CN204045592U - A kind of red blue dichromatic LED - Google Patents

A kind of red blue dichromatic LED Download PDF

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Publication number
CN204045592U
CN204045592U CN201420506009.5U CN201420506009U CN204045592U CN 204045592 U CN204045592 U CN 204045592U CN 201420506009 U CN201420506009 U CN 201420506009U CN 204045592 U CN204045592 U CN 204045592U
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CN
China
Prior art keywords
red
blue
elargol
bowl cup
crystal grain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420506009.5U
Other languages
Chinese (zh)
Inventor
丁明晓
张伟
张继良
路尚伟
王兴超
杨玉杰
高洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shandong Yiguang Electronic Joint Stock Co Ltd
Original Assignee
Shandong Yiguang Electronic Joint Stock Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shandong Yiguang Electronic Joint Stock Co Ltd filed Critical Shandong Yiguang Electronic Joint Stock Co Ltd
Priority to CN201420506009.5U priority Critical patent/CN204045592U/en
Application granted granted Critical
Publication of CN204045592U publication Critical patent/CN204045592U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Led Device Packages (AREA)

Abstract

The utility model discloses a kind of red blue dichromatic LED, belong to technical field of semiconductor device.Be made up of red crystals, blue dies, support bowl cup, altogether negative pole, blue positive pole, red positive pole, spun gold, red crystals sticks to the one end in support bowl cup by elargol, and blue dies sticks to the other end in support bowl cup by insulating cement; Be connected by spun gold between red crystals with red positive pole, between blue dies with blue positive pole, adopt non-cavity epoxy resin plastic-sealed body to encapsulate.The utility model has the advantages that and adopt conductive coefficient and large elargol, the bonding crystal grain of insulating cement of viscosity, solidify respectively by nitrogen oven, impel the fully bonding of elargol, insulating cement, can adapt to the resistance to soldering heat condition of higher temperature, properties of product are stable, reliable.

Description

A kind of red blue dichromatic LED
Technical field
The utility model relates to technical field of semiconductor device, particularly relates to a kind of light-emitting diode.
Background technology
Existing light-emitting diode, particularly dichromatic LED, major failure shows crystal grain and support bowl cup poor adhesion under the high temperature conditions, causes resistance to soldering heat difference to produce early failure, makes it apply and be extremely restricted.
Utility model content
The purpose of this utility model overcomes the deficiencies in the prior art, provides a kind of crystal grain and support bowl cup to have comparatively high-adhesiveness, resistance to soldering heat red blue dichromatic LED of good performance.
A kind of red blue dichromatic LED of the utility model, be made up of red crystals, blue dies, support bowl cup, altogether negative pole, blue positive pole, red positive pole, spun gold, described red crystals sticks to the one end in support bowl cup by elargol, described blue dies sticks to the other end in support bowl cup by insulating cement, and elargol and the insulating cement of bonding two crystal grain are not in contact with each other; Be connected by described spun gold between described red crystals with red positive pole, be connected by described spun gold between described blue dies with blue positive pole.
The support of described support bowl cup is three-prong Intermediate Gray bowl cup support, described spun gold diameter 25 μm, containing gold 99.99%, described elargol conductive coefficient is 3.61W/mK, viscosity is 8700cps at 25 DEG C, and described insulating cement conductive coefficient is 0.9W/mK, viscosity is 12500cps at 25 DEG C.
It is bonding that described crystal grain and the bonding mode of support bowl cup are that nitrogen oven solidifies.First red dies is bonded in one end 1/4 place in support bowl cup by elargol by automatic bonder, the 160 DEG C of baking ovens putting into lasting inflated with nitrogen toast 110 minutes, put normal temperature lower 30 minutes, by automatic bonder blue light crystal grain is bonded in the other end 1/4 place in support bowl cup again by insulating cement, the 150 DEG C of baking ovens putting into lasting inflated with nitrogen toast 30 minutes, and two kinds of bonded adhesivess are fully solidified.
Described red crystals all around elargol height is 1/4 to 1/3 of crystal grain height, and described blue dies all around insulating cement height is 1/6 to 1/5 of crystal grain height.
The packaged type of described light-emitting diode is the encapsulation of non-cavity epoxy resin plastic-sealed body.
Described elargol, conductive coefficient is 3.61W/mK, viscosity is 8700cps at 25 DEG C, and the conductive coefficient being better than common elargol is 1.2W/mK, viscosity is 6000cps at 25 DEG C; Described insulating cement, conductive coefficient is 0.9W/mK, viscosity is 12500cps at 25 DEG C, and the conductive coefficient being better than common insulating cement is 0.2W/mK, viscosity is 9000cps at 25 DEG C, is all adapted to the resistance to soldering heat condition of the higher temperature of LED component.
Described crystal grain and support are bonding by elargol, and crystal grain is all around encased by elargol, and all around elargol height should be 1/4 to 1/3 crystal grain height, and crystal grain and support bowl cup are combined closely, press crystal grain feel without suspension and crystal grain without breakage; Described crystal grain and support are bonding by insulating cement, and crystal grain is all around encased by insulating cement, and all around insulating cement height should be 1/6 to 1/5 crystal grain height, and crystal grain and support bowl cup are combined closely, press crystal grain feel without suspension and crystal grain without breakage.
The utility model has the advantages that and adopt conductive coefficient and large elargol, the bonding crystal grain of insulating cement of viscosity, solidify respectively by nitrogen oven, impel the fully bonding of elargol, insulating cement, can adapt to the resistance to soldering heat condition of higher temperature, properties of product are stable, reliable.
Accompanying drawing explanation
Fig. 1 is the red blue dichromatic LED of the utility model non-package support bowl cup structure schematic diagram;
Fig. 2 is the non-package support vertical view of the red blue dichromatic LED of the utility model;
Fig. 3 is the red blue dichromatic LED contour structures schematic diagram of the utility model.
Embodiment
Below in conjunction with accompanying drawing, the utility model is elaborated:
As shown in Figure 1, Figure 2, Figure 3 shows, in figure: red crystals 1, elargol 2, blue dies 3, insulating cement 4, support bowl cup 5, altogether negative pole 6, blue positive pole 7, red positive pole 8, spun gold 9.
It is made up of red crystals, elargol, blue dies, insulating cement, support bowl cup, altogether negative pole, blue positive pole, red positive pole, spun gold, the support of described support bowl cup has three-prong band bowl cup support, on described support, red crystals sticks to one end in support bowl cup by elargol 2, and blue dies sticks to the other end in support bowl cup by insulating cement; It is bonding that described crystal grain and support bowl cup adopt nitrogen oven to solidify when bonding, first red crystals is bonded in one end 1/4 place in support bowl cup by elargol by automatic bonder, the 160 DEG C of baking ovens putting into lasting inflated with nitrogen toast 110 minutes, put normal temperature lower 30 minutes, by automatic bonder blue dies is bonded in the other end 1/4 place in support bowl cup again by insulating cement, the 150 DEG C of baking ovens putting into lasting inflated with nitrogen toast 30 minutes, two kinds of bonded adhesivess are fully solidified, bond degree between crystal grain and support bowl cup is strengthened, improves resistance to soldering heat ability.Between red crystals with red positive pole, between blue dies with blue positive pole by diameter 25 μm, containing gold 99.99% spun gold be connected; It adopts non-cavity epoxy resin plastic-sealed body to encapsulate.
Above-described embodiment, just the utility model more preferably one of embodiment, the usual change that those skilled in the art carries out within the scope of technical solutions of the utility model and replacement all should be included within protection range of the present utility model.

