CN204803396U - Vacuum sputter coating device - Google Patents
Vacuum sputter coating device Download PDFInfo
- Publication number
- CN204803396U CN204803396U CN201520489263.3U CN201520489263U CN204803396U CN 204803396 U CN204803396 U CN 204803396U CN 201520489263 U CN201520489263 U CN 201520489263U CN 204803396 U CN204803396 U CN 204803396U
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- fixed
- plate
- negative electrode
- coating device
- collets
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Abstract
The utility model discloses a vacuum sputter coating device, including vacuum cavity, positive pole, air inlet, delivery roll, negative pole target and negative pole, the vacuum cavity is formed by connecting first the U -shaped negative pole apron and the U -shaped sun plate frame of lower half, connector plates is installed through the bolt in the inboard of negative pole apron, and connector plates's inboard the welding has stainless steel meshwork, a plurality of delivery rolls are installed to the bottom of vacuum cavity, are fixed with the fixed plate between the delivery roll, and the fixed orifices that the fixed plate passes through on the fixed plate is fixed in positive plate frame's bottom, be fixed with collets through the fastener on the fixed plate, the both sides of collets are fixed with the curb plate through the fastener, and the top of collets is fixed with the base plate through the fastener, the inside of vacuum cavity is equipped with multiunit bilateral symmetry's air inlet. This vacuum coating device has not only reduced dropping of sputter material, has guaranteed insulating nature, can adapt to different technological requirements moreover.
Description
Technical field
The utility model belongs to film coating apparatus field, is specifically related to a kind of vacuum sputtering coating device.
Background technology
Sputter coating is widely used in glass, pottery, the fields such as semi-conductor, sputter coating refers to the splash effect utilizing particle bombardment target to produce in vacuum environment, target atom or molecule are penetrated from solid surface, in the film forming process of deposition on substrate, belong to the one that physical vapor deposition (PVD) prepares thin film technique, but there is electroconductibility between the cavity of existing vacuum sputtering coating device and baffle plate, and the stainless steel baffle plate absorption sputtering material of upper part of sputtering chamber is limited in one's ability, sputtering material is caused to drop, can not be attached on product completely if the surface dropping on product causes rete below to sputter, affect the quality of product.
Utility model content
The purpose of this utility model is to provide a kind of vacuum sputtering coating device, to solve the problem proposed in above-mentioned background technology.
For achieving the above object, the utility model provides a kind of technical scheme: a kind of vacuum sputtering coating device, comprise vacuum chamber, anode, inlet mouth, delivery roll, cathode targets and negative electrode, described vacuum chamber is formed by connecting by the U-shaped negative electrode cover plate of the first half and the U-shaped anode sheet frame of Lower Half, and junction is provided with sealing member, the inner side of described negative electrode cover plate is provided with junction steel plate by bolt, the inner side of junction steel plate is welded with stainless (steel) wire, negative electrode is provided with in described negative electrode cover plate, described negative electrode is connected with cathode power, described negative electrode below be provided with cathode targets, the both sides of described anode sheet frame are respectively equipped with feeding mouth and discharge port, the top of feeding mouth and discharge port is respectively provided with an anode, described anode is connected with plate supply, the bottom of described vacuum chamber is provided with multiple delivery roll, retaining plate is fixed with between delivery roll, retaining plate is fixed on the bottom of anode sheet frame by the fixed orifices on retaining plate, described retaining plate is fixed with collets by fastening piece, the both sides of described collets are fixed with side plate by fastening piece, the top of collets is fixed with substrate by fastening piece, the inside of described vacuum chamber is provided with the symmetrical inlet mouth of many groups.
Preferably, the height of described substrate is lower than the height of delivery roll.
Preferably, described substrate and side plate are structure as a whole, and are provided with gap between side plate and retaining plate.
Preferably, the size shape of described inlet mouth is different, and inlet mouth place is provided with gas flow controller.
Technique effect of the present utility model and advantage: a kind of inner side of negative electrode cover plate of vacuum sputtering coating device is provided with junction steel plate by bolt, the inner side of junction steel plate is welded with stainless (steel) wire, add the adsorptive power to sputtering material, decrease dropping of sputtering material, and it is easy to clean, retaining plate is fixed with collets by fastening piece, the both sides of collets are fixed with side plate by fastening piece, the top of collets is fixed with substrate by fastening piece, ensure that the insulativity of substrate and vacuum chamber, facilitate the replacing of substrate and side plate simultaneously, the inside of vacuum chamber is provided with the symmetrical inlet mouth of many groups, the size shape of inlet mouth is different, and inlet mouth place is provided with gas flow controller, the gas flow of each inlet mouth is adjusted by gas flow control device, thus adapt to different processing requirements.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
In figure: 1, vacuum chamber; 101, negative electrode cover plate; 102, anode sheet frame; 2, junction steel plate; 3, stainless (steel) wire; 4, sealing member; 5, plate supply; 6, anode; 7, feeding mouth; 8, inlet mouth; 9, delivery roll; 10, retaining plate; 11, fastening piece; 12, fixed orifices; 13, side plate; 14, collets; 15, substrate; 16, discharge port; 17, cathode targets; 18, negative electrode; 19, cathode power.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
The utility model provides a kind of vacuum sputtering coating device as shown in Figure 1, comprise vacuum chamber 1, anode 6, inlet mouth 8, delivery roll 9, cathode targets 17 and negative electrode 18, vacuum chamber 1 is formed by connecting by the U-shaped negative electrode cover plate 101 of the first half and the U-shaped anode sheet frame 102 of Lower Half, and junction is provided with sealing member 4, the inner side of negative electrode cover plate 101 is provided with junction steel plate 2 by bolt, the inner side of junction steel plate 2 is welded with stainless (steel) wire 3, negative electrode 18 is provided with in negative electrode cover plate 101, described negative electrode 18 is connected with cathode power 19, negative electrode 18 below be provided with cathode targets 17, the both sides of anode sheet frame 102 are respectively equipped with feeding mouth 7 and discharge port 16, feeding mouth 7 is respectively provided with an anode 6 with the top of discharge port 16, anode 6 is connected with plate supply 5, the bottom of vacuum chamber 1 is provided with multiple delivery roll 9, retaining plate 10 is fixed with between delivery roll 9, retaining plate 10 is fixed on the bottom of anode sheet frame 102 by the fixed orifices 12 on retaining plate, retaining plate 10 is fixed with collets 14 by fastening piece 11, the both sides of collets 14 are fixed with side plate 13 by fastening piece 11, the top of collets 14 is fixed with substrate 15 by fastening piece 11, substrate 15 and side plate 13 are structure as a whole, and be provided with gap between side plate 13 and retaining plate 10, the height of substrate 15 is lower than the height of delivery roll 9, the inside of vacuum chamber 1 is provided with the symmetrical inlet mouth 8 of many groups, the size shape of inlet mouth 8 is different, and inlet mouth 8 place is provided with gas flow controller.
