CN105952749A - Adhesive dispensing method for fingerprint recognition module - Google Patents
Adhesive dispensing method for fingerprint recognition module Download PDFInfo
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- CN105952749A CN105952749A CN201610447302.2A CN201610447302A CN105952749A CN 105952749 A CN105952749 A CN 105952749A CN 201610447302 A CN201610447302 A CN 201610447302A CN 105952749 A CN105952749 A CN 105952749A
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- 238000000034 method Methods 0.000 title claims abstract description 63
- 239000000853 adhesive Substances 0.000 title claims abstract description 27
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 27
- 238000012795 verification Methods 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims description 270
- 238000007599 discharging Methods 0.000 claims description 11
- 238000007689 inspection Methods 0.000 claims description 7
- 238000012360 testing method Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 abstract description 12
- 238000009776 industrial production Methods 0.000 abstract 1
- 238000007711 solidification Methods 0.000 description 49
- 230000008023 solidification Effects 0.000 description 49
- 238000011179 visual inspection Methods 0.000 description 47
- 239000000463 material Substances 0.000 description 26
- 239000003550 marker Substances 0.000 description 18
- 238000012545 processing Methods 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000004026 adhesive bonding Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052594 sapphire Inorganic materials 0.000 description 5
- 239000010980 sapphire Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000010410 reperfusion Effects 0.000 description 4
- 230000004087 circulation Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010068 moulding (rubber) Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002372 labelling Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
Abstract
The invention provides an adhesive dispensing method for a fingerprint recognition module. The adhesive dispensing method comprises an automatic plate-in step, an automatic adhesive dispensing step, an automatic adhesion step and an automatic plate-out step, wherein the automatic adhesive dispensing step comprises adhesive dispensing, detection and curing, and the detection is automatic detection; and before the automatic plate-in step, the adhesive dispensing method further comprises a verification step. By adoption of the scheme, through automatic implementation of the plate-in, adhesive dispensing, adhesion and plate-out steps, automatic adhesive dispensing for industrial production is realized, and the adhesive dispensing method is suitable for the full-automatic adhesive dispensing process of the fingerprint recognition module and can realize one-stop automatic completion of adhesive dispensing.
Description
Technical field
The present invention relates to gluing process, in particular, a kind of fingerprint identification module dispensing method.
Background technology
Point glue, is a kind of technique, also referred to as applying glue, gluing, encapsulating, drips glue etc., is that electronics glue, oil or other liquid applicator, embedding, point are dripped on product, allow product play paste, embedding, insulate, fix, smooth surface etc. acts on
Range of application for dispensing glue widely, arrives greatly aircraft and ship, little produces to clothes toy etc., all may need a glue.As long as it can be said that use the place of glue, then be accomplished by gluing process and realize, but, in industrialized production, especially in the assembling of wiring board, it is automatically obtained gluing process and remains a need for continuing to improve.
Therefore, how design point glue mode so that industrialized production can be carried out automatically, such as, be applicable to the manufacturing such as circuit board or fingerprint identification module field, be the technical issues that need to address.
Summary of the invention
The technical problem to be solved is to provide a kind of new fingerprint identification module dispensing method.
Technical scheme is as follows: a kind of fingerprint identification module dispensing method, and it comprises the following steps: verification step；Automatically plate step is entered；Automatically dropping glue step；Automatic adhesive step；Automatic plate discharging step；Wherein, described automatically dropping glue step includes a glue, detects and solidify；Further, it is detected as described in automatically detecting.
Preferably, described verification step includes authentication operations, it is judged that authenticate by time perform subsequent step.
Preferably, it is judged that authenticate by time start system, perform subsequent step.
Preferably, it is judged that authenticate by time power on to start system.
Preferably, described authentication operations includes fingerprint recognition.
Preferably, described authentication operations includes that password login authenticates.
Preferably, described authentication operations includes that username and password logs in authentication.
