KR20170066046A - Automatic marking apparatus for printed circuit board - Google Patents

Automatic marking apparatus for printed circuit board Download PDF

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Publication number
KR20170066046A
KR20170066046A KR1020150172582A KR20150172582A KR20170066046A KR 20170066046 A KR20170066046 A KR 20170066046A KR 1020150172582 A KR1020150172582 A KR 1020150172582A KR 20150172582 A KR20150172582 A KR 20150172582A KR 20170066046 A KR20170066046 A KR 20170066046A
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KR
South Korea
Prior art keywords
pcb substrate
information
pcb
ink
unit
Prior art date
Application number
KR1020150172582A
Other languages
Korean (ko)
Inventor
최성순
최승호
이태윤
김부기
한원준
권순규
황재하
Original Assignee
(주)맥스벨
최승호
최성순
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by (주)맥스벨, 최승호, 최성순 filed Critical (주)맥스벨
Priority to KR1020150172582A priority Critical patent/KR20170066046A/en
Publication of KR20170066046A publication Critical patent/KR20170066046A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K17/00—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/14—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation using light without selection of wavelength, e.g. sensing reflected white light
    • G06K7/1404—Methods for optical code recognition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Abstract

One embodiment of the present invention relates to a marking automation apparatus for a PCB, and a technical problem to be solved is to automatically perform ink marking at a corresponding position when a pattern defect occurs on a PCB substrate through AOI (Automatic Optical Inspection) Thereby improving work efficiency and improving product quality.
To this end, an embodiment of the present invention includes a substrate supply module including a fixed die on which at least one PCB substrate is fixed by suction and a die moving means for moving the fixed die; A substrate recognition module including a position sensing unit for sensing a position of the PCB substrate, an information reading unit for sensing product information of the PCB substrate, and a photographing unit for photographing one side of the PCB substrate; An ink jet module for jetting ink onto the PCB substrate; And determining whether the PCB substrate is defective by analyzing the image of the PCB substrate photographed by the photographing unit by executing a pre-installed automation program, and if the PCB substrate is defective, detecting by the information reading unit And a control module for controlling the predetermined amount of ink to be ejected through the ink ejection module to the defective position of the PCB substrate based on the product information of the PCB substrate detected by the position sensing unit and the position information of the PCB substrate detected by the position sensing unit A marking automation apparatus for a PCB, comprising:

Figure P1020150172582

Description

[0001] AUTOMATIC MARKING APPARATUS FOR PRINTED CIRCUIT BOARD [0002]

One embodiment of the present invention relates to a marking automation apparatus for a PCB.

Generally, a printed circuit board (PCB) substrate for an electronic circuit is formed by forming a plurality of circuit elements on an insulating substrate by a thin film, a thick film, etc., connecting the elements to each other through a film to form a circuit, It is completed by mounting mounted parts.

On the other hand, since such a PCB substrate is manufactured in a large quantity by an automated production line, a circuit pattern breakage or a pattern width defect may occur due to the generation of foreign substances in the production equipment. Therefore, The marking ink which is easy to be identified along with the marking is used to display the defective PCB.

That is, if the remaining process is performed without selecting the defective PCB, unnecessary processes for making the defective PCB are added, which leads to a reduction in the production rate and loss of unnecessary raw materials. Thus, the strip marking is performed.

However, in the past, such a marking operation was manually performed by a worker, which resulted in an increase in labor cost and a decrease in productivity in a semiconductor package manufacturing process.

Registration Utility Model No. 20-0375821 'Automatic marking device for circuit board' Open Patent Publication No. 10-2006-0055643 'Automatic marking device for circuit board'

In an embodiment of the present invention, when pattern defects are generated on a PCB substrate through Automatic Optical Inspection (AOI), ink marking is automatically performed at a corresponding position, thereby increasing work efficiency and improving product quality A marking automation apparatus for a PCB is provided.

