CN106978597A - A kind of magnetron sputtering coating system and the method that high-purity target membrane is prepared using it - Google Patents
A kind of magnetron sputtering coating system and the method that high-purity target membrane is prepared using it Download PDFInfo
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- CN106978597A CN106978597A CN201710232108.7A CN201710232108A CN106978597A CN 106978597 A CN106978597 A CN 106978597A CN 201710232108 A CN201710232108 A CN 201710232108A CN 106978597 A CN106978597 A CN 106978597A
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- magnetron sputtering
- target
- specimen holder
- coating
- sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
Abstract
The invention belongs to alloy coating technical field, a kind of method for being related to magnetron sputtering coating system and high-purity target membrane being prepared using it.Described magnetron sputtering coating system includes coating chamber, provides system, the pumped vacuum systems for carrying out vacuumize process to coating chamber for providing the argon gas of magnetron sputtering carrier gas argon gas to coating chamber, coating chamber includes sputtering target, can drive the rotating disk of rotation, the specimen holder on rotating disk by motor, sputtering target can carry out magnetron sputtering plating to just to the substrate installed on its specimen holder, wherein described sputtering target is multiple, the respectively sputtering target of different metal or different proportion of composing alloys.The method that high-purity target membrane is prepared with the magnetron sputtering coating system of the present invention and using it, can be coated with the metal film or alloy film of heterogeneity, content on substrate.
Description
Technical field
The invention belongs to alloy coating technical field, it is related to a kind of magnetron sputtering coating system and prepares high-purity using it
The method of target membrane.
Background technology
Target characteristic is one of important parameter of neutron tube, directly affects the indexs such as neutron tube yield, life-span, stability.Tritium
Target is the critical component of neutron tube.In the course of the work, ion gun ionizes deuterium to neutron tube, and the accelerated electrode of deuterium ion accelerates
After get in tritium target, reacted generation neutron with the tritium that is adsorbed in tritium target.
Tritium target material titanium, which has, to be inhaled in hydrogen isotope characteristic, the deuterium tritium gaseous mixture under certain air pressure, and titanium alternative is inhaled
Attached deuterium and tritium.The titanium for having adsorbed certain mol proportion deuterium tritium is placed in vacuum environment, optionally discharged in a heated condition
Deuterium and tritium.This selectivity may be defined as the deuterium tritium gas selectivity α as shown in following formula (1).
α=(T/D)solid/(T/D)gas (1)
In formula (1) (T/D)solidRepresent the mol ratio of tritium and deuterium in solid phase, (T/D)gasRepresent tritium in the mixed gas of release
With the mol ratio of deuterium.
As α ＞ 1, tritium target material tends to retain tritium and discharge deuterium under certain condition；Otherwise as 0 ＜ α ＜ 1, tritium
Target material tends to release tritium and absorbs deuterium under certain condition.
The use condition of neutron tube instrument determines neutron tube tritium target material under operating condition, and deuterium tritium separation should
Meet α ＞ 1.
Titanium maxter alloy is widely used Tritide Target in Neutron Generator material, the titanium deposition formation film on molybdenum end liner, can
Adsorption of hydrogen isotopes, especially under certain condition, can suck the tritium of high concentration.
Document shows, deuterium tritium gas selectivity α and the molybdenum stoichiometric number (i.e. molybdenum atom number percent) in alloy of titanium maxter alloy
Relevant, molybdenum stoichiometric number is smaller, inhales tritium ability stronger.For example at Ti: Mo=1: 2, deuterium tritium gas selectivity α is somebody's turn to do up to 1.87
The suction tritium capacity of alloy can only achieve 1.31 (Q/Ti)；It is appropriate to reduce Mo contents, make Ti: Mo=2: 1, deuterium tritium gas selectivity α is
1.61, the suction tritium capacity of alloy is up to 2.4.
But the titanium in titanium maxter alloy is a kind of active metal, in atmosphere the gas such as easy adsorption of oxygen, carbon dioxide,
Surface forms carbon oxygen contamination, so as to have a strong impact on the suction tritium speed of titanium film and inhale tritium capacity.
