CN204596782U - 散热器 - Google Patents

散热器 Download PDF

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Publication number
CN204596782U
CN204596782U CN201390000739.1U CN201390000739U CN204596782U CN 204596782 U CN204596782 U CN 204596782U CN 201390000739 U CN201390000739 U CN 201390000739U CN 204596782 U CN204596782 U CN 204596782U
Authority
CN
China
Prior art keywords
base plate
heat pipe
radiating fin
radiator
heated sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201390000739.1U
Other languages
English (en)
Chinese (zh)
Inventor
佐佐木泰海
川畑贤也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Application granted granted Critical
Publication of CN204596782U publication Critical patent/CN204596782U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201390000739.1U 2012-12-06 2013-12-04 散热器 Expired - Fee Related CN204596782U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP2012-267171 2012-12-06
JP2012267171 2012-12-06
PCT/JP2013/082635 WO2014088044A1 (ja) 2012-12-06 2013-12-04 ヒートシンク

Publications (1)

Publication Number Publication Date
CN204596782U true CN204596782U (zh) 2015-08-26

Family

ID=50883461

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201390000739.1U Expired - Fee Related CN204596782U (zh) 2012-12-06 2013-12-04 散热器

Country Status (4)

Country Link
US (1) US20150219400A1 (ja)
JP (1) JP5579349B1 (ja)
CN (1) CN204596782U (ja)
WO (1) WO2014088044A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107072110A (zh) * 2017-01-09 2017-08-18 四川埃姆克伺服科技有限公司 一种用于伺服驱动器的穿墙式散热组件
CN108387026A (zh) * 2017-12-22 2018-08-10 青岛海尔智能技术研发有限公司 换热装置及具有该换热装置的半导体制冷设备
CN109168288A (zh) * 2014-09-26 2019-01-08 华为技术有限公司 散热器及电子产品

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6203693B2 (ja) * 2014-09-12 2017-09-27 Idec株式会社 電気機器
US9468086B1 (en) * 2015-04-03 2016-10-11 Motorola Soultions, Inc. Electronic device including an externally-mounted heat pipe
TWM512883U (zh) * 2015-05-05 2015-11-21 Cooler Master Co Ltd 散熱模組、水冷式散熱模組及散熱系統
JP5945047B1 (ja) 2015-08-19 2016-07-05 株式会社フジクラ 携帯型電子機器用熱拡散板
USD805043S1 (en) * 2016-02-22 2017-12-12 Heatscape.Com, Inc. Heatsink for optical modules
JP2017183590A (ja) * 2016-03-31 2017-10-05 古河電気工業株式会社 ヒートシンク
JP6707960B2 (ja) * 2016-04-07 2020-06-10 富士通株式会社 電子機器
TWD181170S (zh) * 2016-07-22 2017-02-01 黃崇賢 散熱器(1)
TWD181171S (zh) * 2016-07-22 2017-02-01 黃崇賢 散熱器(2)
JP6666560B2 (ja) * 2016-09-29 2020-03-18 富士通クライアントコンピューティング株式会社 放熱部品及び放熱部品を備える端末装置
US10667378B1 (en) * 2019-01-14 2020-05-26 Eagle Technology, Llc Electronic assemblies having embedded passive heat pipes and associated method
KR200496590Y1 (ko) * 2021-06-08 2023-03-08 주식회사 한미마이크로닉스 메모리 유닛용 쿨러
WO2023276940A1 (ja) * 2021-06-30 2023-01-05 日本軽金属株式会社 熱デバイス冷却用ヒートシンク

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6626233B1 (en) * 2002-01-03 2003-09-30 Thermal Corp. Bi-level heat sink
US6918429B2 (en) * 2003-11-05 2005-07-19 Cpumate Inc. Dual-layer heat dissipating structure
US7021368B2 (en) * 2003-11-12 2006-04-04 Cpumate Inc. Heat dissipating device with uniform heat points
JP4495021B2 (ja) * 2005-03-30 2010-06-30 古河電気工業株式会社 車両搭載用ヒートシンク
TW200830976A (en) * 2007-01-11 2008-07-16 Delta Electronics Inc Heat dissipating apparatus, heat dissipating base and its manufacturing method
US7443680B1 (en) * 2007-04-04 2008-10-28 Fu Zhun Precision Industry (Shen Zhen) Co., Lts. Heat dissipation apparatus for heat producing device
US7942194B2 (en) * 2007-04-10 2011-05-17 Fujikura Ltd. Heat sink
US20080310105A1 (en) * 2007-06-14 2008-12-18 Chia-Chun Cheng Heat dissipating apparatus and water cooling system having the same
US7643293B2 (en) * 2007-12-18 2010-01-05 Hon Hai Precision Industry Co., Ltd. Heat dissipation device and a method for manufacturing the same
CN101528018A (zh) * 2008-03-07 2009-09-09 富准精密工业(深圳)有限公司 散热装置及其制造方法
US8002019B2 (en) * 2008-03-20 2011-08-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
JP5227672B2 (ja) * 2008-06-17 2013-07-03 古河電気工業株式会社 ヒートパイプの固定方法およびヒートシンク
JP2010161177A (ja) * 2009-01-07 2010-07-22 Kiko Kagi Kofun Yugenkoshi 電子デバイスの放熱構造及びその製造方法
CN201393359Y (zh) * 2009-02-26 2010-01-27 富准精密工业(深圳)有限公司 散热装置及其基座
CN102118952A (zh) * 2009-12-30 2011-07-06 富准精密工业(深圳)有限公司 散热装置
JP5228115B2 (ja) * 2010-01-18 2013-07-03 古河電気工業株式会社 ヒートシンク
US8297062B2 (en) * 2010-02-18 2012-10-30 Golden Sun News Techniques Co., Ltd. Heat-dissipating device for supplying cold airflow
CN102484105A (zh) * 2010-02-26 2012-05-30 古河电气工业株式会社 散热器
TW201037256A (en) * 2010-05-14 2010-10-16 Asia Vital Components Co Ltd Heat dissipating device and manufacturing method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109168288A (zh) * 2014-09-26 2019-01-08 华为技术有限公司 散热器及电子产品
CN109168288B (zh) * 2014-09-26 2020-07-14 华为技术有限公司 散热器及电子产品
CN107072110A (zh) * 2017-01-09 2017-08-18 四川埃姆克伺服科技有限公司 一种用于伺服驱动器的穿墙式散热组件
CN108387026A (zh) * 2017-12-22 2018-08-10 青岛海尔智能技术研发有限公司 换热装置及具有该换热装置的半导体制冷设备
CN108387026B (zh) * 2017-12-22 2020-12-15 青岛海尔智能技术研发有限公司 换热装置及具有该换热装置的半导体制冷设备

Also Published As

Publication number Publication date
US20150219400A1 (en) 2015-08-06
JPWO2014088044A1 (ja) 2017-01-05
JP5579349B1 (ja) 2014-08-27
WO2014088044A1 (ja) 2014-06-12

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150826

Termination date: 20211204

CF01 Termination of patent right due to non-payment of annual fee