CN103290385B - Roll-to-roll vertical type magnetic control film plating device - Google Patents
Roll-to-roll vertical type magnetic control film plating device Download PDFInfo
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- CN103290385B CN103290385B CN201310196343.5A CN201310196343A CN103290385B CN 103290385 B CN103290385 B CN 103290385B CN 201310196343 A CN201310196343 A CN 201310196343A CN 103290385 B CN103290385 B CN 103290385B
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- 238000007747 plating Methods 0.000 title abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 49
- 238000009498 subcoating Methods 0.000 claims description 142
- 238000000576 coating method Methods 0.000 claims description 60
- 239000011248 coating agent Substances 0.000 claims description 57
- 238000005096 rolling process Methods 0.000 claims description 30
- 239000007888 film coating Substances 0.000 claims description 29
- 238000009501 film coating Methods 0.000 claims description 29
- 230000007704 transition Effects 0.000 claims description 21
- 238000010849 ion bombardment Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000012535 impurity Substances 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 28
- 239000012298 atmosphere Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 229910001423 beryllium ion Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000001994 activation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
Abstract
The invention discloses a roll-to-roll vertical type magnetic control film plating device. The roll-to-roll vertical type magnetic control film plating device comprises a film plating chamber, wherein one end of the film plating chamber is connected with an unreeling chamber; the unreeling chamber is internally provided with an unreeling roller and a guide roller with vertical shafts; the other end of the film plating chamber is connected with a reeling chamber; the reeling chamber is provided with a reeling roller and a first guide roller with vertical shafts; the side wall of the film plating chamber is provided with a magnetron sputtering target; the target face of the magnetron sputtering target is vertical and is parallel to a plane of a flexible substrate; slits, through which the flexible substrate passes, are respectively arranged between the unreeling chamber and the film plating chamber, and between the film plating chamber and the reeling chamber; the unreeling chamber, the film plating chamber and the reeling chamber are respectively provided with an independent air exhausting system. The device disclosed by the invention can prevent foreign gas from polluting the film plating chamber so as to guarantee that a film layer is not polluted by impurities; meanwhile, fine powder and grains generated in a chamber body are prevented from falling onto the surface of the flexible substrate and the target face of the magnetron sputtering target, thereby avoiding a needle hole in the film layer and guaranteeing the quality of the film layer.
Description
Technical field
The present invention relates to coating technique field, especially relate to the vertical magnetic control film coating apparatus of a kind of volume to volume.
Background technology
The vertical magnetic control sputtering film plating device of volume to volume plates the retes such as matel coated, nonmetal and/or oxide compound on flexible substrate under being mainly used in vacuum condition.It specifically can be applicable to as the conductive layer etc. that is coated with flexible thin-film solar cell face electrode, back electrode, CIG semiconductor layer and flexible circuit board.
Volume to volume vacuum magnetic control film coating equipment common in prior art is single devices, equipment basic structure is generally made up of a vacuum chamber, wind-up roll, let off roll, multiple deflector roll, cold drum, one group of deviation rectification roller etc., and be horizontal type structure, namely target the below of cold drum or above, in equipment work process, face, thin-film material place is on horizontal plane all the time.
Existing this volume to volume vacuum magnetic control film coating equipment because of target position that structure is limit less, sputter material is single; Owing to adopting horizontal type structure; during equipment work, target and flexible substrate are flat prone position state; coating process internal vacuum chamber formed fine particle can drop on institute's flexible substrate and target formed pollute, the plated film rete thus causing flexible substrate to be formed there will be needle pore defect.
The retractable winding up roller of existing this volume to volume vacuum magnetic control film coating equipment is in same plated film vacuum chamber simultaneously, unreel flexible substrate to be plated in process during normal work and can discharge a large amount of foreign gas under vacuum conditions, thus the work atmosphere of target and composition in plated film vacuum chamber, adverse influence is produced to rete.
In addition, the retractable winding up roller of existing this volume to volume vacuum magnetic control film coating equipment and the position of cold drum limited, the deflector roll of wind-up roll side is inevitably to the rete extruding be coated with, and the coating materials not high to hardness easily makes institute's coatings occur defects such as " scuffings ".And owing to only having a plated film vacuum chamber, so working vacuum atmosphere only has one, cannot plate simultaneously be coated with two or more has different requirement rete to atmosphere.
Summary of the invention
Main purpose of the present invention is to provide a kind of volume to volume vertical magnetic control film coating apparatus, prevents the rete that flexible substrate is formed from there is needle pore defect, prevents foreign gas from polluting coating chamber, to ensure the film quality of flexible substrate.