Preferably, described authentication operations includes identification of swiping the card.
Preferably, described verification step includes self-test operations, it is judged that self-inspection by time perform subsequent step.
Preferably, it is judged that self-inspection by time power on to start system.
Using such scheme, the present invention is by automatically performing into plate, some glue, bonding and ejecting plate step, it is achieved that automatization's point glue operation of industrialized production, it is adaptable to the full automatic point adhesive process of fingerprint identification module, it is possible to an one-stop glue that is automatically performed operates.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of one embodiment of the invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings and specific embodiment, the present invention is described in detail, the following examples can be applied in combination, and, the present invention may utilize various forms and realizes, it is not limited to this specification each specific embodiment described, it is provided that the purpose of these embodiments is more thoroughly to readily appreciate the disclosure all sidedly.Needing further exist for explanation, when a certain structure is fixed on another structure, including this structure being directly or indirectly fixed on this another structure, or this structure being fixed on this another structure by other intermediate structures one or more.When a structure connects another structure, including this structure being directly or indirectly connected to this another structure, or this structure is connected to this another structure by other intermediate structures one or more.Further, described "and/or" include " with " with two kinds of possible embodiments of "or".
As it is shown in figure 1, the present invention example is, a kind of fingerprint identification module dispensing method, it comprises the following steps: automatically enter plate step；Automatically dropping glue step；Automatic adhesive step；Automatic plate discharging step；Wherein, described automatically dropping glue step includes a glue, detects and solidify；Further, it is detected as described in automatically detecting；Described automatically enter plate step before, also include verification step.In such manner, it is possible to realize the some glue of fingerprint identification module product or fingerprint recognition wiring board module, the full-automatic production put glue effect detection, solidify and assemble.
Such as, a kind of fingerprint identification module dispensing method, it comprises the following steps: verification step；Automatically plate step is entered；Automatically dropping glue step；Automatic adhesive step；Automatic plate discharging step etc.；This fingerprint identification module dispensing method, is applied to microelectronics Packaging field, it is possible to achieve be automatically performed the gluing process of flip-chip, wafer link, chip package, box dam filling etc.；Circuit board module process field etc. can also be applied to.Below each step is further described.
Such as, plate step is automatically entered；Such as, described automatically enter plate step, including by pending fingerprint identification module product, the most pending material, such as wiring board or chip or circuit module etc., be automatically sent to subsequent processing position, subsequent step process；Such as it is automatically sent to a glue position, performs automatically dropping glue step；And for example, it is automatically sent to mark position, performs automatic markers step；And for example, described automatically enter in plate step, pending fingerprint identification module product is automatically sent to the initial point glue station of described automatically dropping glue step.And for example, described automatically enter plate step, be sequentially automatically sent to subsequent processing position including by some pending fingerprint identification module products, subsequent step process；Such as, subsequent processing position is the initial point glue station of described automatically dropping glue step, lower same.And for example, described automatically enter plate step, be sequentially automatically sent to subsequent processing position including some pending fingerprint identification module product stacking arranged, subsequent step process；So, for subsequent step, can automatically obtain pending fingerprint identification module product, such as wiring board or chip or circuit module etc..Preferably, described automatically enter in plate step, further comprise the steps of: and automatically detect whether to there is pending fingerprint identification module product, be, sequentially some pending fingerprint identification module products are automatically sent to subsequent processing position, subsequent step process；And for example, otherwise stopping execution is described enters plate step automatically.Preferably, described automatically enter plate step after, also perform into plate detecting step: detect into whether plate puts in place, such as, otherwise send alarm.And for example, enter in plate detecting step, use computer Automatic Visual Inspection (Automated Visual
Inspection, AVI) technology, i.e. Automatic Visual Inspection technology, detects into whether plate puts in place, such as automatically, the visual performance of people is simulated by computer, from the image of acquired pending fingerprint identification module product, extract information, carry out processing and being identified, to realize detection and/or to measure, and according to testing result and/or measurement result, it is judged that enter whether plate puts in place.And for example, automatically detect into plate whether in the processing position of default pending fingerprint identification module product, otherwise send alarm.Such as, use and stack automatic landing modes, fall one piece of pending fingerprint identification module product or treating material every time, be fixed on the process station of conveyer belt, it is achieved described automatically enter plate step.