Magnetron sputtering method is one of vacuum coating technology, is widely used in being coated with titanium metal film and titanium alloy film.Magnetic control splashes
Penetrating the principle of technology is：
Apply magnetic field in the direction parallel with sputtering target surface, using electric field correlation vertical with magnetic field, make target surface
The electronics of transmitting is for the helical movement near target, and is collided with argon gas (Ar) molecule in environment.If electron energy is enough,
To then Ar be ionized out+With another electronics, wherein Ar+Negative electrode (i.e. sputtering target) is flown under electric field action and target surface is bombarded, makes target
Material atom sputtering comes out, and finally be deposited to substrate surface, forms film.Magnetron sputtering technique conditional stability, the sputtering speed of target
Rate is stable, can control passage time to realize the control of thickness, made film layer tack is good, fine and close, purity is higher.
Using magnetron sputtering technique, desired titanium maxter alloy film is met to be coated with, one is installed simultaneously typically in coating machine
Block frozen composition than titanium maxter alloy target and one piece of nickel target, one layer of titanium maxter alloy film is sputtered on substrate using titanium maxter alloy target,
Then protective nickel film is sputtered on alloy film surface using nickel target.Generally, this method can only be coated with frozen composition
The titanium maxter alloy film of ratio, if desired prepares the titanium maxter alloy film of different component, then needs to change corresponding titanium maxter alloy target.
Preparing high-purity alloy target membrane using magnetron sputtering method needs to meet following several conditions：1. sputtering target purity is high；
2. substrate surface is cleaned；Magnetron sputtering carrier gas 3. (Ar) purity is high；4. the coating chamber final vacuum height (plated film of reported in literature
Chamber final vacuum is general 1 × 10-3~2 × 10-4Between Pa).
The content of the invention
The present invention primary and foremost purpose be to provide a kind of magnetron sputtering coating system, with can be coated with substrate heterogeneity,
The metal film or alloy film of content.
In order to achieve this, in the embodiment on basis, the present invention provides a kind of magnetron sputtering coating system, and it includes
Coating chamber, for coating chamber provide magnetron sputtering carrier gas argon gas argon gas provide system, for being carried out to coating chamber
The pumped vacuum systems of vacuumize process,
Coating chamber includes sputtering target, can drive the rotating disk of rotation, the specimen holder on rotating disk by motor,
Sputtering target can carry out magnetron sputtering plating to just to the substrate installed on its specimen holder,
Wherein described sputtering target is multiple, the respectively sputtering target of different metal or different proportion of composing alloys.
In a preferred embodiment, the present invention provides a kind of magnetron sputtering coating system, wherein described plated film
The outer wall materials of chamber are stainless steel, and stainless steel surfaces externally and internally is by ion polishing processing.
In a preferred embodiment, the present invention provides a kind of magnetron sputtering coating system, wherein described plated film
Chamber outer wall is spherical, using high vacuum knife-edge flange seal.
In a preferred embodiment, the present invention provides a kind of magnetron sputtering coating system, wherein described argon gas
Offer system includes Argon Purifier, the purity for improving the argon gas for entering coating chamber.
In a preferred embodiment, the present invention provides a kind of magnetron sputtering coating system, wherein described respectively splashes
Shooting at the target has Individual baffle, and to prevent in single sputtering target sputter procedure, sputter metal atoms are got on other sputtering targets.
In a preferred embodiment, the present invention provides a kind of magnetron sputtering coating system, wherein described sputtering
Target is 4, respectively titanium target, molybdenum target, strong magnetic nickel target and titanium maxter alloy target.
In a kind of more preferred embodiment, the present invention provides a kind of magnetron sputtering coating system, wherein described
Molybdenum atom number percent is 5-15% in titanium maxter alloy target.
In a preferred embodiment, the present invention provides a kind of magnetron sputtering coating system, wherein described sample
The quantity of frame is 4, is evenly and symmetrically distributed on described rotating disk.