The present invention proposes the vertical magnetic control film coating apparatus of a kind of volume to volume, comprising: coating chamber, and one end of this coating chamber is connected with one and unreels room, and this unreels indoor and is provided with the let off roll and guide roller that roll shaft is vertical direction setting; The other end of coating chamber is connected with a rolling room, and this rolling room is provided with the wind-up roll and the first guide roller that roll shaft is vertical direction setting; The sidewall of described coating chamber is provided with magnetron sputtering target, and the target surface of this magnetron sputtering target is that vertical direction is arranged, and parallel with face, flexible substrate place; Describedly unreel room and coating chamber, between coating chamber and rolling room, be respectively equipped with slit by flexible substrate; Described room, coating chamber and the rolling room of unreeling is respectively equipped with independently air-bleed system.
Preferably, described coating chamber comprises: the first sub-coating chamber, the second sub-coating chamber; Connect between described first sub-coating chamber and the second sub-coating chamber and a transition chamber is set;
Unreel room described in one end that described first sub-coating chamber is not connected with transition chamber connects, one end that described second sub-coating chamber is not connected with transition chamber connects described rolling room;
Describedly unreel room and the first sub-coating chamber, the first sub-coating chamber and transition chamber, transition chamber and the second sub-coating chamber, between the second sub-coating chamber and rolling room, be respectively equipped with described slit;
Described first sub-coating chamber, transition chamber and the second sub-coating chamber are respectively arranged with independently air-bleed system.
Preferably, described first sub-coating chamber comprises: sub-coating chamber before first, be connected with coating chamber before first first after sub-coating chamber; Described slit is provided with between sub-coating chamber after sub-coating chamber and first before described first.
Preferably, before described first after sub-coating chamber and first sub-coating chamber sidewall on be respectively equipped with magnetron sputtering target described at least one.
Preferably, the magnetron sputtering target before described first in sub-coating chamber is arranged on left side wall or right side wall; Magnetron sputtering target after described first in sub-coating chamber is arranged on left side wall or right side wall.
Preferably, described second sub-coating chamber comprises: sub-coating chamber before second, be connected with coating chamber before second second after sub-coating chamber; Described slit is provided with between sub-coating chamber after sub-coating chamber and second before described second.
Preferably, before described second after sub-coating chamber and second sub-coating chamber sidewall on be equipped with magnetron sputtering target described at least one.
Preferably, the magnetron sputtering target before described second in sub-coating chamber is arranged on left side wall or right side wall, and the magnetron sputtering target after described second in sub-coating chamber is arranged on left side wall or right side wall.
Preferably, unreel between room and the first sub-coating chamber described in and be provided with pretreatment chamber, pretreated ion bombardment instrument before this pretreatment chamber is provided with and carries out plated film to flexible substrate.
Preferably, between described rolling room and the second sub-coating chamber, be provided with after-processing chamber, in this after-processing chamber, be provided with ion bombardment instrument flexible substrate rete being carried out to film aftertreatment.
The vertical magnetic control film coating apparatus of a kind of volume to volume provided by the present invention, by room, coating chamber and the isolation of rolling room will be unreeled, the foreign gas that can prevent from unreeling flexible substrate release in process pollutes coating chamber, maintain the atmosphere that coating chamber is simple, to ensure flexible substrate rete not by contaminating impurity; The roll shaft of let off roll, wind-up roll is set to vertical direction, and the target surface of magnetron sputtering target 111 is set to vertical direction simultaneously; In coating process, the target surface of face, flexible substrate place and magnetic magnetic sputtering target is all in vertical state, the fine dusts produced in the body of room and particle can not fall on the target surface of flexible substrate surface and magnetron sputtering target, therefore avoid flexible substrate rete and occur pin-hole phenomena, further ensure the quality of flexible substrate rete.