Operate in order to ensure special messenger, such as place material or pending fingerprint identification module product, and for example set-point glue parameter or working condition, avoiding artificial damage or green hand to process causes faulty materials to occur, described automatically enter plate step before, also include verification step, whether have the right to start for verification operation personnel and described automatically enter plate step.Preferably, described verification step includes authentication operations, it is judged that authenticate by time perform subsequent step.Preferably, described authentication operations includes fingerprint recognition or identification of swiping the card；Or, described authentication operations includes that password login authenticates；Or, described authentication operations includes that username and password logs in authentication.Preferably, it is judged that authenticate by time start system, perform subsequent step；Such as, it is judged that authenticate by time power on to start system.And/or, described verification step includes self-test operations, it is judged that self-inspection by time perform subsequent step.Such as, it is judged that self-inspection by time power on to start system.And for example, it is judged that self-inspection by time perform described authentication operations, it is judged that during authentication operations perform subsequent step.
Such as, automatically dropping glue step；Such as, described automatically dropping glue step is the emphasis of the present invention, and described automatically dropping glue step includes a glue, detects and solidify；Such as, described glue is contact point glue or contactless glue；Such as, described glue is coated with dye conducting resinl, fluid sealant, UV glue or red glue etc. for injection；And for example, described glue is for using pressure pot storage glue positioning and quantitative spraying method to carry out automatically dropping glue.Further, it is detected as described in automatically detecting；Preferably, during described automatic detection failure, the current material of reject.Such as, the current material of described reject, move to garbage area including by current material, no longer perform subsequent step.Or, it is understood that for, described automatically dropping glue step includes automatically dropping glue, automatically detection and automatically solidifies, and whole process is all performed entirely automatically, it is not necessary to manual intervention；So, be conducive to avoiding, during glue, dropping liquid and parts interference occur.Such as, after automatically entering plate step or automatic markers step, perform described automatically dropping glue step, and for example, after automatically entering plate step or automatic markers step, before performing described automatically dropping glue step, further comprise the steps of: the locality condition judging whether to meet automatically dropping glue, be, perform described automatically dropping glue step, start automatically dropping glue, after automatically dropping glue, order performs detection automatically and automatically solidifies.And for example, use note to drip mode and carry out automatically dropping glue, such as, within the setting time, by regulation air pressure, glue is released, controlled note every time by injection point gum machine and drip the time, as guaranteeing to note the amount of dripping, so, as long as regulating the pin mouth that air pressure, time and selection are suitable every time, just can change note every time easily and drip amount, the automatization of convenience point glue operation accurately controls.
And for example, diverse location to same pending fingerprint identification module product, perform repeatedly automatically dropping glue step, the most repeatedly put glue, Automatic Visual Inspection and cured, or in described automatically dropping glue step, carrying out some circulations, each circulation includes a glue, detects and solidify, and the most each circulation includes automatically dropping glue, automatically detection and automatically solidifies.Such as, described Automatic Visual Inspection includes being automatically positioned, defects detection, count detection and/or dimensional measurement etc., it is thus possible to find some glue defect, product defects or process defect etc., such as, by described Automatic Visual Inspection, judge whether some glue flaw occurs or does not meets preset glue specification, be that currently processed fingerprint identification module product is inserted trap collecting region or discarded part collecting region, continue next product is performed described Automatic Visual Inspection；Such as, glue specification in preset is that the number of times of appearance point glue flaw is less than predetermined threshold value or occur without or put glue flaw；Such as, described some glue flaw include a glue excessive velocities, dispensing amount is too much, dispensing amount is not enough, some glue positional fault, some glue missing sites, some glue surface amass excessive, some glue surface is long-pending not enough and/or some glue residual etc..In this manner it is achieved that some glue process automatization, be adapted to various fingerprint identification module product repeatedly or the some glue demand of multiple location.
