CN206127418U - A high vacuum sputtering system of volume to volume for flexible electronic component - Google Patents
A high vacuum sputtering system of volume to volume for flexible electronic component Download PDFInfo
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- CN206127418U CN206127418U CN201621196623.1U CN201621196623U CN206127418U CN 206127418 U CN206127418 U CN 206127418U CN 201621196623 U CN201621196623 U CN 201621196623U CN 206127418 U CN206127418 U CN 206127418U
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- electronic component
- flexible substrate
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Abstract
The utility model discloses a high vacuum sputtering system of volume to volume for flexible electronic component, wherein, the sputter system architecture is: controlling both sides and setting up sample cavity and process chamber separately, sample cavity and process chamber feed through mutually, are fixed with the isolated device in vacuum above the intercommunication part, and the lower end is fixed with down the isolated device in vacuum, it receives material roller, blowing roller, protection film blowing roller and receives the material roller to have set gradually the protection film in the sample cavity, marcing the flow, flexible substrate be provided with a plurality of guide rolls on, be provided with the coating film roller in process chamber to be provided with direct current sputtering source, magnetron sputtering device and baffle with the supporting work of sputtering of coating film roller. The utility model discloses flexibility lining ground warp thread does not touch to when crossing the running roller and spatters surfacing, and increases the isolated device in vacuum, has reduced the substrate and has changed the time, has improved the quantity of output of interior coiled material of unit interval, add heating device and surface treatment module, improved the coating film quality, improved flexible electronic component's yields.
Description
Technical field
This utility model is related to flexible electronic component manufacturing equipment field, and in particular to a kind of for flexible electronic component
Volume to volume fine vacuum sputter system.
Background technology
In prior art, the vacuum coating equipment for having a kind of volume to volume magnetic control sputtering cathode to combine with column multi-arc source,
Which includes unreeling room, coating chamber and winding room, has the long and narrow thin seam that can pass through flexible substrate between retractable volume room and coating chamber,
Central coating chamber is provided with chill roll, and its resist technology is using linear plasma source, magnetic control sputtering cathode, column multi-arc source institute
Corresponding gun body, is independently ventilated using semi open model, and semi open model cavity air pressure and gas component are suitably adjustable.
In said apparatus, no matter before and after sputter, roller can all touch sputter face, this easy scratch flexible electronic component,
Because when roller surface does not totally have granule to adhere to, now coiled material affects the yields of product through will result in fixed scratch.
In addition, since it is desired that reach high vacuum state, can just carry out sputtering process processing procedure, thus evacuation time-consuming.The design does not have yet
There is protection film device, when the coil is finished, if when winding, having granule to take in coiled strip, coiled strip will be caused to produce fixation
Defect；Also without heater and surface processing device, material moisture content and surface can not be removed to the material before sputter
Impurity.
Prior art is primarily present following deficiency：1st, when flexible electronic component is made, its substrate surface holds through running roller
Defect or damage are easily caused, causes subsequent technique processing procedure yields to reduce.2nd, unprotected film before and after coiled material sputter, in winding
Surface scratches are easily caused, or granule income produces defect.3rd, each sputter is required for just carrying out sputter when fine vacuum,
Use duration.4th, sputter coiled material removes surface impurity, causes adhesive force not good not through surface treatment.5th, sputter coiled material supplied materials
It is too high containing aqueous vapor, cause that the process time is long, film forming is poor quality.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of volume to volume fine vacuum for flexible electronic component
Sputter system, flexible substrate do not touch sputter face when running roller, increase vacuum insulating device, when reducing coiled material replacing
Between, improve the quantum of output of coiled material in the unit interval；Heater and surface treatment module are added, plated film product are improve
Matter, it is ensured that the yields of follow-up flexible electronic component.
To solve above-mentioned technical problem, the technical solution adopted in the utility model is：
A kind of volume to volume fine vacuum sputter system for flexible electronic component, its structure is：The right and left sets up sample introduction separately
Chamber and process cavity, the sample cavity are connected with process cavity, and vacuum insulating device is fixedly arranged above in place of connection, and lower section is solid
Surely there is lower vacuum insulating device；Protecting film material receiving roller, emptying roller, protecting film emptying roller and rewinding are disposed with sample introduction intracavity
Roller, the protecting film material receiving roller and emptying roller are used to tear flexible substrate protecting film, and the protecting film emptying roller and material receiving roller are used
Flexible substrate addition protecting film after to sputtering；Some guide rollers are provided with flexible substrate traveling flow process；In process cavity
Film coating roller is inside provided with, and is provided with d.c. sputtering source, magnetic control sputtering device and the gear for carrying out sputtering work supporting with film coating roller
Plate.