Accompanying drawing explanation
Fig. 1 is the perspective view of the vertical magnetic control film coating apparatus of volume to volume of the present invention;
Fig. 2 is the plan structure schematic diagram of the vertical magnetic control film coating apparatus of volume to volume of the present invention.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
See Fig. 1 and Fig. 2, a kind of volume to volume of the present invention vertical magnetic control film coating apparatus 100 1 embodiment is proposed, it comprises: coating chamber 110, and one end of this coating chamber 110 is connected with one and unreels room 120, and this unreels in room 120 and is provided with the let off roll 121 and guide roller 122 that roll shaft is vertical direction setting; The other end of coating chamber 110 is connected with a rolling room 130, and this rolling room 130 is provided with the wind-up roll 131 and the first guide roller 132 that roll shaft is vertical direction setting; The sidewall of described coating chamber 110 is provided with magnetron sputtering target 111, and the target surface of this magnetron sputtering target 111 is that vertical direction is arranged, and parallel with face, flexible substrate 101 place; Describedly unreel room 120 and coating chamber 110, between coating chamber 110 and rolling room 130, be respectively equipped with slit (scheming not shown) by flexible substrate 101; Described room 120, coating chamber 110 and the rolling room 130 of unreeling is respectively equipped with independently air-bleed system 103.
In the present embodiment, be all in high vacuum state owing to unreeling room 120, rolling room 130 and coating chamber 110, internal gas density is little; Therefore the gas unreeled in room 120, coating chamber 110 and rolling room 130 can not pass slit (scheming not shown) and enter in adjacent room body.
In the present embodiment, the roll shaft due to described let off roll 121, guide roller 122, wind-up roll 131, first guide roller 132 is that vertical direction is arranged.Let off roll 131 unreels, and face, flexible substrate 101 place is in vertical state in wind-up roll 131 wrapup procedure, therefore flexible substrate 101 by unreel room 120 move to rolling room 130 time, unreel the fine dusts that produces in room 120, coating chamber 110, rolling room 130 and particle can not fall into it on the surface.The target surface of described magnetron sputtering target 111 is that vertical direction is arranged simultaneously, the fine dusts produced in coating chamber 110 and particle can not fall on target surface, therefore the rete of flexible substrate 101 effectively can be avoided to occur pin-hole phenomena, ensure that the quality of flexible substrate 101 rete.
In addition, in the present embodiment, independently vacuum chamber body is isolated into respectively owing to unreeling room 120, coating chamber 110 and rolling room 130, let off roll 121 can discharge a large amount of foreign gas at vacuum state unreeling flexible substrate 101 in process, the gas simultaneously discharged can be good at being isolated in outside coating chamber 110, therefore can ensure that coating chamber 110 is not polluted by foreign gas, maintain simple atmosphere, hinge structure can ensure the rete after flexible substrate 101 plated film further not by contaminating impurity.
Further, see Fig. 1 and Fig. 2, in described volume to volume vertical magnetic control film coating apparatus 100 embodiment, described coating chamber 110 comprises: the sub-coating chamber 1120 of the first sub-coating chamber 1110, second; Connect between described first sub-coating chamber 1110 and the second sub-coating chamber 1120 and a transition chamber 1130 is set.Unreel room 120 described in one end that described first sub-coating chamber 1110 is not connected with transition chamber 1130 connects, one end that described second sub-coating chamber 1120 is not connected with transition chamber 1130 connects described rolling room 130.Describedly unreel room 120 and the first sub-coating chamber 1110 of sub-coating chamber 1110, first and transition chamber 1130, transition chamber 1130 and be respectively equipped with described slit (scheming not shown) between the second sub-coating chamber 1120 of sub-coating chamber 1120, second and rolling room 130; Described first sub-coating chamber 1110, transition chamber 1130 and the second sub-coating chamber 1120 are respectively arranged with independently air-bleed system 103.
In the present embodiment, because coating chamber 110 comprises the first sub-coating chamber 1110 and the second sub-coating chamber 1120, therebetween connect and a transition chamber 1130 is set, and the first sub-coating chamber 1120 of sub-coating chamber 1110, second and transition chamber 1130 are respectively equipped with independently air-bleed system 103; Therefore the magnetron sputtering target 111 of the first sub-coating chamber 1110 and the second sub-coating chamber 1120 can adopt different coating materials simultaneously, and two kinds of coating materials sputter on flexible substrate 101 under can realizing different process atmospheric condition simultaneously, as the first sub-coating chamber 1110 splash-proofing sputtering metal material in straight argon atmosphere, second sub-coating chamber 1120 sputters oxide compound in the atmosphere being furnished with trace oxygen, can realize on flexible substrate 101, be coated with two kinds of retes.
In addition, if product requirement is coated with multilayer film, the sub-coating chamber setting up corresponding number between room 120 and rolling room 130 can be unreeled in upper institute device 100, connect between adjacent sub-coating chamber and a transition chamber 1130 is set.
