CN103143507A - Screening method of photodiode chips - Google Patents
Screening method of photodiode chips Download PDFInfo
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- CN103143507A CN103143507A CN2013100626538A CN201310062653A CN103143507A CN 103143507 A CN103143507 A CN 103143507A CN 2013100626538 A CN2013100626538 A CN 2013100626538A CN 201310062653 A CN201310062653 A CN 201310062653A CN 103143507 A CN103143507 A CN 103143507A
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Abstract
The invention discloses a screening method of photodiode chips. The method comprises the steps of: step 1, carrying out photoelectricity test on the chip after splitting, and utilizing a dotting device to spray UV (ultraviolet) glue on the disqualified chips so as to mark; step two, pasting a piece of electronic grade transparent glass paper onto the upper surfaces of the chips after finishing test, and enabling the UV glue to fully contact with the disqualified chips and the glass paper; step three, putting the chips covered by the glass paper into an ultraviolet lamp to be irradiated, and solidifying the UV glue so that the disqualified chips is fully bonded with the glass paper; and step four, taking the chip away from the ultraviolet lamp, tearing out the glass paper, and removing the chips tested to be disqualified in one time through the stickiness between the UV glue and the glass paper. The method provided by the invention can remove the disqualified chips in one time, the time is saved, the labor is saved, the accuracy rate is high, the problems of mistaking and leaking are not generated, the operation is simple, the cost is low, and the method can not additionally damage the qualified chips.
Description
Technical field
The screening technique of the relevant a kind of chip of the present invention refers to a kind of sorting sieve choosing method be used to choosing except underproof photodiode chip especially.
Background technology
At present, photodiode chip is all generally to adopt the mode of ink distribution point to mark out defective chip through photoelectricity test the time, these defective works is chosen afterwards again and is removed.Choose the method for removing and have two kinds, the one, manually choose division, be that the people is pressed from both sides out defective chip with tweezers one by one at microscopically, this method not only needs a large amount of manpowers, and the long-acting rate of required time is low, and the risk that the people also can exist Lou in choosing the process of removing and choose, other qualified chips are chosen, are caught broken, accidentally injure and polluted to mistake has increased cost; The 2nd, equipment is chosen division, this kind equipment price costliness, and choose except the time need to puncture that blue film comes the jack-up chip in order to draw with thimble, so also need carry out the chip upset after cDNA microarray, qualified chip is transferred on the blue film of another Zhang Quanxin, the upset of chip is not only wasted time and energy, and need to realize upset to the certain pressure of chip when upset, and chip has been caused secondary damage.
Summary of the invention
In view of this, main purpose of the present invention is to provide that a kind of cost is low, efficient is high, can disposable defective chip be rejected and can not caused to qualified chip the screening technique of the photodiode chip of additional injuries.
For achieving the above object, the invention provides a kind of screening technique of photodiode chip, the method comprises:
Step 1, get the good chip of cleavage and carry out photoelectricity test, utilize tapper to spray UV glue on defective chip and carry out mark;
After step 2, test are completed, the electron level cellophane cover is attached to the upper surface of chip, UV glue is contacted fully with defective chip and glassine paper;
Step 3, the chip that will build glassine paper are put under uviol lamp and are shone, thereby make the UV glue curing make defective chip and glassine paper fully bonding;
Step 4, chip is taken out under uviol lamp, tears glassine paper off, by the viscosity between UV glue and glassine paper with the disposable rejecting of the chip of test failure.
It is liquid that described UV glue at room temperature becomes, and mobility is moderate, neither can cross the sticking tapper that stops up, and can not cross again that rare mobility is excessive to be caused the pollution of qualified chip on every side.
In described step 3, irradiation time is at least 5 seconds.
Method of the present invention can defective chip be disposable weeds out all, and time saving and energy saving, accuracy rate is high, does not exist mistake to choose the problem of Lou choosing, and is simple to operate, with low cost, and can not cause extra damage to qualified chip.
Description of drawings
Fig. 1 is the flow chart of steps of the screening technique of photodiode chip of the present invention.
The specific embodiment
For ease of method of the present invention and the effect that reaches are had further understanding, the existing preferred embodiment that develops simultaneously by reference to the accompanying drawings is described in detail as follows.
As shown in Figure 1, the step of the screening technique of photodiode chip of the present invention comprises:
Step 1, get the good chip of cleavage and carry out photoelectricity test, the method of traditional defective chip of ink distribution point mark is sprayed UV(Utlraviolet instead, ultraviolet ray) glue carries out mark, it is liquid that this glue at room temperature becomes, and mobility is moderate, neither can cross the sticking tapper that stops up, can not cross again that rare mobility is excessive to be caused the pollution of qualified chip on every side;
The upper surface that is attached to chip that the electron level cellophane cover is careful after step 2, test are completed makes glue contact fully with defective chip and glassine paper;
Step 3, the chip that will build glassine paper are put under uviol lamp and are shone, and irradiation time is at least 5 seconds, thereby can make glue curing make defective chip and glassine paper fully bonding;
Step 4, chip is taken out under uviol lamp, tear glassine paper off, because defective chip and glassine paper are bonded together, therefore can the chip of test failure be removed by the viscosity between glue and glassine paper.
As seen by above-mentioned, the present invention adopts the method for suitable UV glue and ultra violet lamp to make defective chip be bonded on glassine paper and by the defective chip of the disposable rejecting of the method that tears glassine paper off.
Method of the present invention has following beneficial effect with respect to prior art:
There is not artificial omission in 1 all test failure chips of the disposable removal of the present invention's energy;
2 the present invention do not need expensive equipment, have reduced production cost;
3 have improved tradition, and to choose in eliminating method manpower demand many, the problem such as efficient is low;
4 whole operating process of the present invention can not cause secondary pollution and damage to qualified chip, have reduced the waste of chip.