According to such scheme, surface treatment module is additionally provided with the technique intracavity, for increasing flexible substrate to splashing
The tack and removal relative impurity of plating metal.
According to such scheme, heater is additionally provided with the sample introduction intracavity, for removing flexible substrate aqueous vapor.
According to such scheme, deviation correcting device is additionally provided with sample introduction intracavity, walk for adjusting flexible substrate.
According to such scheme, upper vacuum insulating device and lower vacuum insulating device are rubber-like macromolecular material or metal
The vacuum insulation scope of material, the upper vacuum insulating device and lower vacuum insulating device is：Fine vacuum 1 × 10-3～1 × 10- 6Mbar, coarse vacuum 1 × 103More than mbar.
Compared with prior art, the beneficial effects of the utility model are：
1 utilizes height vacuum insulating device, process cavity is maintained after fine vacuum, after can reducing when change of lap material
It is the time of continuous technique evacuation, time-consuming.
2 will make the substrate of flexible electronic component, and its sputtered surfaces all avoids running roller front face, and by heating
System, superficial treatment system, control after face quality reaches good plating film quality, to obtain good plated film effect before sputter
Really.
3 are unreeling section, are also wound using protecting film, make it is every it is a roll of participate in plated film after can not be subject to extraneous impurity and
Particle contamination, lifts the yields of plated film finished product.
Description of the drawings
Fig. 1 is the volume to volume fine vacuum sputter system structural representation in this utility model for flexible electronic component.
In figure：1- sample cavitys；2- protecting film material receiving rollers；3- emptying rollers；4- protecting film emptying rollers；5- material receiving rollers；6- rectifies a deviation
Device；Vacuum insulating device under 7-；8- process cavities；9- film coating rollers；10- d.c. sputterings source；11- magnetic control sputtering devices；12- keeps off
Plate；13- is surface-treated module；The upper vacuum insulating devices of 14-；15- heaters；16- guide rollers.
Specific embodiment
With reference to the accompanying drawings and detailed description this utility model is described in further detail.
Flexible electronic component processing procedure is mainly comprising coating process processing procedure, sputtering process processing procedure, annealing process processing procedure, etching work
Skill processing procedure, through coating in layers, development, etching, stripping process, by the source electrode in the middle of flexible electronic component, gate, collection
Pole, quasiconductor, stacked dielectric layer are into a complete electronic component.In electronic component, the conductor for mainly using has source electrode, lock
Pole, collector, these conductors are mainly by metal (such as gold, silver, copper, aluminum, chromium, copper alloy, silver alloy etc.) or conductive material ITO
Constitute Deng oxide, and these conductors are all by physical vapor deposition or hot evaporation work in current manufacturing process, mostly
Skill is reaching quality after good film.
In existing process processing procedure, most commonly sputtering process, sputtering process principle be using ionic dissociation after it is dynamic
Can go to clash into target, target atom is splashed on substrate, the effect of plated film is reached.This utility model is by a kind of volume to volume
Making flexible electronic component, in electronic component, common defect is sputter system：Having foreign body to fall in element causes circuit short
Road or open circuit；There is scratch on surface, causes face tack not good；Leakage current causes hydraulic performance decline.
Retractable volume is in same chamber by this utility model, and sputtering process is in another chamber, middle using true
Empty barrier means isolate two chambers, and then reduce the pumpdown time required for sputtering process；For flexible electronic component
Yields viewpoint is set out, it is considered to all of roller in cavity, and the sputter face of substrate is neither touched in all making technologies, therefore
Can lift dose rate, reduce the defect that substrate is caused because of friction, more protection film device be added in retractable volume, reach after plated film immediately
The effect of protection, reduces the granule in income volume.
By this utility model, before all product sputters, using heater 15 and surface treatment module 13 by substrate
Aqueous vapor is excluded, while carrying out surface cleaning, makes substrate surface that kilter is reached before plated film, and substrate sputtered surfaces are neither contacted
To running roller, running roller scratch substrate surface, and the product after the completion of sputter is prevented to be coated with by protecting film, it is ensured that product quality.
Sample cavity 1 and process cavity 8 are designed using High and low type vacuum insulating, during change of lap, are isolated sample cavity 1 and process cavity 8, are made process cavity 8
After the completion of high vacuum state, change of lap, as long as carrying out sputtering process flow process by change of lap cavity is evacuated to coarse vacuum, during saving
Between.