Claims (8)

1. a red blue dichromatic LED, it is characterized in that: be made up of red crystals, blue dies, support bowl cup, altogether negative pole, blue positive pole, red positive pole, spun gold, described red crystals sticks to the one end in support bowl cup by elargol, described blue dies sticks to the other end in support bowl cup by insulating cement, and elargol and the insulating cement of bonding two crystal grain are not in contact with each other; Be connected by described spun gold between described red crystals with red positive pole, be connected by described spun gold between described blue dies with blue positive pole.
2. red blue dichromatic LED according to claim 1, it is characterized in that: the support of described support bowl cup is three-prong Intermediate Gray bowl cup support, described spun gold diameter 25 μm, containing gold 99.99%, described elargol conductive coefficient is 3.61W/mK, viscosity is 8700cps at 25 DEG C, and described insulating cement conductive coefficient is 0.9W/mK, viscosity is 12500cps at 25 DEG C.
3. red blue dichromatic LED according to claim 1 and 2, is characterized in that: it is bonding that described crystal grain and the bonding mode of support bowl cup are that nitrogen oven solidifies.
4. red blue dichromatic LED according to claim 1 and 2, is characterized in that: described red crystals all around elargol height is 1/4 to 1/3 of crystal grain height, and described blue dies all around insulating cement height is 1/6 to 1/5 of crystal grain height.
5. red blue dichromatic LED according to claim 3, is characterized in that: described red crystals all around elargol height is 1/4 to 1/3 of crystal grain height, and described blue dies all around insulating cement height is 1/6 to 1/5 of crystal grain height.
6. red blue dichromatic LED according to claim 1 and 2, is characterized in that: the packaged type of described light-emitting diode is the encapsulation of non-cavity epoxy resin plastic-sealed body.
7. red blue dichromatic LED according to claim 3, is characterized in that: the packaged type of described light-emitting diode is the encapsulation of non-cavity epoxy resin plastic-sealed body.
8. red blue dichromatic LED according to claim 4, is characterized in that: the packaged type of described light-emitting diode is the encapsulation of non-cavity epoxy resin plastic-sealed body.
CN201420506009.5U 2014-09-04 2014-09-04 A kind of red blue dichromatic LED Expired - Fee Related CN204045592U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420506009.5U CN204045592U (en) 2014-09-04 2014-09-04 A kind of red blue dichromatic LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420506009.5U CN204045592U (en) 2014-09-04 2014-09-04 A kind of red blue dichromatic LED

Publications (1)

Publication Number Publication Date
CN204045592U true CN204045592U (en) 2014-12-24

Family

ID=52246229

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420506009.5U Expired - Fee Related CN204045592U (en) 2014-09-04 2014-09-04 A kind of red blue dichromatic LED

Country Status (1)

Country Link
CN (1) CN204045592U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141224

Termination date: 20160904