In a kind of more preferred embodiment, the present invention provides a kind of magnetron sputtering coating system, wherein each sample
Installable substrate quantity is 1-6 on product frame.
In a kind of more preferred embodiment, the present invention provides a kind of magnetron sputtering coating system, wherein described
Specimen holder is can drive the specimen holder of rotation by motor, so that each substrate installed on specimen holder can be just to sputtering target.
In a preferred embodiment, the present invention provides a kind of magnetron sputtering coating system, wherein described plated film
Also include the heat block being arranged on specimen holder in chamber, for carrying out heated baking degasification to the substrate installed on specimen holder,
Remove the impurity of substrate surface absorption.
In a preferred embodiment, the present invention provides a kind of magnetron sputtering coating system, wherein described plated film
Also include argon-ion gun in chamber, for spraying argon gas cleaning substrate surface.
In a preferred embodiment, the present invention provides a kind of magnetron sputtering coating system, wherein described magnetic control
Sputter coating system also includes vacuum measurement instrument, for being monitored to the vacuum in coating chamber.
Second object of the present invention provides a kind of side that high-purity target membrane is prepared using foregoing magnetron sputtering coating system
Method, so that the metal film or alloy film of heterogeneity, content can be coated with substrate.
In order to achieve this, in the embodiment on basis, the present invention provides one kind and utilizes foregoing magnetron sputtering membrane system
Controlling is for the method for high-purity target membrane, and described method comprises the following steps (wherein (2) step and (3) step repeat)：
(1) coating chamber is vacuumized using pumped vacuum systems, to reach the vacuum required for magnetron sputtering plating
Degree；
(2) motor drives turntable rotation, the substrate installed on specimen holder is directed at the sputtering target for needing to plate corresponding membrane；
(3) operate sputtering target, under an argon atmosphere to its just to specimen holder on substrate carry out sputter coating.
In a preferred embodiment, present invention offer one kind is prepared high-purity using foregoing magnetron sputtering coating system
The method of target membrane is spent, 450 DEG C of high-temperature bakings are also carried out wherein in step (1) to the substrate on specimen holder, and it is first in coating system
It is secondary when using or for a long time after by coating chamber integrally by the high-temperature baking that maximum temperature is 200 DEG C, abundant degasification.
The beneficial effects of the present invention are prepare high-purity target membrane with the magnetron sputtering coating system of the present invention and using it
Method, the metal film or alloy film of heterogeneity, content can be coated with substrate.And can also be cleaned by improving substrate surface
Degree, carrier gas purity of argon and/or coating chamber vacuum (can reach 2.0 × 10-6Pa), to improve plated film purity.
Brief description of the drawings
Fig. 1 is the composition figure of exemplary magnetron sputtering coating system of the invention.
Fig. 2 is element depth analysis in the multicoating prepared using exemplary magnetron sputtering coating system of the invention
Result figure.
Embodiment
The embodiment of the present invention is further illustrated below in conjunction with accompanying drawing.
The composition of exemplary magnetron sputtering coating system of the invention including coating chamber 1 as shown in figure 1, (include again
Spherical outer wall 9 and installed in its internal sputtering target 5, rotating disk 6, specimen holder 7, argon-ion gun 8, heat block), for plating membrane cavity
The argon gas that room 1 provides magnetron sputtering carrier gas argon gas provides system, is for carrying out vacuumizing for vacuumize process to coating chamber 1
System, the vacuum measurement instrument 4 for being monitored to the vacuum in coating chamber 1.
Sputtering target 5 has four, is evenly distributed on the lower semisphere of spherical coating chamber 1, respectively titanium target, molybdenum target, strong
Molybdenum atom number percent is 10% in magnetic nickel target and titanium maxter alloy target, wherein titanium maxter alloy target.Each sputtering target 5 has independent gear
Plate, to prevent in the single sputter procedure of sputtering target 5, sputter metal atoms are got on other sputtering targets 5.