The PCB marking automation apparatus according to an embodiment of the present invention includes a substrate supply module including a stationary die to which at least one PCB substrate is sucked and fixed and a die moving unit to move the stationary die; A substrate recognition module including a position sensing unit for sensing a position of the PCB substrate, an information reading unit for sensing product information of the PCB substrate, and a photographing unit for photographing one side of the PCB substrate; An ink jet module for jetting ink onto the PCB substrate; And determining whether the PCB substrate is defective by analyzing the image of the PCB substrate photographed by the photographing unit by executing a pre-installed automation program, and if the PCB substrate is defective, detecting by the information reading unit And a control module for controlling the predetermined amount of ink to be ejected through the ink ejection module to the defective position of the PCB substrate based on the product information of the PCB substrate detected by the position sensing unit and the position information of the PCB substrate detected by the position sensing unit .

The PCB substrate may be provided with an identification code including product information, and the information reading unit may include a reader for reading the identification code.

The substrate supply module is connected to an automation control unit that supplies air to the fixing die, and the PCB substrate can be vacuum-adsorbed through the air supplied from the automation control unit.

The automation control unit is connected to the control module through a wired / wireless communication network and transmits at least one of product information of the PCB substrate, marking operation information of the PCB substrate, warming up information before marking, and injection information of the ink ejection unit to the control module .

And a display module for displaying product information of the PCB substrate, marking status information about the PCB substrate, ejection information of the ink ejection unit, and connection status information with an external device.

Wherein the display module displays product information of the PCB substrate, marking status information of the PCB substrate, ejection information of the ink ejection unit, and connection status information with an external device; And an information setting unit for setting at least one of marking operation information on the PCB substrate, alignment information on the fixed die or the PCB substrate, warm-up information before the marking, and injection information of the ink ejection unit.

The information setting unit may automatically set an injection amount of ink ejected through the ink ejecting module according to the type of the ink.

The product information of the PCB substrate includes coordinate information of the PCB substrate and the control module extracts defective position information of the PCB substrate based on the coordinate information of the PCB substrate, The ink ejecting module may be moved on the area to eject the ink.

In the automatic marking apparatus for PCB according to an embodiment of the present invention, when a pattern defect occurs on a PCB substrate through automatic optical inspection (AOI), ink marking is automatically performed at a corresponding position, It is possible to improve work efficiency and product quality compared to the existing one.

1 is a block diagram schematically showing an automation apparatus for a PCB according to an embodiment of the present invention.
2 is a view for explaining an ink dispensing process through the marking automation apparatus for PCB of FIG.
FIG. 3 is a view showing an example in which the marking automation apparatus for PCB of FIG. 1 is implemented.
4 is a view illustrating a marking automation process using the marking automation apparatus for PCB of FIG.
FIG. 5 is a diagram illustrating a data parsing process through the control module of the marking automation apparatus for PCB of FIG. 1;
6A to 6C are views showing an example of implementing the ink dispensing process through the marking automation apparatus for PCB of FIG.

The terms used in this specification will be briefly described and the present invention will be described in detail.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. Also, in certain cases, there may be a term selected arbitrarily by the applicant, in which case the meaning thereof will be described in detail in the description of the corresponding invention. Therefore, the term used in the present invention should be defined based on the meaning of the term, not on the name of a simple term, but on the entire contents of the present invention.

When an element is referred to as "including" an element throughout the specification, it is to be understood that the element may include other elements, without departing from the spirit or scope of the present invention. Also, the terms "part," " module, "and the like described in the specification mean units for processing at least one function or operation, which may be implemented in hardware or software or a combination of hardware and software .

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

FIG. 1 is a block diagram schematically showing a marking automation apparatus for a PCB according to an embodiment of the present invention, FIG. 2 is a view for explaining an ink dispensing process through the marking automation apparatus for PCB of FIG. 1, FIG. 4 is a view showing an automatic marking process using the marking automation apparatus for PCB of FIG. 1, and FIG. 5 is a view showing an example of the marking automation apparatus for the PCB of FIG. FIGS. 6A to 6C are diagrams illustrating an example of implementing the ink dispensing process through the marking automation apparatus for PCB of FIG. 1. FIG.