Further, see Fig. 1 and Fig. 2, in above-mentioned volume to volume vertical magnetic control film coating apparatus 100 embodiment, described first sub-coating chamber 1110 comprises: sub-coating chamber 1111 before first, be connected with coating chamber 1111 sub-before first first after sub-coating chamber 1112; Described slit (scheming not shown) is provided with between sub-coating chamber 1111 and the first rear sub-coating chamber 1112 before described first.Before described first after sub-coating chamber 1111 and first sub-coating chamber 1112 sidewall on be respectively equipped with magnetron sputtering target 111 described at least one.
In the present embodiment, before described first, sub-coating chamber 1111 and the first rear sub-coating chamber 1112 should adopt same atmosphere, but the magnetron sputtering target 111 of the two inside can adopt the corresponding flexible substrate 101 of different coating materials to carry out sputter coating.Wherein, described different coating materials can in same atmosphere sputter coating.
Further, in described volume to volume vertical magnetic control film coating apparatus 100 embodiment, the magnetron sputtering target 111 before described first in sub-coating chamber 1111 is arranged on left side wall or right side wall; Magnetron sputtering target 111 after described first in sub-coating chamber 1112 is arranged on left side wall or right side wall.
In the present embodiment, be arranged at the left surface plated film of the magnetron sputtering target 111 pairs of flexible substrates on left side wall, be arranged at the right surface coating of the magnetron sputtering target 111 pairs of flexible substrates on left side wall.Magnetron sputtering target 111 before first after sub-coating chamber 1111 and first in sub-coating chamber 1112 is all arranged on left side wall, then flexible substrate 101 is by after sub-coating chamber 1112 after sub-coating chamber before first 1111 and first, and its left surface just can be coated with two-layer plated film.Magnetron sputtering target 111 before first after sub-coating chamber 1111 and first in sub-coating chamber 1112 is all arranged on right side wall.Then flexible substrate 101 is by after sub-coating chamber 1112 after sub-coating chamber before first 1111 and first, and its right surface just can be coated with two-layer plated film.Magnetron sputtering target 111 before first in sub-coating chamber 1111 is arranged at left side wall; Magnetron sputtering target 111 after described first in sub-coating chamber 1112 is arranged on right side wall.Then flexible substrate 101 is by after sub-coating chamber 1112 after sub-coating chamber before first 1111 and first, and its left and right surfaces just can be coated with one deck plated film respectively.Magnetron sputtering target 111 before first in sub-coating chamber 1111 is arranged at right side wall; Magnetron sputtering target 111 after described first in sub-coating chamber 1112 is arranged on left side wall.Then flexible substrate 101 is by after sub-coating chamber 1112 after sub-coating chamber before first 1111 and first, and its left and right surfaces just can be coated with one deck plated film respectively.Namely the device 100 that the present embodiment provides both can realize flexible substrate 101 coating single side, can realize again flexible substrate 101 double-sided coating.
Further, see Fig. 1 and Fig. 2, in above-mentioned volume to volume vertical magnetic control film coating apparatus 100 embodiment, described second sub-coating chamber 1120 comprises: sub-coating chamber 1121 before second, be connected with coating chamber 1121 sub-before second second after sub-coating chamber 1122; Described slit (scheming not shown) is provided with between sub-coating chamber 1121 and the second rear sub-coating chamber 1122 before described second.Before described second after sub-coating chamber 1121 and second sub-coating chamber 1121 sidewall on be equipped with magnetron sputtering target 111 described at least one.
In the present embodiment, before described second, sub-coating chamber 1121 and the first rear sub-coating chamber 1122 should adopt same atmosphere, but the magnetron sputtering target 111 of the two inside can adopt the corresponding flexible substrate 101 of different coating materials to carry out sputter coating.Wherein, described different coating materials can in same atmosphere sputter coating.
Further, in above-mentioned volume to volume vertical magnetic control film coating apparatus 100 embodiment, magnetron sputtering target 111 before described second in sub-coating chamber 1121 is arranged on left side wall or right side wall, and the magnetron sputtering target 111 after described second in sub-coating chamber 1122 is arranged on left side wall or right side wall.