Rotating disk 6 is arranged on the episphere of coating chamber 1, can be driven and rotated by motor, 4 are uniformly and symmetrically distributed thereon can
The specimen holder 7 of rotation is driven by motor.6 15 × 1mm of Φ or 4 22 × 0.5mm of Φ base can be installed on each specimen holder 7
Piece (being molybdenum base piece).
By the rotation and the rotation of specimen holder 7 of rotating disk 6, each substrate installed on specimen holder 7 can be made just to any one
Individual sputtering target 5.In coating process, the sputtering aura of a sputtering target 5 can institute of the uniform irradiation just to being installed on its specimen holder 7
There is substrate, therefore, coated product is reproducible.
Argon-ion gun 8 is used to spray argon gas cleaning substrate surface.Heat block is arranged on specimen holder 7, for each sample
The substrate installed on product frame 7 carries out the heated baking degasification that maximum temperature is 500 DEG C, removes the impurity of substrate surface absorption.
The spherical material of outer wall 9 is stainless steel, using high vacuum knife-edge flange seal.Appearance in the stainless steel of spherical outer wall 9
Face is handled by ion polishing, to reach preferable surface smoothness.Coating chamber 1 integrally have passed through under the state that vacuumizes
200 DEG C of high-temperature bakings, abundant degasification, its interior final vacuum is up to 2.0 × 10-6Pa。
Argon gas, which provides system, includes Argon Purifier 2, argon gas (input argon of 2 pairs of the Argon Purifier from high-purity argon gas cylinder
Gas purity is 4N5) send into after purification coating chamber 1 as carrier gas (output argon gas impurity content is less than 50ppb).
Pumped vacuum systems realizes vacuum action by the vavuum pump 3 outside coating chamber 1.
The magnetron sputtering coating system of the invention of above-mentioned example it is exemplary prepare high-purity titanium molybdenum alloy plated film
Method is as follows：
(1) coating chamber 1 is vacuumized using pumped vacuum systems, and the substrate on specimen holder 7 carried out 450 DEG C high
Temperature baking, and also dry the entirety of coating chamber 1 by 200 DEG C of high temperature when coating system is used first or for a long time without rear
It is roasting, to reach the vacuum required for magnetron sputtering plating；
(2) motor drives the rotation of rotating disk 6 and the rotation of specimen holder 7, the substrate installed on specimen holder 7 is directed at titanium target and is splashed
Penetrate plated film；
(3) motor drives the rotation of rotating disk 6 and the rotation of specimen holder 7, the substrate installed on specimen holder 7 is directed at molybdenum target and is splashed
Penetrate plated film；
(4) titanium target and molybdenum target are recycled and sputter coating is carried out to the substrate on same sample frame 7, each followed by adjustment
The sputtering time of the target of ring two and circulation coating times, can be achieved different titanium molybdenum contents than alloy film be coated with；
(5) last motor drives the rotation of rotating disk 6 and the rotation of specimen holder 7, the substrate installed on specimen holder 7 is directed at strong magnetic nickel
Target carries out sputter coating, titanium maxter alloy coated surface is sputtered one layer of nickel.
Table 1 below is uses the above method, the group of the titanium maxter alloy prepared under different step (4) operating conditions
Into situation.
The composition situation of the titanium maxter alloy prepared under the different step of table 1 (4) operating condition
Wherein, each circulation titanium target sputtering time is 0.5h in exemplary step (4), and molybdenum target sputtering time is
2min, in the case that circulation coating times are 10 times, concentration of element in the target membrane as obtained by glow discharge spectrometry analysis is final
With the regularity of distribution of depth direction, its result is as shown in Figure 2.From figure 2 it can be seen that carbon oxygen element is mainly distributed on surface nickel
Layer, and titanium molybdenum layer has no oxygen distribution, and carbon content is less than 0.3at%.This explanation carbon oxygen element is to contact air after plated film is sampled
When institute's adsorbing contaminant, high-purity titanium molybdenum alloy film can be prepared using this method.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention
God and scope.So, if these modifications and variations to the present invention belong to the model of the claims in the present invention and its equivalent technology
Within enclosing, then the present invention is also intended to comprising including these changes and modification.Above-described embodiment or embodiment are simply to the present invention
For example, the present invention can also be implemented with other ad hoc fashions or other particular form, without departing from the present invention's
Main idea or substantive characteristics.Therefore, it is regarded as from the point of view of the embodiment of description is in terms of any illustrative and non-limiting.This
The scope of invention should be illustrated that any change equivalent with the intention and scope of claim should also be included by appended claims
Within the scope of the invention.
