine pump, stator formula mechanical pump and rotary vane mechanical pump, in actual applications, rotary vane mechanical pump frequency of utilization is the highest, also be the most practical, there is the performances such as use cost is lower, vacuumizing effect is excellent.
Rotary vane mechanical pump is prior art, only carries out general description at this, and rotary vane mechanical pump is primarily of part compositions such as cylindrical cavity stator, eccentric rotor, blade, spring, top cover and vent valves.The top of eccentric rotor remains and to contact with pump housing bore of stator, and when eccentric rotor rotates, the inwall all the time along stator slides.Rotor has two chutes, install a blade respectively, there is a spring centre, when blade rotates with rotor, by spring tension and centrifugal force, makes two blades be close to stator inner wall and slides.Whole cavity is placed in fuel tank.
Two blades are separated into A, B, C tri-parts the crescent-shaped space that rotor, bore of stator and Ding Gai surround, and are called suction muffler, compression chamber and discharge chamber respectively.When rotor rotates by certain direction, the volume of the space A communicated with inlet mouth constantly increases, the pressure in A space constantly reduces, when the pressure in A space is lower than by the pressure taken out in container, according to the principle of gas pressure intensity balance, suction muffler A is constantly drawn into by the gas taken out, now the volume in compression chamber B space reduces just gradually, gaseous tension constantly increases, the volume of the discharge chamber C simultaneously communicated with venting port reduces further, the space pressure of discharge chamber C raises further, when the pressure of gas is greater than drain pressure, pushed open vent valve by the gas compressed, drain in air through the oil reservoir in fuel tank.In the continuous operation process of pump, constantly carry out air-breathing, compression, exhaust process, thus reach the object of continuous air extraction.The rotating speed of obvious rotor is faster, then the pumping speed of pump is larger.The rotating speed of mechanical pump 103 is generally between 450-1400r/min, because rotating speed is too high, sealing is difficulty very.Vent valve is immersed in oil, enters in pump to prevent air flow.Air tight for ensureing between suction muffler and discharge chamber, except guarantee close contact, also adopt the special machinery pump oil that vapor pressure is lower, and make oil enter pump chamber by the gap on the pump housing, oilhole and vent valve, the surface of all motions in pump chamber is covered by oil, defines the sealing of suction muffler and discharge chamber.In addition mechanical pump oil also plays a part lubrication and helps to open drain tap when gas pressure intensity is lower.Simultaneously mechanical pump oil also can be full of some idle spaces, to eliminate their impacts on highest attainable vacuum.
Mechanical pump 103 discussed above only has a rotor, is called single-stage rotary vane type vacuum pump, and the ultimate pressure that it can reach is 1Pa.For improving ultimate pressure, usually adopting two-stage pump structure, being together in series by two single stage pumps, ultimate pressure can be made to reach the Pa order of magnitude.
As the preferred version of this embodiment, molecular pump 102 is vertical molecular pump or horizontal molecular pump.
Molecular pump 102, primarily of vertical and horizontal two kinds, for vertical molecular pump, moves the speed (be generally 150 ~ 400 meter per seconds) of linear velocity up to heat motion of gas molecules of impeller outer edge.The compression ratio of single impeller is very little, and turbomolecular pump will be taken turns by more than ten movable vanes and stationary blade wheel forms.Movable vane wheel and stationary blade wheel are alternately arranged.Dynamic and static impeller geometrical dimension is substantially identical, but blade pitch angle is contrary.A stationary blade wheel is filled between every two movable vanes wheel.Stationary blade wheel outer rim ring is fixed and is made to keep between dynamic and static impeller the gap of 1 millimeter, and movable vane wheel can rotate freely between stationary blade wheel.
Be diffuse scattering at the gas molecule of moving impeller both sides.On the left of impeller, when gas molecule arrives near A point, get back to left side at the gas molecule of angle [alpha] 1 internal reflection; Get back to left side in a gas molecule part for angle beta 1 internal reflection, another part arrives right side through blade; Directly right side will be arrived through blade at the gas molecule of angle γ 1 internal reflection.In like manner, on the right side of impeller, when gas molecule incides near B point, right side will be returned at the gas molecule of α 2 angle internal reflection; Arrive left side in a gas molecule part for β 2 angle internal reflection, another part returns to right side; Left side is arrived through blade at the gas molecule of γ 2 angle internal reflection.The motion of dihedral vane makes gas molecule arrive right side from left side through blade, more much bigger than the probability from right side through blade arrival left side.Impeller continuous rotation, gas molecule just constantly flows to right side by left side, thus produces air-extraction function.