Preferably, described automatically dropping glue step comprises the following steps: some glue for the first time；Automatic Visual Inspection for the first time.Such as, put employing instillation mode or reperfusion mode in glue step for the first time and carry out a glue；And for example, carrying out an Automatic Visual Inspection after some glue for the first time, Automatic Visual Inspection i.e. for the first time, to judge whether some glue meets default first glue specification for the first time.Wherein, Automatic Visual Inspection i.e. computer Automatic Visual Inspection, when judging that some glue meets default first glue specification for the first time, perform subsequent step；Such as, when judging that some glue does not meets default first glue specification for the first time, terminate performing subsequent step, it is preferred that also send alarm sound, to notify user.And for example, when judging that some glue does not meets default first glue specification for the first time, currently processed fingerprint identification module product is inserted trap collecting region or discarded part collecting region, continue next product is performed Automatic Visual Inspection step for the first time；Or, continue next product performs some glue step for the first time.Such as, currently processed fingerprint identification module product is the fingerprint identification module for intelligent terminal.
Preferably, described automatically dropping glue step is further comprising the steps of after described first time Automatic Visual Inspection: solidification for the first time.Such as, the time of first time solidification, depending on amassing according to glue quantity for dispensing glue for the first time and some glue surface, and/or, the time of solidification for the first time, it is directly proportional to glue quantity for dispensing glue for the first time.Preferably, the solidification of described first time comprises the following steps: be heating and curing, and such as, in first time Automatic Visual Inspection step by afterwards, persistently presets first time period in the range of automatic heating to preset first temperature, with solidification glue for dispensing glue for the first time；Or, the solidification of described first time comprises the following steps: ultra-violet curing.Such as, in first time Automatic Visual Inspection step by afterwards, automatically turn on ultra-vioket radiation, in the range of presetting the first UV intensity, persistently preset the first time of ultraviolet irradiation section, with solidification glue for dispensing glue for the first time.
Preferably, described automatically dropping glue step is further comprising the steps of after described first time solidifies: second time point glue；Automatic Visual Inspection for the second time；Flexible print wiring board (Flexible Printed Circuit
Board, FPC) process；Second time solidification.Wherein, glue the most for dispensing glue is identical or different with glue for dispensing glue for the first time, such as, glue the most for dispensing glue is identical with glue for dispensing glue for the first time, after by Automatic Visual Inspection, identical curing mode is used to process, now, second time solidification solidifies identical with first time, i.e. second time solidification is identical with the condition of solidification for the first time and processing mode.And for example, glue the most for dispensing glue is identical with glue for dispensing glue for the first time, but processing position is different, as such, it is possible to the diverse location to same pending fingerprint identification module product, repeatedly puts glue, Automatic Visual Inspection and cured.