Claims (10)
1. a kind of magnetron sputtering coating system, including coating chamber, for providing magnetron sputtering carrier gas argon gas to coating chamber
Argon gas provides system, the pumped vacuum systems for carrying out vacuumize process to coating chamber,
Coating chamber includes sputtering target, can drive the rotating disk of rotation, the specimen holder on rotating disk by motor,
Sputtering target can carry out magnetron sputtering plating to just to the substrate installed on its specimen holder,
It is characterized in that：
Described sputtering target is multiple, the respectively sputtering target of different metal or different proportion of composing alloys.
2. magnetron sputtering coating system according to claim 1, it is characterised in that：The outer wall materials of described coating chamber
For stainless steel, and stainless steel surfaces externally and internally is handled by ion polishing；Described coating chamber outer wall is spherical, using high vacuum
Edge of a knife flange seal.
3. magnetron sputtering coating system according to claim 1, it is characterised in that：Described argon gas, which provides system, includes argon
Gas purifier, the purity for improving the argon gas for entering coating chamber.
4. magnetron sputtering coating system according to claim 1, it is characterised in that：Described sputtering target is 4, is respectively
Titanium target, molybdenum target, strong magnetic nickel target and titanium maxter alloy target.
5. magnetron sputtering coating system according to claim 1, it is characterised in that：The quantity of described specimen holder is 4,
It is evenly and symmetrically distributed on described rotating disk.
6. magnetron sputtering coating system according to claim 5, it is characterised in that：Installable substrate on each specimen holder
Quantity is 1-6.
7. magnetron sputtering coating system according to claim 6, it is characterised in that：Described specimen holder is that can pass through motor
The specimen holder of rotation is driven, so that each substrate installed on specimen holder can be just to sputtering target.
8. magnetron sputtering coating system according to claim 1, it is characterised in that：Also include peace in described coating chamber
Heat block on specimen holder, for carrying out heated baking degasification to the substrate installed on specimen holder, removes substrate surface and inhales
Attached impurity.
9. magnetron sputtering coating system according to claim 1, it is characterised in that：Also include argon in described coating chamber
Ion gun, for spraying argon gas cleaning substrate surface.
10. the method that a kind of any described magnetron sputtering coating systems of utilization claim 1-9 prepare high-purity target membrane, including
Following steps：
(1) coating chamber is vacuumized using pumped vacuum systems, to reach the vacuum required for magnetron sputtering plating；
(2) motor drives turntable rotation, the substrate installed on specimen holder is directed at the sputtering target for needing to plate corresponding membrane；
(3) operate sputtering target, under an argon atmosphere to its just to specimen holder on substrate carry out sputter coating.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108486527A (en) * | 2018-06-21 | 2018-09-04 | 江苏时代华宜电子科技有限公司 | A kind of nickel plating technology of molybdenum alloy substrate |
| CN110531403A (en) * | 2019-09-12 | 2019-12-03 | 中国科学院兰州化学物理研究所 | A method of it is distributed using deuterium content in radio frequency glow discharge spectrometer detection tungsten |