The electronics moved in titanium pump anode canister, has axial velocity component Vz and radial velocity component Vr, because Vr is vertical with axial magnetic field Bz, electrons is subject to Lorentz force F=eVr & acute; Bz effect, so the electronics in anode canister is except being subject to axisymmetric electrical forces effect, is also subject to eVr & acute; The Lorentz force action of Bz, the motion of electronics is the wheel rolling curve motion on axial translational motion and cross section.On cross section, the size of electronics wheel rolling curve moving radius is the function of velocity of electrons and magneticstrength, velocity of electrons larger (anode voltage is higher), and the circle of wheel rolling curve is larger; Magnetic field is stronger, and the circle of wheel rolling curve is less.When anode voltage is higher, in order to avoid electronics " tumbles " on anode, a stronger axial magnetic field must be added.At axis direction, when the central cross-section motion of electronics anode cylinder, by the booster action of electrical forces, the speed of electronics is more and more large, and after crossing central cross-section, electrical forces plays inhibition and makes electronics do retarded motion, when negative plate, Vz decays to zero, the electronics oppositely accelerated motion by the booster action of electrical forces again, reduces speed now again after crossing central cross-section, so ceaselessly repeats above-mentioned motion.Electronics is just fallen on anode through very long distance in anode canister.A large amount of electronics, by magnetically confined, is pressed close to anode canister with the form of roller line and is rotated, form one deck electronic cloud.The rotation frequency of rotating electron cloud is about 100 order of megahertz, (individual/centimetre 3) magnitude that electron density can reach 1010.Above-mentioned phenomenon is called Penning discharge.
The electronic impact of gas molecule and rotation and being ionized, gaseous ion, under the effect of electric field, flies to and bombarding cathode titanium plate.Ion bombardment titanium plate produces two kinds of effects: 1, sputtered titanium, forms titanium film; 2, secondary electron is got.
The titanium atom sputtered out, is deposited on anode inwall and negative plate, forms the exhaust capacity that fresh titanium film maintains titanium pump.The sputtering ability of ion is different with the difference of the energy of incident ion, quality and input angle, and energy is large, and the sputtering ability of the ion that quality is large is also large; It is better than the effect of vertical bombardment to slant.In order to ensure the gettering ability of the titanium film on anode canister, enough sputtering rastes must be ensured, namely requiring enough voltage, to ensure that ion obtains enough bombarding energies.Ion bombardment titanium plate, can get secondary electron, and secondary electron enters in rotating electron cloud by electromagnetic field effect, supplements the electronics lost.While each gas molecule is ionized, all at least release an electronics, these electronics also enter in rotating electron cloud, and they compensate because going to the electronics that anode loses together with secondary electron, thus constantly can maintain Penning discharge.
Certainly, on the basis of the vacuum system provided at the present embodiment, can also set up titanium sublimation pump etc., the pumping mechanism of titanium sublimation pump (Ti sublimation pump) is chemisorption.The titanium of sublimer distillation is deposited on cold pump housing wall, form fresh titanium film, have than stronger adsorption (see table) to nitrogen, oxygen and carbon monoxide isoreactivity gas, and form the stable compound such as titanium nitride, titanium carbide and titanium oxide, but rare gas element and methane are adsorbed hardly.Titanium film adsorbed gas can only be unimolecular layer, can not adsorbed gas again on the position of adsorption gas molecule.Therefore, titanium sublimer must constantly distil, and makes pump housing wall constantly deposits new titanium film, just can reach the object of continuous air extraction.
In order to overcome the shortcoming of titanium sublimation pump absorption rare gas element difference, usually it and sputter ion pump 104 (see getter ion pump 104) with the use of or be combined into compound titanium pump, so just can play respective strong point.The pumping speed of titanium sublimation pump is large, and ionic pump 104 can take out rare gas element and methane, can obtain lower ultimate pressure.As first with taking out the sieve sorption pump of inert gas argon and reactive gas as pre vacuum pump, with these 3 kinds of pump composition units, without oil pollution, friction noise when bleeding, be obtain the important method without oily ultrahigh vacuum(HHV).
