CN204892294U - UV glues automatic temperature control solidification system - Google Patents
UV glues automatic temperature control solidification system Download PDFInfo
- Publication number
- CN204892294U CN204892294U CN201520607045.5U CN201520607045U CN204892294U CN 204892294 U CN204892294 U CN 204892294U CN 201520607045 U CN201520607045 U CN 201520607045U CN 204892294 U CN204892294 U CN 204892294U
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- China
- Prior art keywords
- carrier band
- cure system
- automatically controlled
- glue
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a UV glues automatic temperature control solidification system. UV glues automatic temperature control solidification system includes control system and solidification system, control system and solidification system electric connection, control system includes carrier band, photoelectric sensor and data controller, photoelectric sensor quantity is two, all locates the one end of carrier band, data controller with two photoelectric sensor electricity is connected. The utility model provides a UV glues automatic temperature control solidification system has product quality height, advantage that production efficiency is high.
Description
Technical field
The utility model relates to IC card chip encapsulation technology, especially, relates to the temperature automatically controlled cure system of a kind of UV glue.
Background technology
In IC chip card production process, dripping glue process is in IC card chip encapsulation after paster, bonding wire operation, for the link that chip and gold thread encapsulating are fixed, is the committed step guaranteeing IC-card Module Reliability and environment resistance.Above chip and gold thread, cover UV glue, penetrated by bottom plate heating and UV illumination afterwards and UV glue is just solidified, the Post RDBMS of UV glue can be completed the remaining time after discharging under ordinary light.
UV glue Post RDBMS needs a period of time, still rests on work carrier band during Post RDBMS.The movement locus of work carrier band is setting in advance, has advance and rewinding two kinds of patterns.In UV glue post cure processes, when carrier band rewinding is heated to heatable soleplate, cause the inner micro-air of colloid by thermal enlargement, cause layering between chip and carrier band to turn white, reduce the contact bond area between colloid and carrier band, affect the reliability of module.
Current employing manually by occurring that the IC-card module of rewinding moves to not heat affected zone, usually occurs that leakage is picked up, or the situation that mistake is picked up, and such mode production efficiency is low, product quality is low.
Utility model content
The technical problem that above-mentioned production efficiency is low in order to solve, product quality is low, the utility model provides the temperature automatically controlled cure system of UV glue that a kind of production efficiency is high, product quality is high.
In a kind of preferred embodiment of the temperature automatically controlled cure system of UV glue provided at the utility model, comprise control system and cure system, described control system is electrically connected with cure system, described control system comprises carrier band, photoelectric sensor and recording controller, described photoelectric sensor quantity is two, all be located at one end of described carrier band, described recording controller is electrically connected with described two photoelectric sensors.
In a kind of preferred embodiment of the temperature automatically controlled cure system of UV glue provided at the utility model, described cure system comprises heatable soleplate and UV cure lamp, and described heatable soleplate is layed in described carrier band one end, and described UV cure lamp is set up in the other end of described carrier band.
In a kind of preferred embodiment of the temperature automatically controlled cure system of UV glue provided at the utility model, described recording controller comprises single-chip microcomputer and heating controller, the two electrical connection.
In a kind of preferred embodiment of the temperature automatically controlled cure system of UV glue provided at the utility model, described heating controller is electrically connected with described heatable soleplate.
In a kind of preferred embodiment of the temperature automatically controlled cure system of UV glue provided at the utility model, described single-chip microcomputer is connected with described photoelectric sensor.
The temperature automatically controlled cure system of UV glue that the utility model provides has following beneficial effect:
One, by the design of described heating controller, stop being heated when making precuring IC card chip module be retracted into heatable soleplate, can be heated rapidly when the IC card chip module that needs are heated enters, ensure that the solidification quality of UV glue, improve the quality of products.
Two, by the design of described two photoelectric sensors, substitute manual working, realize controlling heatable soleplate heated condition in real time, respond sensitive, reduce production cost, enhance productivity.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of a kind of embodiment of the temperature automatically controlled cure system of UV glue that the utility model provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only a part of embodiment of the present utility model, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making other embodiments all obtained under creative work prerequisite, all belong to the scope of the utility model protection.Refer to Fig. 1, the structural representation of a kind of embodiment of the temperature automatically controlled cure system of UV glue provided for the utility model.The temperature automatically controlled cure system 1 of described UV glue comprises control system 11 and cure system 13.Described control system 11 is electrically connected with cure system 13.