1 and 2, a PCB marking automation apparatus 1 according to an exemplary embodiment of the present invention is provided with a PCB marking apparatus 1 for detecting a defective pattern on a PCB substrate 3 through AOI (Automatic Optical Inspection) And includes a substrate supply module 10, a substrate recognition module 20, an ink injection module 30, a display module 50, and a control module 40.

Although not shown, the PCB marking automation apparatus 1 may include a curing module for curing the injected ink, and a storage module for storing and storing the processed PCB substrate 3.

The PCB marking automation apparatus 1 is an apparatus for automatically displaying a pattern defect on a PCB substrate 3 by installing an automation program for marking on a control module 40 provided in an existing AOI apparatus, The AOI equipment may be provided with all of the substrate supply module 10, the substrate recognition module 20, the ink injection module 30, the display module 50 and the control module 40, or only the automatic program of the control module 40 And the like.

The PCB substrate 3 is provided with an identification code including product information. Such an identification code can be read through the reader of the information reading section 22 provided in the substrate recognition module 20 described later.

The substrate supply module 10 supplies a PCB substrate 3 to be ink-marked. The substrate supply module 10 includes a fixed die 11 to which at least one PCB substrate 3 is attracted and fixed, And a die moving means (12).

The fixing die 11 may further include a vacuum suction means for vacuum-sucking at least one PCB substrate 3.

Further, the die moving means 12 moves the PCB substrate 3 fixed to the fixed die 11 stepwise by a driving motor (not shown) provided in an adjacent region.

The substrate supply module 10 is connected to an automation control unit 2 for supplying air to the stationary die 11. Accordingly, the vacuum adsorption means of the substrate supply module 10 can vacuum-adsorb the PCB substrate 3 through the air supplied from the automation control unit 2. [

The automation control unit 2 is connected to the control module 40 through a wired / wireless communication network and is connected to the control module 40 so that the product information of the PCB substrate 3, the marking operation information of the PCB substrate 3, And the injection information of the injection unit.

More specifically, the automation control unit 2 is an apparatus that performs signal transmission to the control module 40 and supplies air to the substrate supply module 10, and controls the ink injection amount through signal transmission to the control module 40 , The marking operation can be performed on the PCB substrate 3 according to the coordinate information extracted by the substrate recognition module 20 and the PCB substrate 3 can be vacuum-adsorbed through air supply to the substrate supply module 10 .

The board recognizing module 20 is a device for recognizing the vision of the supplied PCB board 3 and includes a position sensing part 21 for sensing the position of the PCB board 3, And a photographing unit 23 for photographing one side of the PCB substrate 3. The information reading unit 22 may be a microcomputer, The substrate recognition module 20 recognizes the position of the PCB 3 automatically and recognizes specific points such as lines and corners of the PCB 3 when the position is difficult to sense, Position error and rotation error can be calculated automatically.

The position sensing unit 21 may include at least one position sensor for recognizing the position of the PCB substrate 3 fixed on the fixed die 11.

The information reading unit 22 may include a reader for recognizing an identification code printed on the PCB substrate 3. [

The photographing unit 23 may include a camera for confirming the defect information (for example, scratches) formed on one side of the PCB substrate 3 fixed on the fixed die 11 by suction.

6A, the ink ejection module 30 is an apparatus that performs ink ejection on a portion of the PCB substrate 3, which is recognized by the substrate recognition module 20. The ink ejection module 30 may include a cylinder for moving the ink ejecting module 30 in the forward, backward, or up and down directions on the PCB substrate 3, and a solenoid actuator for driving the cylinder. In addition, the ink injection module 30 may further include a focus recognition sensor for the PCB substrate 3.