Titanium sublimation pump makes the vacuumizing effect of vacuum system more excellent.
In addition, as shown in Figure 1, the niobium sputter pump that the utility model embodiment provides comprises housing 105, magnetically controlled DC sputtering target rifle 106, inert gas entrance 107 and baffle plate 108.It should be noted that: niobium sputter pump can be applied in any ultravacuum system, be not limited to in above-mentioned vacuum system.Niobium sputter pump can use as a kind of sublimation pump, uses niobium sputter pump in specific vacuum system, and vacuum tightness can be made to be greatly improved.It should be noted that: niobium sputter pump may be used for, in any ultra-high vacuum system, being not limited in above-mentioned vacuum system.In specific vacuum system, use niobium sputter pump, continue again to vacuumize more than pump work half hour, vacuum tightness can be made to be greatly enhanced.Existing general ionic pump and titanium sublimation pump then need to work long hours.
Be provided with cavity in housing 105, cavity is communicated with cavity 101 to be vacuumized; Magnetically controlled DC sputtering target rifle 106 to be fixed on housing 105 and to stretch into the inside of housing 105; If housing 105 is cylindrical shape, then magnetically controlled DC sputtering target rifle 106 is fixed on the circle of cylindrical bottom surface, inert gas entrance 107 run through housing 105 and and cavity connects, the air outlet of inert gas entrance 107 is arranged on one end of the close magnetically controlled DC sputtering target rifle 106 of cavity 101; Baffle plate 108 is arranged on the inside of housing 105.
Niobium sputter pump adopts principle of magnetron-sputtering, and magnetron sputtering is the one of physical vapor deposition (PhysicalVaporDeposition, PVD).General sputtering method can be used to prepare many materials such as metal, semi-conductor, isolator, and have equipment simple, be easy to control, the advantage such as the large and strong adhesion of plated film area, and the magnetron sputtering method that the seventies in last century grows up achieves high speed, low temperature, low damage especially.Because be carry out high-speed sputtering at low pressure, the ionization level of gas effectively must be improved.Magnetron sputtering, by introducing magnetic field at target cathode surface, utilizes magnetic field to the constraint of charged particle to improve plasma density to increase sputtering raste.
As shown in Figure 2, principle of magnetron-sputtering: the principle of work of magnetron sputtering refers to that electronics is under the effect of electric field E, collides with ar atmo flying in substrate process, makes it ionize and produce Ar positive ion and new electronics; New electronics flies to substrate, and Ar ion accelerates to fly to cathode target under electric field action, and with high-energy bombardment target surface, target is sputtered.In sputtering particle, neutral target atom or molecule deposition form film on substrate, and the secondary electron produced can be subject to Electric and magnetic fields effect, produce the direction drift of E (electric field) × B (magnetic field) indication, be called for short E × B drift, its movement locus is similar to a cycloid.If toroidal magnetic field, then electronics just moves in a circle on target surface with approximate cycloid form, and their movement path is not only very long, and is bound in the heating region on target surface, and ionize a large amount of Ar in this region and bombard target, thus achieve high sedimentation rate.Along with the increase of collision frequency, the energy expenditure of secondary electron totally, gradually away from target surface, and is finally deposited on substrate under the effect of electric field E.Because the energy of this electronics is very low, the energy passing to substrate is very little, causes substrate temperature rise lower.
Magnetron sputtering is the collision process of projectile and target.Projectile experiences complicated scattering process in target, and target atom collision, and part momentum is passed to target atom, and this target atom collides with other target atoms again, forms cascade process.In this cascade process, the target atom of some near surface obtains enough momentum of outwards motion, leaves target sputtered out.
It should be noted is that: said niobium sputter pump is only it can be used as vacuum pump to use herein, it might not be the pump that can vacuumize, and, this niobium sputter pump be need with other vacuum pump as mechanical pump 103, molecular pump 102, ionic pump 104 etc. with the use of, other vacuum pump vacuumizes cavity 101, and this niobium sputter pump is normally worked.