| CN113573458A (en) * | 2021-06-11 | 2021-10-29 | 中科超睿(青岛)技术有限公司 | Nano-gradient neutron target and preparation method thereof |
| CN114182205A (en) * | 2021-12-10 | 2022-03-15 | 中国工程物理研究院材料研究所 | Nano multilayer structure metal hydrogen absorption film and preparation method and application thereof |
| CN114250441A (en) * | 2021-12-23 | 2022-03-29 | 黑龙江省原子能研究院 | Method for preparing bismuth-antimony alloy coating with uniform surface and stable combination by magnetron sputtering |
| CN115478253A (en) * | 2022-09-20 | 2022-12-16 | 中核四0四有限公司 | Method for plating radioactive metal film and film-plated pipe |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2422291Y (en) * | 2000-06-07 | 2001-03-07 | 中国科学院沈阳科学仪器研制中心 | Vacuum coating film device |
| JP2010105137A (en) * | 2008-10-31 | 2010-05-13 | Sumitomo Electric Ind Ltd | Surface-coated cutting tool |
| CN103103486A (en) * | 2011-11-11 | 2013-05-15 | 中国科学院沈阳科学仪器研制中心有限公司 | Magnetron sputtering system |
| CN103397300A (en) * | 2013-08-06 | 2013-11-20 | 中国钢研科技集团有限公司 | Multifunctional experiment device and method for deposition of zinc alloy coating |
| CN103668092A (en) * | 2012-09-24 | 2014-03-26 | 中国科学院大连化学物理研究所 | Plasma assisted magnetron sputtering depositing method |
| CN203922729U (en) * | 2014-04-10 | 2014-11-05 | 天津博利明科技有限公司 | Argon purification device |
-
2017
- 2017-04-11 CN CN201710232108.7A patent/CN106978597A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2422291Y (en) * | 2000-06-07 | 2001-03-07 | 中国科学院沈阳科学仪器研制中心 | Vacuum coating film device |
| JP2010105137A (en) * | 2008-10-31 | 2010-05-13 | Sumitomo Electric Ind Ltd | Surface-coated cutting tool |
| CN103103486A (en) * | 2011-11-11 | 2013-05-15 | 中国科学院沈阳科学仪器研制中心有限公司 | Magnetron sputtering system |
| CN103668092A (en) * | 2012-09-24 | 2014-03-26 | 中国科学院大连化学物理研究所 | Plasma assisted magnetron sputtering depositing method |
| CN103397300A (en) * | 2013-08-06 | 2013-11-20 | 中国钢研科技集团有限公司 | Multifunctional experiment device and method for deposition of zinc alloy coating |
| CN203922729U (en) * | 2014-04-10 | 2014-11-05 | 天津博利明科技有限公司 | Argon purification device |
Non-Patent Citations (2)
| Title |
|---|
| 王成彪等: "《摩擦学材料及表面工程》", 28 February 2012, 国防工业出版社 * |
| 陈光华等: "《新型电子薄膜材料》", 30 September 2002, 化学工业出版社 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108486527A (en) * | 2018-06-21 | 2018-09-04 | 江苏时代华宜电子科技有限公司 | A kind of nickel plating technology of molybdenum alloy substrate |
| CN110531403A (en) * | 2019-09-12 | 2019-12-03 | 中国科学院兰州化学物理研究所 | A method of it is distributed using deuterium content in radio frequency glow discharge spectrometer detection tungsten |
| CN113573458A (en) * | 2021-06-11 | 2021-10-29 | 中科超睿(青岛)技术有限公司 | Nano-gradient neutron target and preparation method thereof |
| CN114182205A (en) * | 2021-12-10 | 2022-03-15 | 中国工程物理研究院材料研究所 | Nano multilayer structure metal hydrogen absorption film and preparation method and application thereof |
| CN114250441A (en) * | 2021-12-23 | 2022-03-29 | 黑龙江省原子能研究院 | Method for preparing bismuth-antimony alloy coating with uniform surface and stable combination by magnetron sputtering |
| CN114250441B (en) * | 2021-12-23 | 2023-12-08 | 黑龙江省原子能研究院 | Method for preparing bismuth-antimony alloy coating with uniform surface and stable combination by utilizing magnetron sputtering |
| CN115478253A (en) * | 2022-09-20 | 2022-12-16 | 中核四0四有限公司 | Method for plating radioactive metal film and film-plated pipe |
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Application publication date: 20170725 |