More specifically, the ink ejecting module 30 includes an ink containing portion 31 for receiving ink to be ejected on the PCB substrate 3 and an ink receiving portion 31 for connecting the ink to the PCB substrate 3 (Not shown). At this time, the ink may be a black or white UV ink, but other ink materials may be applied as far as the ink material is excellent in the degree of curing or adhesion on the PCB substrate 3.

The display module 50 displays product information of the PCB 3, marking status information of the PCB 3, ejection information of the ink ejection unit, connection status information with external devices, , LED, and OLED may be used. Through the display module 50, the task manager can check the ink marking state on the PCB substrate 3 and set the log file for the marking progress product.

More specifically, as shown in FIG. 6B, the display module 50 displays the product information of the PCB 3, the marking status information of the PCB 3, the injection information of the ink ejection unit, Marking operation information on the PCB substrate 3, alignment information on the fixing die 11 or the PCB substrate 3, warm-up information on the marking before the marking, And an information setting unit 52 for setting at least one of the jetting information.

At this time, the information setting unit 52 may automatically set the injection amount of the ink to be injected through the ink injection module 30 according to the type of the ink. That is, the information setting unit can adjust the degree of ink ejection according to the curing degree of the ink or the adhesive force characteristic. Accordingly, as shown in FIGS. 6B to 6C, the ink can be jetted onto the PCB substrate 3 at a narrower and more precise position than the width of the conventional ink, which is manually marked. Further, have. Accordingly, it is possible to minimize the occurrence of product defects due to the thickness of the ink when the PCB substrate 3 is loaded or stored.

The control module 40 analyzes the image of the PCB substrate 3 photographed by the photographing unit 23 to determine whether the PCB substrate 3 is defective or not, When the substrate 3 is defective based on the product information of the PCB substrate 3 sensed by the information reading unit 22 and the position information of the PCB substrate 3 sensed by the position sensing unit 21, It is possible to control the operation of each constituent element constituting the marking automation apparatus 1 for the PCB so as to inject ink of a preset reference amount through the ink ejection module 30 to the defective position of the marking automaton 3.

At this time, the product information of the PCB substrate 3 may include coordinate information of the PCB substrate 3 (see the ellipse of FIG. 5).

Accordingly, the control module 40 extracts the defective position information of the PCB substrate 3 based on the coordinate information of the PCB substrate 3, and then outputs the defective position information to the ink ejection module 30) to eject the ink.

Although not shown, the control module 40 controls a log file switching program according to the type of the AOI equipment, a communication interface for connecting to an external server, and controls operations of the components constituting the marking automation apparatus 1 for the PCB And a file generating unit for generating and storing a log file of the marking operation history and managing the log file.

In the automatic marking apparatus for PCB 1 according to the embodiment of the present invention configured as described above, when a pattern defect occurs on the PCB substrate 3 through AOI (Automatic Optical Inspection), ink marking is automatically performed at the corresponding position It is possible to improve the work efficiency and the product quality compared to the conventional manual work by the inspector.

Meanwhile, as shown in FIG. 4, the automatic marking apparatus for PCB 1 according to an embodiment of the present invention configured as described above sets product data for a marking operation, performs a marking operation after deflecting the product And can perform the function of drying the marked ink.

For this purpose, the PCB marking automation apparatus 1 loads the product on a fixed leg, recognizes the identification information of the product (for example, bar code, QR code, etc.), inserts a log file to be operated, Allows you to enter the work quantity and then check for full proof. In addition, in this PCB marking automation apparatus 1, the alignment of the apparatus is first performed for the product alignment, the apparatus is aligned, the alignment of the apparatus is released, and the alignment is performed.

Then, the marking automation apparatus for PCB 1 performs a marking operation on the PCB substrate 3, and then records ink drying and operation completion log files.