Substrate in principle of magnetron-sputtering adopts baffle plate 108 to replace, and cavity 101 adopts mechanical pump 103 etc. to vacuumize.
As the preferred version of this embodiment, baffle plate 108 is rotatable baffle, and rotatable baffle and housing 105 are rotationally connected, and rotatable baffle is towards magnetically controlled DC sputtering target rifle 106 and can turn to towards cavity 101.
Baffle plate 108 can rotate, carrying out in magnetron sputtering process, rotatable baffle is towards magnetically controlled DC sputtering target rifle 106, and plated film is more abundant, after plated film completes, rotatable baffle can rotate, the axial line rotated is indefinite, can be the medullary ray rotation around self, also can be rotate around the side of self, towards cavity 101 after rotatable baffle rotation, more successfully chemisorption can be carried out to gases such as oxygen.
As the preferred version of this embodiment, housing 105 is circular tube shaped, magnetically controlled DC sputtering target rifle 106 is arranged on one end away from cavity 101 of housing 105, rotatable baffle is arranged on one end of the close cavity 101 of housing 105, rotatable baffle is circular plate-like shape, the diameter of rotatable baffle is less than the internal diameter of housing 105, certainly, also can be roughly equal, rotation axis is provided with in housing 105, the axial line of rotation axis is crossing with the axial line of housing 105, namely can think that rotation axis axial line overlaps with a wherein diameter of housing 105, the rotatable baffle moving axis that can rotate does 360 degree of rotations.
As the preferred version of this embodiment, rotation axis can vertically be arranged or arranged transversely, certainly, also can arrange along other directions, and rotatable baffle manually controls to rotate or rotated by Electronic control.
As the preferred version of this embodiment, magnetically controlled DC sputtering target rifle 106 adopts Nb target.
Nb magnetron sputtering target rifle is installed in the cavity 101 of vacuum, after this target rifle works in vacuum cavity 101, at the Nb nano thin-film that deposited on sidewalls one deck of baffle plate 108 is fresh, this layer film carries out chemisorption to the gas in cavity 101, effectively removes the O in cavity 101
2and N
2, role is the equal of a kind of novel vacuum pump, and vacuumizing effect is better.
Through overtesting, doing magnetron sputtering (principle of magnetron-sputtering sees appendix) metallizing niobium (Nb) discovery, the minimum vacuum be extracted into before plated film is 5 × 10
-7pa, plating is after Nb1 hour, take out one evening final vacuum be reduced to 2 × 10
-8pa, this is because, after magnetron sputtering Nb target, at the Nb nano thin-film that surface deposition one deck of vacuum cavity 101 is fresh, the result of O2 and N2 in this layer film chemisorption cavity 101, or there is chemical reaction in O2 and N2 in the process of sputtering Nb in a large amount of Nb ions and cavity 101, consumes the result of these two kinds of gases in cavity 101.Certainly, above-mentioned experimental result is not also suitable for all vacuum systems, need other vacuum pumps selected in conjunction with vacuum system, generally, about using niobium sputter pump that vacuum tightness can be made to improve half order of magnitude in specific vacuum system, be conducive to improving the purity of prepared material and the analysis etc. to experiment.
As the preferred version of this embodiment, inert gas entrance 107 is Ar gas entrance.
Magnetron sputtering must use the effect of rare gas element competence exertion, and the use of Ar gas is the most general, the better effects if of magnetron sputtering.
As the preferred version of this embodiment, housing 105 is provided with transparent viewing window 109, and viewing window 109 is embedded on the sidewall of housing 105.
Viewing window 109 can be the materials such as glass, and staff can observe the working order of niobium sputter pump inside by viewing window 109, regulate etc. at any time.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (10)
1. a niobium sputter pump, is characterized in that, comprising:
Housing, is provided with cavity in described housing, and described cavity is communicated with cavity to be vacuumized;
Magnetically controlled DC sputtering target rifle, described magnetically controlled DC sputtering target rifle is fixed on the housing and stretches into the inside of described housing, and described magnetically controlled DC sputtering target rifle adopts Nb target;
Inert gas entrance, described inert gas entrance run through described housing and with described cavity connects, the air outlet of described inert gas entrance is arranged on one end of the close described magnetically controlled DC sputtering target rifle of described cavity;
Baffle plate, described baffle plate is arranged on the inside of described housing.