Such as, second time point glue step use instillation mode or reperfusion mode to carry out a glue；And for example, carry out an Automatic Visual Inspection again after second time point glue, i.e. second time Automatic Visual Inspection, to judge whether second time point glue meets default second point glue specification.When judging that second time point glue meets default second point glue specification, perform subsequent step；Such as, when judging that second time point glue does not meets default second point glue specification, terminate performing subsequent step, it is preferred that also send alarm sound, to notify user.And for example, when judging that second time point glue does not meets default second point glue specification, currently processed fingerprint identification module product is inserted trap collecting region or discarded part collecting region, continues next product is performed second time Automatic Visual Inspection step；Or, continue next product performs second time point glue step.Further, described automatically dropping glue step is further comprising the steps of after described second time Automatic Visual Inspection: flexible print wiring board processes；Such as, it is curved after second time point glue and/or pressing process by the flexible print wiring board of second time computer Automatic Visual Inspection.And for example, flexible print wiring board is further comprising the steps of after processing: second time solidification.Such as, the time of solidification for the second time, depending on amassing according to second time glue quantity for dispensing glue and some glue surface, and/or, the time of second time solidification, it is directly proportional to second time glue quantity for dispensing glue.Preferably, the solidification of described second time comprises the following steps: be heating and curing, and such as, in second time Automatic Visual Inspection step by afterwards, persistently presets for the second time period in the range of automatic heating to preset second temperature, with solidification second time glue for dispensing glue；Or, the solidification of described second time comprises the following steps: ultra-violet curing.Such as, in second time Automatic Visual Inspection step and after being processed by flexible print wiring board, automatically turn on ultra-vioket radiation, in the range of presetting the second UV intensity, persistently preset the second time of ultraviolet irradiation section, with solidification second time glue for dispensing glue.Preferably, the solidification of described first time comprises the following steps: be heating and curing, and the solidification of described second time comprises the following steps: ultra-violet curing, wherein, depending on concrete condition of cure is according to the glue used and consumption thereof.
Preferably, described automatically dropping glue step is further comprising the steps of after described second time solidifies: third time point glue.Preferably, described automatically dropping glue step is further comprising the steps of after described third time point glue: Automatic Visual Inspection for the third time.Preferably, described automatically dropping glue step is further comprising the steps of after described third time Automatic Visual Inspection: third time solidification.Wherein, glue the most for dispensing glue is identical or different with glue for dispensing glue for the first time, such as, glue the most for dispensing glue is identical with glue for dispensing glue for the first time, after by Automatic Visual Inspection, identical curing mode is used to process, now, third time solidification solidifies identical with first time, i.e. third time solidification is identical with the condition of solidification for the first time and processing mode.And for example, glue the most for dispensing glue is identical with glue for dispensing glue for the first time, but processing position is different；And for example, glue position the most for dispensing glue and for the first time some glue, position the most for dispensing glue are different.As such, it is possible to the diverse location to same pending fingerprint identification module product, repeatedly put glue, Automatic Visual Inspection and cured.
Such as, third time point glue step use instillation mode or reperfusion mode to carry out a glue；And for example, after some glue for the third time, carry out an Automatic Visual Inspection again, i.e. third time Automatic Visual Inspection, to judge whether third time point glue meets default thirdly glue specification.When judging that third time point glue meets default thirdly glue specification, perform subsequent step；Such as, when judging that third time point glue does not meets default thirdly glue specification, terminate performing subsequent step, it is preferred that also send alarm sound, to notify user.And for example, when judging that third time point glue does not meets default thirdly glue specification, currently processed fingerprint identification module product is inserted trap collecting region or discarded part collecting region, continue next product is performed third time Automatic Visual Inspection step；Or, continue next product performs third time point glue step.Further, described automatically dropping glue step is further comprising the steps of after described third time Automatic Visual Inspection: third time solidification.Such as, the time of solidification for the third time, depending on amassing according to third time glue quantity for dispensing glue and some glue surface, and/or, the time of third time solidification, it is directly proportional to third time glue quantity for dispensing glue.Preferably, the solidification of described third time comprises the following steps: be heating and curing, such as, in third time Automatic Visual Inspection step by afterwards, automatic heating persistently preset for the 3rd time period in presetting the 3rd temperature range, with solidification third time glue for dispensing glue；Or, the solidification of described third time comprises the following steps: ultra-violet curing.Such as, in third time Automatic Visual Inspection step by afterwards, automatically turn on ultra-vioket radiation, in the range of presetting the 3rd UV intensity, persistently preset the 3rd time of ultraviolet irradiation section, with solidification third time glue for dispensing glue.Preferably, the solidification of described first time comprises the following steps: be heating and curing, and the solidification of described second time comprises the following steps: ultra-violet curing, and the solidification of described third time comprises the following steps: ultra-violet curing, wherein, depending on concrete condition of cure is according to the glue used and consumption thereof.Concrete some glue specification, including presetting first glue specification, presetting second point glue specification and preset thirdly glue specification, available existing glue spots glue specification, or, according to experimental data and/or existing glue spots glue specification integrated treatment.