At this time, the PCB marking automation apparatus 1 moves the fixing die 11 up and down in the Y-axis direction after the marking operation is completed, thereby unloading the product.

Accordingly, it is understood that the ink marking operation for a large number of PCB boards 3 can be automated in a short time in a large amount of time by repeating such an operation procedure.

As described above, the present invention is not limited to the above-described embodiment, and it is to be understood that the present invention is not limited to the above-described embodiment, It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

1: Marking automation device for PCB 2: Automation control part
3: PCB substrate 10: substrate supply module
11: fixed die 12: die moving means
20: substrate recognition module 21:
22: information reading section 23: photographing section
30: Ink jetting module 31:
32: Ink jetting part 40: Control module
50: display module 51: display part
52: Information setting section

Claims (8)

A substrate supply module including a fixed die on which at least one PCB substrate is fixed by suction and a die moving means for moving the fixed die;
A substrate recognition module including a position sensing unit for sensing a position of the PCB substrate, an information reading unit for sensing product information of the PCB substrate, and a photographing unit for photographing one side of the PCB substrate;
An ink jet module for jetting ink onto the PCB substrate; And
And a control unit that analyzes the image of the PCB substrate photographed by the photographing unit to determine whether or not the PCB substrate is defective by executing a pre-installed automation program, and if the PCB substrate is defective, And a control module for controlling ink ejection of a preset reference amount through the ink ejection module to a defective position of the PCB substrate based on product information of the PCB substrate and position information of the PCB substrate sensed by the position sensing unit And a marking unit for PCB.
The method according to claim 1,
The PCB substrate is provided with an identification code including product information,
And the information reading unit includes a reader for reading the identification code.
The method according to claim 1,
Wherein the substrate supply module is connected to an automatic control unit for supplying air to the fixed die,
And the PCB substrate is vacuum-adsorbed through the air supplied from the automation control unit.
The method of claim 3,
The automation control unit is connected to the control module through a wired / wireless communication network and transmits at least one of product information of the PCB substrate, marking operation information of the PCB substrate, warming up information before marking, and injection information of the ink ejection unit to the control module And a marking unit for PCB.
The method according to claim 1,
Further comprising a display module for displaying product information of the PCB substrate, marking status information of the PCB substrate, ejection information of the ink ejection unit, and connection status information with an external device.
The method of claim 5,
The display module
A display unit for displaying product information of the PCB substrate, marking status information about the PCB substrate, ejection information of the ink ejection unit, and connection status information with an external device; And
And an information setting unit for setting at least one of marking operation information on the PCB substrate, alignment information on the fixed die or the PCB substrate, warming-up information before the marking, and injection information on the ink ejecting unit. Automation device.
The method of claim 6,
Wherein the information setting unit automatically sets an injection amount of ink injected through the ink injection module according to the type of the ink.
The method of claim 2,
Wherein the product information of the PCB substrate includes coordinate information of the PCB substrate,
The control module extracts defective position information of the PCB substrate based on the coordinate information of the PCB substrate and then moves the ink jet module onto an area corresponding to the extracted position information to eject the ink Marking automation device for PCB.
KR1020150172582A 2015-12-04 2015-12-04 Automatic marking apparatus for printed circuit board KR20170066046A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112415973A (en) * 2020-11-24 2021-02-26 广州广合科技股份有限公司 Intelligent control method and system for inner layer AOI (automated optical inspection) process
CN116773541A (en) * 2022-06-15 2023-09-19 欧阳津 AOI automatic optical nondestructive testing equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112415973A (en) * 2020-11-24 2021-02-26 广州广合科技股份有限公司 Intelligent control method and system for inner layer AOI (automated optical inspection) process
CN112415973B (en) * 2020-11-24 2022-05-17 广州广合科技股份有限公司 Intelligent control method and system for inner layer AOI (automated optical inspection) process
CN116773541A (en) * 2022-06-15 2023-09-19 欧阳津 AOI automatic optical nondestructive testing equipment

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