2. niobium sputter pump according to claim 1, is characterized in that, described baffle plate is rotatable baffle, and described rotatable baffle is connected with described housing into rotation, and described rotatable baffle is towards described magnetically controlled DC sputtering target rifle and can turn to towards described cavity.
3. niobium sputter pump according to claim 2, it is characterized in that, described housing is circular tube shaped, described magnetically controlled DC sputtering target rifle is arranged on one end away from described cavity of described housing, described rotatable baffle is arranged on one end of the close described cavity of described housing, described rotatable baffle is circular plate-like shape, the diameter of described rotatable baffle is less than the internal diameter of described housing, rotation axis is provided with in described housing, the axial line of described rotation axis is crossing with the axial line of described housing, and described rotatable baffle can do 360 degree of rotations around described rotation axis.
4. niobium sputter pump according to claim 3, is characterized in that, described rotatable baffle manually controls to rotate or rotated by Electronic control.
5. the niobium sputter pump according to claim 1-4 any one, is characterized in that, described inert gas entrance is Ar gas entrance.
6. the niobium sputter pump according to claim 1-4 any one, it is characterized in that, described housing is provided with transparent viewing window, described viewing window is embedded on the sidewall of described housing.
7. a vacuum system, it is characterized in that, comprise cavity, mechanical pump, molecular pump, ionic pump and the niobium sputter pump described in claim 1-6 any one, described cavity sealing, described mechanical pump, described molecular pump, described ionic pump are all communicated with described cavity with described niobium sputter pump.
8. vacuum system according to claim 7, is characterized in that, described mechanical pump is rotary vane mechanical pump or dry pump.
9. vacuum system according to claim 7, is characterized in that, described molecular pump is vertical molecular pump.
10. vacuum system according to claim 7, is characterized in that, described molecular pump is horizontal molecular pump.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520719593.7U CN204898063U (en) | 2015-09-16 | 2015-09-16 | Niobium sputter pump and vacuum system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520719593.7U CN204898063U (en) | 2015-09-16 | 2015-09-16 | Niobium sputter pump and vacuum system |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108196502A (en) * | 2017-12-25 | 2018-06-22 | 中国科学院上海微系统与信息技术研究所 | ARPES vacuum systems, vacuum safety interlock system and vacuum safety interlocking method |
| CN108550636A (en) * | 2018-06-14 | 2018-09-18 | 浙江尚越新能源开发有限公司 | Flexible solar battery back electrode production equipment |
| CN108649007A (en) * | 2018-06-14 | 2018-10-12 | 浙江尚越新能源开发有限公司 | Flexible solar battery window layer production equipment |
| CN110689971A (en) * | 2019-10-29 | 2020-01-14 | 中国科学院合肥物质科学研究院 | High-speed projectile centrifugal acceleration system and method |
| CN115427606A (en) * | 2020-04-01 | 2022-12-02 | 佳能安内华股份有限公司 | Film forming apparatus, control apparatus for film forming apparatus, and film forming method |
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2015
- 2015-09-16 CN CN201520719593.7U patent/CN204898063U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108196502A (en) * | 2017-12-25 | 2018-06-22 | 中国科学院上海微系统与信息技术研究所 | ARPES vacuum systems, vacuum safety interlock system and vacuum safety interlocking method |
| CN108550636A (en) * | 2018-06-14 | 2018-09-18 | 浙江尚越新能源开发有限公司 | Flexible solar battery back electrode production equipment |
| CN108649007A (en) * | 2018-06-14 | 2018-10-12 | 浙江尚越新能源开发有限公司 | Flexible solar battery window layer production equipment |
| CN110689971A (en) * | 2019-10-29 | 2020-01-14 | 中国科学院合肥物质科学研究院 | High-speed projectile centrifugal acceleration system and method |
| CN115427606A (en) * | 2020-04-01 | 2022-12-02 | 佳能安内华股份有限公司 | Film forming apparatus, control apparatus for film forming apparatus, and film forming method |
| CN115427606B (en) * | 2020-04-01 | 2024-01-02 | 佳能安内华股份有限公司 | Film forming apparatus, control apparatus for film forming apparatus, and film forming method |
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