The above is only preferred embodiment of the present invention, is not for limiting protection scope of the present invention.
Claims (3)
1. the screening technique of a photodiode chip, is characterized in that, the method comprises:
Step 1, get the good chip of cleavage and carry out photoelectricity test, utilize tapper to spray UV glue on defective chip and carry out mark;
After step 2, test are completed, the electron level cellophane cover is attached to the upper surface of chip, UV glue is contacted fully with defective chip and glassine paper;
Step 3, the chip that will build glassine paper are put under uviol lamp and are shone, thereby make the UV glue curing make defective chip and glassine paper fully bonding;
Step 4, chip is taken out under uviol lamp, tears glassine paper off, by the viscosity between UV glue and glassine paper with the disposable rejecting of the chip of test failure.
2. the screening technique of photodiode chip as claimed in claim 1, it is characterized in that, it is liquid that described UV glue at room temperature becomes, and mobility is moderate, neither can cross the sticking tapper that stops up, can not cross again that rare mobility is excessive to be caused the pollution of qualified chip on every side.
3. the screening technique of photodiode chip as claimed in claim 1, is characterized in that, in described step 3, irradiation time is at least 5 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100626538A CN103143507A (en) | 2013-02-27 | 2013-02-27 | Screening method of photodiode chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100626538A CN103143507A (en) | 2013-02-27 | 2013-02-27 | Screening method of photodiode chips |
Publications (1)
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| CN103143507A true CN103143507A (en) | 2013-06-12 |
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| CN2013100626538A Pending CN103143507A (en) | 2013-02-27 | 2013-02-27 | Screening method of photodiode chips |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106311625A (en) * | 2015-06-17 | 2017-01-11 | 晶元光电股份有限公司 | Semiconductor element classification method |
| CN106493094A (en) * | 2016-09-23 | 2017-03-15 | 华灿光电（浙江）有限公司 | A kind of detection method of LED chip |
| CN106890802A (en) * | 2017-02-08 | 2017-06-27 | 聚灿光电科技股份有限公司 | A kind of LED disks choose bad point method for separating |
| CN107983665A (en) * | 2017-11-17 | 2018-05-04 | 厦门乾照光电股份有限公司 | A kind of exception LED core particle choosing except method and choosing except system |
| CN110660337A (en) * | 2019-10-15 | 2020-01-07 | 京东方科技集团股份有限公司 | Backboard, display panel and method for processing bad points of micro light-emitting diodes |
| CN113125919A (en) * | 2019-12-26 | 2021-07-16 | 潍坊华光光电子有限公司 | Photosensitive diode chip detection device for laser |
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| JP2002361181A (en) * | 2001-06-08 | 2002-12-17 | Ishikawajima Harima Heavy Ind Co Ltd | Display device for specific material waste for manual sorting |
| CN101861214A (en) * | 2008-10-28 | 2010-10-13 | 松下电器产业株式会社 | Assorting method |
| CN101987322A (en) * | 2009-08-07 | 2011-03-23 | 晶元光电股份有限公司 | Chip classification device and chip classification method |
| CN102244039A (en) * | 2010-05-11 | 2011-11-16 | 扬州杰利半导体有限公司 | Splitting method of semiconductor wafer |
| CN202105806U (en) * | 2011-04-12 | 2012-01-11 | 源兴电子股份有限公司 | Chip detecting device |
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2013
- 2013-02-27 CN CN2013100626538A patent/CN103143507A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2002361181A (en) * | 2001-06-08 | 2002-12-17 | Ishikawajima Harima Heavy Ind Co Ltd | Display device for specific material waste for manual sorting |
| CN101861214A (en) * | 2008-10-28 | 2010-10-13 | 松下电器产业株式会社 | Assorting method |
| CN101987322A (en) * | 2009-08-07 | 2011-03-23 | 晶元光电股份有限公司 | Chip classification device and chip classification method |
| CN102244039A (en) * | 2010-05-11 | 2011-11-16 | 扬州杰利半导体有限公司 | Splitting method of semiconductor wafer |
| CN202105806U (en) * | 2011-04-12 | 2012-01-11 | 源兴电子股份有限公司 | Chip detecting device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106311625A (en) * | 2015-06-17 | 2017-01-11 | 晶元光电股份有限公司 | Semiconductor element classification method |
| CN106311625B (en) * | 2015-06-17 | 2019-02-19 | 晶元光电股份有限公司 | Semiconductor element classification method |
| CN106493094A (en) * | 2016-09-23 | 2017-03-15 | 华灿光电（浙江）有限公司 | A kind of detection method of LED chip |
| CN106890802A (en) * | 2017-02-08 | 2017-06-27 | 聚灿光电科技股份有限公司 | A kind of LED disks choose bad point method for separating |
| CN107983665A (en) * | 2017-11-17 | 2018-05-04 | 厦门乾照光电股份有限公司 | A kind of exception LED core particle choosing except method and choosing except system |
| CN110660337A (en) * | 2019-10-15 | 2020-01-07 | 京东方科技集团股份有限公司 | Backboard, display panel and method for processing bad points of micro light-emitting diodes |
| CN110660337B (en) * | 2019-10-15 | 2021-11-23 | 京东方科技集团股份有限公司 | Backboard, display panel and method for processing bad points of micro light-emitting diodes |
| CN113125919A (en) * | 2019-12-26 | 2021-07-16 | 潍坊华光光电子有限公司 | Photosensitive diode chip detection device for laser |
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Application publication date: 20130612 |