This utility model sputter system structure is：The right and left sets up sample cavity 1 and process cavity 8, the sample cavity 1 and work separately
Skill chamber 8 is connected, and is fixedly arranged above vacuum insulating device 14 in place of connection, lower section be fixed with lower vacuum insulating device 7 (on
The vacuum insulation scope of vacuum insulating device 14 and lower vacuum insulating device 7 is：Fine vacuum 1 × 10-3～1 × 10-6Mbar is low
Vacuum 1 × 103More than mbar)；Protecting film material receiving roller 2, emptying roller 3, protecting film emptying roller 4 are disposed with sample cavity 1
With material receiving roller 5, the protecting film material receiving roller 2 and emptying roller 3 are used to tear flexible substrate protecting film, the protecting film emptying roller 4
With material receiving roller 5 for the flexible substrate addition protecting film after sputtering；Some guiding are provided with flexible substrate traveling flow process
Roller 16；Film coating roller 9 is provided with process cavity 8, and is provided with the d.c. sputtering source for carrying out sputtering work supporting with film coating roller 9
10th, magnetic control sputtering device 11 and baffle plate 12.
As improvement, surface treatment module 13 is additionally provided with process cavity 8, for increasing flexible substrate to jet-plating metallization
Tack and remove relative impurity.Heater 15 is additionally provided with sample cavity 1, for removing flexible substrate aqueous vapor.
Deviation correcting device 6 is additionally provided with sample cavity 1, is walked for adjusting flexible substrate.
The film plating process of this utility model device is divided into following four big steps：
Step one
Open sample cavity 1 and flexible substrate is put into into emptying roller 3, substrate front end vacation tape splicing is pulled out, protecting film is torn and is incited somebody to action
Protecting film is fixed on protecting film material receiving roller 2, after fixing, by false tape splicing along guide roller 16 sequentially through heater 15,
Upper and lower vacuum insulating device 14,7, surface treatment module 13, and material is worn to material receiving roller 5 along film coating roller 9, then protecting film is put into
Protecting film is pulled out and is fixed to material receiving roller 5 by protecting film emptying roller 4, closes sample cavity 1.Emptying roller 3 and material receiving roller 5 are set,
Take substrate out of heater 15, sample cavity 1 and process cavity 8 are carried out into vacuum respectively using upper and lower vacuum insulating device 14,7 and is taken out
Gas.
Step 2
When setting process conditions pressure is reached, Ar gas is passed through to process cavity 8, open upper and lower vacuum insulating device 14,7,
Balance 8 pressure of sample cavity 1 and process cavity, starts heater 15 and removes flexible substrate surface aqueous vapor, open surface treatment therewith
Module 13, removes flexible substrate surface impurity, it is ensured that the face quality before plated film maintains high cleaning, starts coating process.
The flexible substrate (PET, PEN, rustless steel flexible substrate) for being intended to sputter is evacuated to vacuum values higher than 10-7Mbar, from
1 coiled strip end of sample cavity releases, while tearing protecting film, removes the aqueous vapor on substrate through heater 15, into process cavity 8
Afterwards, plasma-based is produced using surface treatment module 13, plasma-based bombardment substrate surface increases tack of the substrate to jet-plating metallization,
Remove relative impurity.Any impurity can all cause short circuit and defect in flexible display element.Before completing sputter
Preparation, film start through noble gases Ar, Ar pureness specifications need to reach more than 99.9995% could using in electric field and
In the presence of alternating magnetic field, Ar gas is dissociated into high energy particle, clashes into metal targets (the such as metal such as copper, copper alloy, silver, silver alloy
Material), after energy exchange, target material surface atom is transferred to substrate surface from former lattice and forms film, using upper vacuum insulating device
14 and lower vacuum insulating device 7 isolation sample cavity 1 and process cavity 8, make process cavity 8 maintain 10-5mbar.Wherein material retractable roller is straight
Footpath is all needed more than 152mm, tension value between 30～1000N/m, and face uniformity maintains 100nm ± 5%.
Step 3
After the completion of sputter, by sputter good flexible substrate income material receiving roller 5, determine that flexible substrate length is received completely
Enter, close vacuum insulating device, completely cut off the vacuum values of sample cavity 1 and process cavity 8, process cavity 8 is maintained in high vacuum environment,
Sample cavity 1 is ventilated body, until which is 1 atmospheric pressure, is subsequently changed flexible substrate, empty is taken down and put from emptying roller 3
Upper new flexible substrate, the flexible substrate for having plated film is removed from material receiving roller 5.
