CN103646956B - Band protecting film CCD chip packaging technology - Google Patents
Band protecting film CCD chip packaging technology Download PDFInfo
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- CN103646956B CN103646956B CN201310723204.3A CN201310723204A CN103646956B CN 103646956 B CN103646956 B CN 103646956B CN 201310723204 A CN201310723204 A CN 201310723204A CN 103646956 B CN103646956 B CN 103646956B
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Abstract
For solving CCD chip front that prior art CCD chip packaging technology exists easily by Particulate Pollution be easily scratched, thus underproof problem after causing CCD chip encapsulation, the present invention proposes one band protecting film CCD chip packaging technology.Band protecting film CCD chip packaging technology of the present invention; including; the blue film of patch, scribing, cleaning, expansion crystalline substance, solution sheet, die bonding, bonding solidification, wire bonding sequence; it is characterized in that; first paste one layer of ultraviolet light polymerization protecting film in CCD chip front before the blue membrane process of patch; after bonding process, peel off ultraviolet light polymerization protecting film, then, then carry out bonding solidification and wire bonding sequence.Advantageous Effects with protecting film CCD chip packaging technology of the present invention can protect CCD chip photosurface (i.e. chip front side) not by the pollution of particulate matter and/or scuffing in CCD chip encapsulation process, improves the qualification rate of CCD chip encapsulation.
Description
Invention field
The present invention relates to CCD chip encapsulation technology, be related specifically to a kind of band protecting film CCD chip packaging technology.
Background technology
Prior art CCD chip packaging technology generally includes the blue film of patch, scribing, cleaning, expansion is brilliant, solve the multiple working procedures such as sheet, die bonding, bonding solidification, wire bonding.In encapsulation process, the photosurface (i.e. chip front side) of CCD chip exposes in the environment, the granule that granule in environment, human body and instrument etc. are brought into is all likely to introduce chip front side, hide photosensitive area, form stain or Black strip, affect the photoresponse heterogeneity of CCD, fault number etc..It addition, the scuffing of the chip front side introduced during operation is likely to the alternating current-direct current short circuit directly contributing CCD.And encapsulation is last one technique of CCD chip product, the product failure that encapsulation process causes is especially unacceptable.Whether introducing the particulate matter of chip front side or the scuffing of the chip front side of operating process introducing in encapsulation process, after all causing CCD chip encapsulation, product is defective, seriously constrains the encapsulation yield rate of CCD chip.Obviously, prior art CCD chip packaging technology also exists CCD chip front easily by Particulate Pollution be easily scratched, thus underproof problem after causing CCD chip encapsulation.
Summary of the invention
For solving CCD chip front that prior art CCD chip packaging technology exists easily by Particulate Pollution be easily scratched, thus underproof problem after causing CCD chip encapsulation, the present invention proposes one band protecting film CCD chip packaging technology.Band protecting film CCD chip packaging technology of the present invention; including; the blue film of patch, scribing, cleaning, expansion crystalline substance, solution sheet, die bonding, bonding solidification, wire bonding sequence; it is characterized in that; first paste one layer of ultraviolet light polymerization protecting film in CCD chip front before the blue membrane process of patch; after bonding process, peel off ultraviolet light polymerization protecting film, then, then carry out bonding solidification and wire bonding sequence.
Further, the AdwillT-5782 ultraviolet light polymerization protecting film that ultraviolet light polymerization protecting film is the production of lintec company of Lin get section sticked in CCD chip front with protecting film CCD chip packaging technology of the present invention.
Further, the operation peeling off ultraviolet light polymerization protecting film with protecting film CCD chip packaging technology of the present invention, including:
S1, irradiation under ultraviolet ray make protecting film lose viscosity, and the wavelength of described ultraviolet light is 365nm, and power is 120mw/cm2, energy is 160mJ/cm2；
S2, baking make protecting film crispatura, and baking temperature is 100 DEG C, and baking time is 10 minutes.