Such as, automatically entering to also set up automatic markers step between plate step and described automatically dropping glue step described, so, for dispensing glue of the most described automatically dropping glue step is accurately carried out.Such as, described automatic markers step includes arranging marker bit and being marked；And for example, described automatic markers step includes automatically arranging marker bit and being marked described marker bit；And for example, described automatic markers step includes automatically arranging some marker bits and being automatically marked each described marker bit respectively；And for example, described automatic markers step includes the edge automatically identifying pending fingerprint identification module product, the edge of such as circuit board or module board, it is partly or entirely set to marker bit and is marked, by that analogy.Preferably, described being automatically detected as detects material edge automatically.And for example, the fingerprint identification module product that virtual tag frame matching is pending is set automatically, virtual tag frame is made just to encase whole pending fingerprint identification module product, using this virtual tag frame as marker bit, it is correspondingly arranged the center of virtual tag frame, then adjust the detection range of image-taking device, such as, focus on and in the visual field, obtain whole virtual tag frame, then positioning and described marker bit is marked.Preferably, before virtual tag frame is set, also regulate brightness and contrast so that this virtual tag frame and background exist significant difference, in order to the execution of subsequent step.So, before automatically dropping glue step, it is possible to determine that target location for dispensing glue, for dispensing glue of the most described automatically dropping glue step are accurately carried out automatically and accurately.
Preferably, described marker bit is point-like；And/or, described marker bit is wire；And/or, described marker bit is triangle.Such as, arrange multiple marker bit, at least one be point-like, at least one be wire, and/or, at least one is triangle.Preferably, described marker bit is set before, further comprising the steps of: to obtain the described material structure automatically entering and entering in plate step, i.e. obtain the described structure of pending fingerprint identification module product automatically entered and enter in plate step.And for example, the planar structure of the described pending fingerprint identification module product automatically entering and entering in plate step is obtained.Preferably, described arrange in marker bit, at least one marker bit is set always according to described material structure；Such as, three marker bits are set according to described material structure.Preferably, described three marker bits form a triangle；Or, described three marker bits form a linear.So, be conducive to obtaining preferable labelling effect, complete degree of accuracy with improve described automatically dropping glue step.
Preferably, described automatically to enter plate step further comprising the steps of: be automatically sent to the fingerprint identification module product that pending during the initial point glue station of described automatically dropping glue step send a checking signal every time, described automatically dropping glue step starts according to described checking signal, i.e., when receiving described checking signal, perform the most described automatically dropping glue step and subsequent step thereof.Preferably, described checking signal includes preset glue pattern information, and described automatically dropping glue step, according to the described preset glue pattern information in described checking signal, carries out being started and carried out corresponding preset rubber moulding formula.Such as, described preset rubber moulding formula includes some adhesive tape part and/or a condition of cure etc., and such as, described preset rubber moulding formula includes a glue position, some glue mode, some glue speed, dispensing amount and/or curing mode, hardening time, solidification temperature etc..