Described control system 11 comprises carrier band 111, photoelectric sensor 113 and recording controller 115.Described photoelectric sensor 113 quantity is two, is all located at one end of described carrier band 111, and described recording controller 115 is electrically connected with described two photoelectric sensors 113.
Described cure system 13 comprises heatable soleplate 131 and UV cure lamp 133.Described heatable soleplate 131 is layed in described carrier band 111 one end, and described UV cure lamp 133 is set up in the other end of described carrier band 111.
Described recording controller 115 comprises single-chip microcomputer 10 and heating controller 20, the two electrical connection.Described heating controller 20 is connected with described heatable soleplate 131, and described single-chip microcomputer 10 is connected with described photoelectric sensor 113.
The operation principle of the temperature automatically controlled cure system 1 of described UV glue: when IC card chip module is after dripping glue, moves to described heating floor 131 position with described carrier band 111, start to be heated.After being tentatively heated, then move to described UV cure lamp 133 place with described carrier band 111, accept UV illumination and penetrate further solidification, next carry out normal temperature cure step.
Now, when rewinding appears in described carrier band 111, IC card chip module is refunded to described heatable soleplate 131 place, described two photoelectric sensors 113 receive the signal that carrier band is refunded, give described single-chip microcomputer 10 by Signal transmissions, single-chip microcomputer 10, by after data processing, sends data to described heating controller 20.Described heating controller 20 sends signal, and described heatable soleplate 131 stops heating.
Described carrier band 111 moves forward, now described photoelectric sensor 113 receives the proal signal of described carrier band 111, described single-chip microcomputer 10 is given by Signal transmissions, described single-chip microcomputer 10 is by after data processing, send data to described heating controller 20, described heating controller 20 sends signal, and the described heatable soleplate 131 receiving signal starts heating, continues to heat the IC card chip module of not just solidification.
The temperature automatically controlled cure system of UV glue that the utility model provides has following beneficial effect:
One, by the design of described heating controller 20, stop being heated when making precuring IC card chip module be retracted into heatable soleplate, can be heated rapidly when the IC card chip module that needs are heated enters, ensure that the solidification quality of UV glue, improve the quality of products.
Two, by the design of described two photoelectric sensors 113, substitute manual working, realize controlling heatable soleplate heated condition in real time, respond sensitive, reduce production cost, enhance productivity.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model description and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (5)
1. the temperature automatically controlled cure system of UV glue, it is characterized in that: comprise control system and cure system, described control system is electrically connected with cure system, described control system comprises carrier band, photoelectric sensor and recording controller, described photoelectric sensor quantity is two, all be located at one end of described carrier band, described recording controller is electrically connected with described two photoelectric sensors.
2. the temperature automatically controlled cure system of UV glue according to claim 1, it is characterized in that: described cure system comprises heatable soleplate and UV cure lamp, described heatable soleplate is layed in described carrier band one end, and described UV cure lamp is set up in the other end of described carrier band.
3. the temperature automatically controlled cure system of UV glue according to claim 1, is characterized in that: described recording controller comprises single-chip microcomputer and heating controller, the two electrical connection.
4. the temperature automatically controlled cure system of UV glue according to claim 3, is characterized in that: described heating controller is connected with described heatable soleplate.
5. the temperature automatically controlled cure system of UV glue according to claim 3, is characterized in that: described single-chip microcomputer is connected with described photoelectric sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520607045.5U CN204892294U (en) | 2015-08-13 | 2015-08-13 | UV glues automatic temperature control solidification system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520607045.5U CN204892294U (en) | 2015-08-13 | 2015-08-13 | UV glues automatic temperature control solidification system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204892294U true CN204892294U (en) | 2015-12-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520607045.5U Expired - Fee Related CN204892294U (en) | 2015-08-13 | 2015-08-13 | UV glues automatic temperature control solidification system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204892294U (en) |
-
2015
- 2015-08-13 CN CN201520607045.5U patent/CN204892294U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 255088 No. 158 run Avenue, hi tech Development Zone, Shandong, Zibo Patentee after: Shandong Qi Xinwei system Polytron Technologies Inc Address before: 255088 No. 158 run Avenue, hi tech Development Zone, Shandong, Zibo Patentee before: Shandong Qixin MEMS Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151223 Termination date: 20180813 |