In the present embodiment, be arranged at the left surface plated film of the magnetron sputtering target 111 pairs of flexible substrates 101 on left side wall, be arranged at the right surface coating of the magnetron sputtering target 111 pairs of flexible substrates 101 on left side wall.Magnetron sputtering target 111 before second after sub-coating chamber 1121 and second in sub-coating chamber 1122 is all arranged on left side wall, then flexible substrate 101 is by after sub-coating chamber 1122 after sub-coating chamber before second 1121 and second, and its left surface just can be coated with two-layer plated film.Magnetron sputtering target 111 before second after sub-coating chamber 1121 and second in sub-coating chamber 1122 is all arranged on right side wall.Then flexible substrate 101 is by after sub-coating chamber 1122 after sub-coating chamber before second 1121 and second, and its right surface just can be coated with two-layer plated film.Magnetron sputtering target 111 before second in sub-coating chamber 1121 is arranged at left side wall; Magnetron sputtering target 111 after described second in sub-coating chamber 1122 is arranged on right side wall.Then flexible substrate 101 is by after sub-coating chamber 1122 after sub-coating chamber before second 1121 and second, and its left and right surfaces just can be coated with one deck plated film respectively.Magnetron sputtering target 111 before second in sub-coating chamber 1121 is arranged at right side wall; Magnetron sputtering target 111 after described second in sub-coating chamber 1122 is arranged on left side wall.Then flexible substrate 101 is by after sub-coating chamber 1122 after sub-coating chamber before second 1121 and second, and its left and right surfaces just can be coated with one deck plated film respectively.Namely the device 100 that the present embodiment provides both can realize flexible substrate 101 coating single side, can realize again flexible substrate 101 double-sided coating.
Further, see Fig. 1 and Fig. 2, in above-mentioned volume to volume vertical magnetic control film coating apparatus 100 embodiment, described in unreel between room 120 and the first sub-coating chamber 1110 and be provided with pretreatment chamber 140, pretreated ion bombardment instrument 141 before this pretreatment chamber 140 is provided with and carries out plated film to flexible substrate 101.Described ion bombardment instrument 141 can be ion source.Before described plated film, pre-treatment mainly comprises and carries out cleaning and/or surface activation process before plated film, to ensure the film quality after flexible substrate 101 plated film to flexible substrate 101.
Further, see Fig. 1 and Fig. 2, in above-mentioned volume to volume vertical magnetic control film coating apparatus 100 embodiment, be provided with after-processing chamber 150 between described rolling room 130 and the second sub-coating chamber 1120, in this after-processing chamber 150, be provided with the first ion bombardment instrument 151 flexible substrate 101 rete being carried out to film aftertreatment.Described first ion bombardment instrument 151 can be ion source.In the present embodiment, carry out film aftertreatment by the rete of the first ion bombardment instrument 151 pairs of flexible substrates 101 and can improve film quality further.
In addition, device 100 provided by the present invention, owing to unreeling room 120, coating chamber 110, rolling room 130 be isolated into independently room body, distance in rolling room 130 between wind-up roll 131 and the first guide roller 132 is in safety range, first guide roller 132 can not be expressed to the rete on flexible substrate 101, therefore can not to defects such as the retes " scuffing " on flexible substrate 101.
Should be understood that; these are only the preferred embodiments of the present invention; can not therefore limit the scope of the claims of the present invention; every utilize specification sheets of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. the vertical magnetic control film coating apparatus of volume to volume, is characterized in that, comprising: coating chamber, and one end of this coating chamber is connected with one and unreels room, and this unreels indoor and is provided with the let off roll and guide roller that roll shaft is vertical direction setting; The other end of coating chamber is connected with a rolling room, and this rolling room is provided with the wind-up roll and the first guide roller that roll shaft is vertical direction setting; Let off roll unreels and in wind-up roll wrapup procedure, face, flexible substrate place is in vertical state; The sidewall of described coating chamber is provided with magnetron sputtering target, and the target surface of this magnetron sputtering target is that vertical direction is arranged, and parallel with face, flexible substrate place; Describedly unreel room and coating chamber, between coating chamber and rolling room, be respectively equipped with slit by flexible substrate; Described room, coating chamber and the rolling room of unreeling is respectively equipped with independently air-bleed system.
2. the vertical magnetic control film coating apparatus of volume to volume according to claim 1, it is characterized in that, described coating chamber comprises: the first sub-coating chamber, the second sub-coating chamber; Connect between described first sub-coating chamber and the second sub-coating chamber and a transition chamber is set;
Unreel room described in one end that described first sub-coating chamber is not connected with transition chamber connects, one end that described second sub-coating chamber is not connected with transition chamber connects described rolling room;
Describedly unreel room and the first sub-coating chamber, the first sub-coating chamber and transition chamber, transition chamber and the second sub-coating chamber, between the second sub-coating chamber and rolling room, be respectively equipped with described slit;
Described first sub-coating chamber, transition chamber and the second sub-coating chamber are respectively arranged with independently air-bleed system.