Such as, automatic adhesive step；Such as, described automatic adhesive step after described automatically dropping glue step, the structural member of the fingerprint identification module product that automatic adhesive is pending；And for example, the structural member of automatic adhesive material.Such as, described automatic adhesive step comprises the following steps: sapphire is bonding.And for example, described automatic adhesive step is further comprising the steps of: metal edge frame is bonding.Preferably, described automatic adhesive step includes the following steps that order performs: sapphire is bonding；Metal edge frame is bonding.Preferably, sapphire bonding bonding with metal edge frame between, further comprising the steps of: the 4th some glue.Preferably, further comprising the steps of after described 4th some glue: the 4th solidification.Preferably, after the 4th some glue and before the 4th solidification, further comprising the steps of: the 4th Automatic Visual Inspection.Wherein, 4th time glue for dispensing glue is identical or different with second time glue for dispensing glue, such as, 4th time glue for dispensing glue is identical with second time glue for dispensing glue, after by Automatic Visual Inspection, identical curing mode is used to process, now, 4th solidification solidifies identical with second time, and i.e. the 4th time solidification is identical with the condition of second time solidification and processing mode.And for example, the 4th time glue for dispensing glue is identical with second time glue for dispensing glue, but processing position is different；And for example, the 4th glue position for dispensing glue and some glue for the first time, second time point glue, position the most for dispensing glue are different.As such, it is possible to the diverse location to same pending fingerprint identification module product, repeatedly put glue, Automatic Visual Inspection and cured.
Such as, the 4th some glue step use instillation mode or reperfusion mode carry out a glue；And for example, carrying out an Automatic Visual Inspection after the 4th some glue again, i.e. the 4th time Automatic Visual Inspection, to judge whether the 4th some glue meets default 4th glue specification.When judging that the 4th some glue meets default 4th glue specification, perform subsequent step；Such as, when judging that the 4th some glue does not meets default 4th glue specification, terminate performing subsequent step, it is preferred that also send alarm sound, to notify user.And for example, when judging that the 4th some glue does not meets default 4th glue specification, currently processed product is inserted trap collecting region or discarded part collecting region, continue next product or next material are performed the 4th Automatic Visual Inspection step；Or, continue next product or next material are performed the 4th some glue step.Further, described automatically dropping glue step is further comprising the steps of after described 4th Automatic Visual Inspection: the 4th solidification.Such as, the time of the 4th solidification, depending on amassing according to the 4th glue quantity for dispensing glue and some glue surface, and/or, the time of the 4th solidification, it is directly proportional to the 4th glue quantity for dispensing glue.Preferably, described 4th solidification comprises the following steps: be heating and curing, and such as, the 4th Automatic Visual Inspection step by afterwards, automatic heating persistently preset for the 4th time period, to solidify the 4th glue for dispensing glue in presetting the 4th temperature range；Or, described 4th solidification comprises the following steps: ultra-violet curing.Such as, the 4th Automatic Visual Inspection step by afterwards, automatically turn on ultra-vioket radiation, in the range of presetting the 4th UV intensity, persistently preset the 4th time of ultraviolet irradiation section, to solidify the 4th glue for dispensing glue.Preferably, the solidification of described second time comprises the following steps: being heating and curing, described 4th solidification comprises the following steps: ultra-violet curing, wherein, depending on concrete condition of cure is according to the glue used and consumption thereof.Concrete some glue specification, including presetting first glue specification, presetting second point glue specification, default thirdly glue specification and preset the 4th glue specification, available existing glue spots glue specification, or, according to experimental data and/or existing glue spots glue specification integrated treatment.
Such as, automatic plate discharging step；Such as, described automatic plate discharging step after described automatic adhesive step, automatic plate discharging, complete produce, such as, the product or material that are complete process are collected finished product district automatically.