Advantageous Effects with protecting film CCD chip packaging technology of the present invention can protect CCD chip photosurface (i.e. chip front side) not by the pollution of particulate matter and/or scuffing in CCD chip encapsulation process, improves the qualification rate of CCD chip encapsulation.
Accompanying drawing explanation
Accompanying drawing 1 is the schematic flow sheet of prior art CCD chip packaging technology；
Accompanying drawing 2 is the schematic flow sheet with protecting film CCD chip packaging technology of the present invention；
Accompanying drawing 3 is of the present invention with the structural representation of CCD chip after protecting film CCD chip packaging technology bonding protective film.
Below in conjunction with drawings and the specific embodiments, band protecting film CCD chip packaging technology of the present invention is further described.
Detailed description of the invention
Accompanying drawing 1 is the schematic flow sheet of prior art CCD chip packaging technology, and as seen from the figure, prior art CCD chip packaging technology generally includes the blue film of patch, scribing, cleaning, expansion is brilliant, solve the multiple working procedures such as sheet, die bonding, bonding solidification, wire bonding.In encapsulation process, the photosurface (i.e. chip front side) of CCD chip exposes in the environment, the granule that granule in environment, human body and instrument etc. are brought into is all likely to introduce chip front side, hide photosensitive area, form stain or Black strip, affect the photoresponse heterogeneity of CCD, fault number etc..It addition, the scuffing of the chip front side introduced during operation is likely to the alternating current-direct current short circuit directly contributing CCD.Obviously, prior art CCD chip packaging technology also exists CCD chip front easily by Particulate Pollution be easily scratched, thus underproof problem after causing CCD chip encapsulation.
Accompanying drawing 2 is the schematic flow sheet with protecting film CCD chip packaging technology of the present invention, and accompanying drawing 3 is of the present invention with the structural representation of CCD chip after protecting film CCD chip packaging technology bonding protective film, and in figure, 1 is ultraviolet light polymerization protecting film, and 2 is chip, and 3 is blue film.As seen from the figure; band protecting film CCD chip packaging technology of the present invention; including; the blue film of patch, scribing, cleaning, expansion crystalline substance, solution sheet, die bonding, bonding solidification, wire bonding sequence; it is characterized in that, before the blue membrane process of patch, first paste one layer of ultraviolet light polymerization protecting film in CCD chip front, after bonding process, peel off ultraviolet light polymerization protecting film; then carry out bonding solidification and wire bonding sequence then,.
The AdwillT-5782 ultraviolet light polymerization protecting film that ultraviolet light polymerization protecting film is the production of lintec company of Lin get section sticked in CCD chip front with protecting film CCD chip packaging technology of the present invention.
The operation peeling off ultraviolet light polymerization protecting film with protecting film CCD chip packaging technology of the present invention, including:
S1, irradiation under ultraviolet ray make protecting film lose viscosity, and the wavelength of described ultraviolet light is 365nm, and power is 120mw/cm2, energy is 160mJ/cm2；
S2, baking make protecting film crispatura, and baking temperature is 100 DEG C, and baking time is 10 minutes.
Band protecting film CCD chip packaging technology of the present invention is after ultraviolet light polymerization protecting film is pasted in CCD chip front, it is possible to be effectively protected chip front side in encapsulation process not by the pollution of particulate matter, without being scratched.Owing to namely ultraviolet light polymerization protecting film loses viscosity by after irradiation under ultraviolet ray, occur curling in baking process subsequently, it is easy to peel off; chip front side will not be injured; without leaving pollutant, chip will not be produced any adverse influence, be effectively increased the qualification rate of CCD chip encapsulation.
Obviously; Advantageous Effects with protecting film CCD chip packaging technology of the present invention can protect CCD chip photosurface (i.e. chip front side) not by the pollution of particulate matter and/or scuffing in CCD chip encapsulation process, improves the qualification rate of CCD chip encapsulation.