3. the vertical magnetic control film coating apparatus of volume to volume according to claim 2, it is characterized in that, described first sub-coating chamber comprises: sub-coating chamber before first, be connected with coating chamber before first first after sub-coating chamber; Described slit is provided with between sub-coating chamber after sub-coating chamber and first before described first.
4. the vertical magnetic control film coating apparatus of volume to volume according to claim 3, is characterized in that, before described first after sub-coating chamber and first sub-coating chamber sidewall on be respectively equipped with magnetron sputtering target described at least one.
5. the vertical magnetic control film coating apparatus of volume to volume according to claim 4, it is characterized in that, the magnetron sputtering target before described first in sub-coating chamber is arranged on left side wall or right side wall; Magnetron sputtering target after described first in sub-coating chamber is arranged on left side wall or right side wall.
6. the vertical magnetic control film coating apparatus of volume to volume according to claim 2, it is characterized in that, described second sub-coating chamber comprises: sub-coating chamber before second, be connected with coating chamber before second second after sub-coating chamber; Described slit is provided with between sub-coating chamber after sub-coating chamber and second before described second.
7. the vertical magnetic control film coating apparatus of volume to volume according to claim 6, is characterized in that, before described second after sub-coating chamber and second sub-coating chamber sidewall on be equipped with magnetron sputtering target described at least one.
8. the vertical magnetic control film coating apparatus of volume to volume according to claim 7, it is characterized in that, magnetron sputtering target before described second in sub-coating chamber is arranged on left side wall or right side wall, and the magnetron sputtering target after described second in sub-coating chamber is arranged on left side wall or right side wall.
9. the vertical magnetic control film coating apparatus of volume to volume according to any one of claim 1 to 8, is characterized in that, described in unreel between room and the first sub-coating chamber and be provided with pretreatment chamber, pretreated ion bombardment instrument before this pretreatment chamber is provided with and carries out plated film to flexible substrate.
10. the vertical magnetic control film coating apparatus of volume to volume according to any one of claim 1 to 8, it is characterized in that, be provided with after-processing chamber between described rolling room and the second sub-coating chamber, in this after-processing chamber, be provided with ion bombardment instrument flexible substrate rete being carried out to film aftertreatment.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310196343.5A CN103290385B (en) | 2013-05-24 | 2013-05-24 | Roll-to-roll vertical type magnetic control film plating device |
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| CN201310196343.5A CN103290385B (en) | 2013-05-24 | 2013-05-24 | Roll-to-roll vertical type magnetic control film plating device |
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| CN103290385A CN103290385A (en) | 2013-09-11 |
| CN103290385B true CN103290385B (en) | 2015-07-22 |
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| CN104775102B (en) * | 2015-05-04 | 2017-07-14 | 上海产业技术研究院 | The vacuum coating system that volume to volume magnetic control sputtering cathode is combined with column multi-arc source |
| CN106086822B (en) * | 2016-07-28 | 2018-06-08 | 河北大学 | Suitable for the roll-to-roll vacuum coating reaction unit of batch processing |
| CN106319473B (en) * | 2016-08-31 | 2019-04-16 | 旭科新能源股份有限公司 | CIGS solar battery thin film production line |
| CN106282958A (en) * | 2016-11-03 | 2017-01-04 | 成都捷翼电子科技有限公司 | A kind of volume to volume fine vacuum sputter system for flexible electronic component and method |
| CN109049660A (en) * | 2018-08-01 | 2018-12-21 | 嘉兴高正新材料科技股份有限公司 | A kind of high performance membrane material plasma processing equipment |
| CN113097393B (en) * | 2021-04-12 | 2024-02-13 | 辽宁分子流科技有限公司 | Production equipment for preparing flexible organic new energy battery assembly |
| CN115198245A (en) * | 2022-07-18 | 2022-10-18 | 浙江弘康半导体技术股份有限公司 | Oxide high-barrier film, preparation method and vacuum winding coating equipment |
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| CN103290385A (en) | 2013-09-11 |
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Address after: Building 4, Haiyin Technology Industrial Park, No.1 Industrial Avenue, Banfu Community, Banfu Town, Zhongshan City, Guangdong Province, 528400 Patentee after: Guangdong Sheng Boer Photoelectric Technology Co.,Ltd. Address before: 528400 Room 403, four floor, government side economic and trade building, 25 of ban Fu town, 25 of ban Fu Road, Zhongshan, Guangdong. Patentee before: Guangdong Sheng Boer Photoelectric Technology Co.,Ltd. |
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