Such as, automatically enter plate step and each pending fingerprint identification module product or treating material are automatically subsequently attached on conveyer belt the science and engineering position everywhere of correspondence, preferably, described process station arranges at least one clamping part, for clamping the pending fingerprint identification module product on described process station or treating material；Preferably, each clamping part rotary setting is in described process station, so as to 360 degree of scopes, the pending fingerprint identification module product on described process station or treating material are carried out subsequent handling.Then.Point gum machine mechanical arm is used automatically to arrive the pending fingerprint identification module product processed on station or the some glue position for the treatment of material, contactless some glue mode positioning and quantitative spraying is used to carry out automatically dropping glue, it is then delivered to automatically detect position, automatically detect, detect by time be sent to automatically solidify station, automatically solidified by the mode of being heating and curing or ultra-violet curing mode, then proceed to transmit, automatically the pending fingerprint identification module product processed on station or the bonding location for the treatment of material is arrived by the splicing machine mechanical arm of the corresponding bonding station of automatic adhesive step, the structural member of the fingerprint identification module product that automatic adhesive is pending, such as, bonding sapphire and/or metal edge frame；Then proceed to transmit, automatic plate discharging step correspondence ejecting plate station each is complete product or the taking-up in the position of science and engineering everywhere of correspondence from conveyer belt of material automatically order of process；Such as, each product being complete process or material is taken out by the discharging machine mechanical arm of the automatic plate discharging step correspondence ejecting plate station position of science and engineering everywhere that automatically order is corresponding from conveyer belt.
Such as, after described automatic plate discharging step, also include data statistics step, be used for adding up ejecting plate quantity and/or ejecting plate accuracy etc.；Ejecting plate i.e. completes material production or process completes pending fingerprint identification module product etc..Preferably, in described data statistics step, including process time and process quantity, such as, the process time of outputting material and process quantity；And for example, export the total processing time of a batch materials and always process quantity；And for example, export the total processing time of a batch materials, always process quantity, average treatment quantity and average handling time etc..
Another example is, fingerprint identification module dispensing method comprises the following steps: automatically enter plate；Automatically labelling；Point glue for the first time；Computer Automatic Visual Inspection for the first time；Solidification for the first time；Second time point glue；Computer Automatic Visual Inspection for the second time；Flexible print wiring board processes；Second time solidification；Third time point glue；Sapphire is bonding；4th some glue；Metal edge frame is bonding；Ejecting plate.In this manner it is achieved that single machine production completes gluing process, it is also possible to add upper trigger, lower trigger, docking machine etc. and be used in automatic production line, it is achieved automatically produce.
Further, embodiments of the invention also include, each technical characteristic of the various embodiments described above, are mutually combined the fingerprint identification module dispensing method of formation.
It should be noted that above-mentioned each technical characteristic continues to be mutually combined, form various embodiments the most enumerated above, be accordingly to be regarded as the scope that description of the invention is recorded；Further, for those of ordinary skills, can be improved according to the above description or be converted, and all these modifications and variations all should be belonged to the protection domain of claims of the present invention.
Claims (10)
1. a fingerprint identification module dispensing method, it is characterised in that comprise the following steps:
Verification step；
Automatically plate step is entered；
Automatically dropping glue step；
Automatic adhesive step；
Automatic plate discharging step；
Wherein, described automatically dropping glue step includes a glue, detects and solidify；
Further, it is detected as described in automatically detecting.
Fingerprint identification module dispensing method the most according to claim 1, it is characterised in that described verification step includes authentication operations, it is judged that authenticate by time perform subsequent step.
Fingerprint identification module dispensing method the most according to claim 2, it is characterised in that judge authentication by time start system, perform subsequent step.
Fingerprint identification module dispensing method the most according to claim 3, it is characterised in that judge authentication by time power on to start system.
Fingerprint identification module dispensing method the most according to claim 2, it is characterised in that described authentication operations includes fingerprint recognition.
Fingerprint identification module dispensing method the most according to claim 2, it is characterised in that described authentication operations includes that password login authenticates.
Fingerprint identification module dispensing method the most according to claim 6, it is characterised in that described authentication operations includes that username and password logs in authentication.
Fingerprint identification module dispensing method the most according to claim 2, it is characterised in that described authentication operations includes identification of swiping the card.
Fingerprint identification module dispensing method the most according to claim 1, it is characterised in that described verification step includes self-test operations, it is judged that self-inspection by time perform subsequent step.
Fingerprint identification module dispensing method the most according to claim 9, it is characterised in that judge self-inspection by time power on to start system.
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