Claims (1)
1. a band protecting film CCD chip packaging technology; including; the blue film of patch, scribing, cleaning, expansion crystalline substance, solution sheet, die bonding, bonding solidification, wire bonding sequence; it is characterized in that; first paste one layer of ultraviolet light polymerization protecting film in CCD chip front before the blue membrane process of patch; after bonding process, peel off ultraviolet light polymerization protecting film, then, then carry out bonding solidification and wire bonding sequence；The described ultraviolet light polymerization protecting film sticked in CCD chip front is the AdwillT-5782 ultraviolet light polymerization protecting film that lintec company of Lin get section produces；Wherein, peel off the operation of ultraviolet light polymerization protecting film, including:
S1, irradiation under ultraviolet ray make protecting film lose viscosity, and the wavelength of described ultraviolet light is 365nm, and power is 120mw/cm2, energy is 160mJ/cm2；
S2, baking make protecting film crispatura, and baking temperature is 100 DEG C, baking time 10 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310723204.3A CN103646956B (en) | 2013-12-25 | 2013-12-25 | Band protecting film CCD chip packaging technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310723204.3A CN103646956B (en) | 2013-12-25 | 2013-12-25 | Band protecting film CCD chip packaging technology |
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| Publication Number | Publication Date |
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| CN103646956A CN103646956A (en) | 2014-03-19 |
| CN103646956B true CN103646956B (en) | 2016-07-06 |
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| CN201310723204.3A Active CN103646956B (en) | 2013-12-25 | 2013-12-25 | Band protecting film CCD chip packaging technology |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105720146B (en) * | 2016-04-12 | 2018-08-31 | 中山大学 | A kind of broad-area electrode LED array preparation method |
| CN106711163B (en) * | 2017-01-12 | 2019-06-21 | 中国电子科技集团公司第四十四研究所 | The method of large scale CCD chip is mounted on ceramic cartridge |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1684225A (en) * | 2001-03-21 | 2005-10-19 | 琳得科株式会社 | Sheet material for forming chip protection film |
| CN101118838A (en) * | 2006-08-03 | 2008-02-06 | 国际商业机器公司 | Method, chip and wafer for preventing the formation of backside micro-crack and its frontside extension in the semiconductor chip or wafer |
| CN101350296A (en) * | 2008-09-02 | 2009-01-21 | 广东风华高新科技股份有限公司 | Method for preparing crystal round back electrode and crystal round |
| CN102120560A (en) * | 2010-01-12 | 2011-07-13 | 南茂科技股份有限公司 | Cutting method for micro-electro-mechanical wafer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7279362B2 (en) * | 2005-03-31 | 2007-10-09 | Intel Corporation | Semiconductor wafer coat layers and methods therefor |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1684225A (en) * | 2001-03-21 | 2005-10-19 | 琳得科株式会社 | Sheet material for forming chip protection film |
| CN101118838A (en) * | 2006-08-03 | 2008-02-06 | 国际商业机器公司 | Method, chip and wafer for preventing the formation of backside micro-crack and its frontside extension in the semiconductor chip or wafer |
| CN101350296A (en) * | 2008-09-02 | 2009-01-21 | 广东风华高新科技股份有限公司 | Method for preparing crystal round back electrode and crystal round |
| CN102120560A (en) * | 2010-01-12 | 2011-07-13 | 南茂科技股份有限公司 | Cutting method for micro-electro-mechanical wafer |
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| CN103646956A (en) | 2014-03-19 |
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Effective date of registration: 20190705 Address after: 401332 367, West Wing Road, Xiyong Town, Shapingba District, Chongqing Patentee after: China Electric Technology Group Chongqing acoustic photoelectric Co., Ltd. Address before: 400060 No. 14 Yuanyuan Road, Nanan District, Chongqing Patentee before: No.44 Inst., China Electronical Science and Technology Group Co. |
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Effective date of registration: 20210126 Address after: 400060 No. 14, Huayuan Road, Nan'an District, Chongqing Patentee after: THE 44TH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY Group Corp. Address before: 401332 367, West Wing Road, Xiyong Town, Shapingba District, Chongqing Patentee before: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION CHONGQING ACOUSTIC-OPTIC-ELECTRONIC Co.,Ltd. |
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