Step 4
As process cavity 8 to have been maintained the state of fine vacuum for upper vacuum insulating device 14 and lower vacuum insulating device 7,
Therefore the pumpdown time can be reduced, after vacuum values are reached, repeat step two to step 3 carries out coating process.
Claims (5)
1. a kind of volume to volume fine vacuum sputter system for flexible electronic component, it is characterised in that the right and left sets up sample introduction separately
Chamber (1) and process cavity (8), the sample cavity (1) are connected with process cavity (8), be fixedly arranged above in place of connection vacuum every
Exhausted device (14), lower section is fixed with lower vacuum insulating device (7)；Protecting film material receiving roller is disposed with sample cavity (1)
(2), emptying roller (3), protecting film emptying roller (4) and material receiving roller (5), the protecting film material receiving roller (2) and emptying roller (3) are for tearing
Flexible substrate protecting film is opened, the protecting film emptying roller (4) and material receiving roller (5) are for the flexible substrate addition protection after sputtering
Film；Some guide rollers (16) are provided with flexible substrate traveling flow process；Film coating roller (9) is provided with process cavity (8), and is set
It is equipped with d.c. sputtering source (10), magnetic control sputtering device (11) and the baffle plate (12) for carrying out sputtering work supporting with film coating roller (9).
2. the volume to volume fine vacuum sputter system of flexible electronic component is used for as claimed in claim 1, it is characterised in that in institute
State and in process cavity (8), be additionally provided with surface treatment module (13), for increasing flexible substrate to the tack of jet-plating metallization and going
Except relative impurity.
3. the volume to volume fine vacuum sputter system of flexible electronic component is used for as claimed in claim 1, it is characterised in that in institute
State in sample cavity (1) and be additionally provided with heater (15), for removing flexible substrate aqueous vapor.
4. the volume to volume fine vacuum sputter system for flexible electronic component as described in claim 1 or 2 or 3, its feature exist
In being additionally provided with deviation correcting device (6) in the sample cavity (1), walk for adjusting flexible substrate.
5. the volume to volume fine vacuum sputter system of flexible electronic component is used for as claimed in claim 1, it is characterised in that upper true
Empty barrier means (14) and lower vacuum insulating device (7) are rubber-like macromolecular material or metal material, the upper vacuum every
The vacuum insulation scope of absolutely device (14) and lower vacuum insulating device (7) is：Fine vacuum 1 × 10-3～1 × 10-6Mbar is low true
Empty 1 × 103More than mbar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621196623.1U CN206127418U (en) | 2016-11-03 | 2016-11-03 | A high vacuum sputtering system of volume to volume for flexible electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621196623.1U CN206127418U (en) | 2016-11-03 | 2016-11-03 | A high vacuum sputtering system of volume to volume for flexible electronic component |
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| Publication Number | Publication Date |
|---|---|
| CN206127418U true CN206127418U (en) | 2017-04-26 |
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ID=58578179
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621196623.1U Active CN206127418U (en) | 2016-11-03 | 2016-11-03 | A high vacuum sputtering system of volume to volume for flexible electronic component |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3744873A1 (en) * | 2019-05-30 | 2020-12-02 | Sumitomo Metal Mining Co., Ltd. | Vacuum deposition apparatus and vacuum deposition method |
| CN113416941A (en) * | 2021-06-29 | 2021-09-21 | 辽宁分子流科技有限公司 | A device is changed to winding up roller for roll-to-roll equipment |
| CN117289520A (en) * | 2023-11-27 | 2023-12-26 | 成都捷翼电子科技有限公司 | Manufacturing method of roll-to-roll flexible electronic paper membrane |
-
2016
- 2016-11-03 CN CN201621196623.1U patent/CN206127418U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3744873A1 (en) * | 2019-05-30 | 2020-12-02 | Sumitomo Metal Mining Co., Ltd. | Vacuum deposition apparatus and vacuum deposition method |
| CN113416941A (en) * | 2021-06-29 | 2021-09-21 | 辽宁分子流科技有限公司 | A device is changed to winding up roller for roll-to-roll equipment |
| CN117289520A (en) * | 2023-11-27 | 2023-12-26 | 成都捷翼电子科技有限公司 | Manufacturing method of roll-to-roll flexible electronic paper membrane |
| CN117289520B (en) * | 2023-11-27 | 2024-01-26 | 成都捷翼电子科技有限公司 | Manufacturing method of roll-to-roll flexible electronic paper membrane |
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