Principle of work, the inner side of negative electrode cover plate 101 is provided with junction steel plate 2 by bolt, junction steel plate 2 is welded with stainless (steel) wire 3, add adsorptive power, when sputtering material is adsorbed on stainless (steel) wire 3, junction steel plate 2 can be unloaded, clean is carried out to stainless (steel) wire 3, according to different processing requirements, adjusted the gas flow of each inlet mouth 8 by gas flow control device.
Last it is noted that the foregoing is only preferred embodiment of the present utility model; be not limited to the utility model; although be described in detail the utility model with reference to previous embodiment; for a person skilled in the art; it still can be modified to the technical scheme described in foregoing embodiments; or equivalent replacement is carried out to wherein portion of techniques feature; all within spirit of the present utility model and principle; any amendment of doing, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (4)
1. a vacuum sputtering coating device, comprise vacuum chamber (1), anode (6), inlet mouth (8), delivery roll (9), cathode targets (17) and negative electrode (18), it is characterized in that: described vacuum chamber (1) is formed by connecting by the U-shaped negative electrode cover plate (101) of the first half and the U-shaped anode sheet frame (102) of Lower Half, and junction is provided with sealing member (4), the inner side of described negative electrode cover plate (101) is provided with junction steel plate (2) by bolt, the inner side of junction steel plate (2) is welded with stainless (steel) wire (3), negative electrode (18) is provided with in described negative electrode cover plate (101), described negative electrode (18) is connected with cathode power (19), described negative electrode (18) below be provided with cathode targets (17), the both sides of described anode sheet frame (102) are respectively equipped with feeding mouth (7) and discharge port (16), feeding mouth (7) is respectively provided with an anode (6) with the top of discharge port (16), described anode (6) is connected with plate supply (5), the bottom of described vacuum chamber (1) is provided with multiple delivery roll (9), retaining plate (10) is fixed with between delivery roll (9), retaining plate (10) is fixed on the bottom of anode sheet frame (102) by the fixed orifices (12) on retaining plate, described retaining plate (10) is fixed with collets (14) by fastening piece (11), the both sides of described collets (14) are fixed with side plate (13) by fastening piece (11), the top of collets (14) is fixed with substrate (15) by fastening piece (11), the inside of described vacuum chamber (1) is provided with multiple inlet mouth (8).
2. a kind of vacuum sputtering coating device according to claim 1, is characterized in that: the height of described substrate (15) is lower than the height of delivery roll (9).
3. a kind of vacuum sputtering coating device according to claim 1, is characterized in that: described substrate (15) and side plate (13) are structure as a whole, and are provided with gap between side plate (13) and retaining plate (10).
4. a kind of vacuum sputtering coating device according to claim 1, it is characterized in that: the size shape of described inlet mouth (8) is different, and inlet mouth (8) place is provided with gas flow controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520489263.3U CN204803396U (en) | 2015-07-09 | 2015-07-09 | Vacuum sputter coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520489263.3U CN204803396U (en) | 2015-07-09 | 2015-07-09 | Vacuum sputter coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204803396U true CN204803396U (en) | 2015-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520489263.3U Expired - Fee Related CN204803396U (en) | 2015-07-09 | 2015-07-09 | Vacuum sputter coating device |
Country Status (1)
| Country | Link |
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| CN (1) | CN204803396U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107523854A (en) * | 2017-09-28 | 2017-12-29 | 张家港天工机械制造有限公司 | A kind of cathode roll |
| CN112159961A (en) * | 2020-09-06 | 2021-01-01 | 湖北亿钧耀能新材股份公司 | Sputtering chamber of glass coating equipment |
-
2015
- 2015-07-09 CN CN201520489263.3U patent/CN204803396U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107523854A (en) * | 2017-09-28 | 2017-12-29 | 张家港天工机械制造有限公司 | A kind of cathode roll |
| CN112159961A (en) * | 2020-09-06 | 2021-01-01 | 湖北亿钧耀能新材股份公司 | Sputtering chamber of glass coating equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151125 Termination date: 20190709 |