CN203377253U - Small module high strength LED package structure with green chip and red fluorescence powder - Google Patents
Small module high strength LED package structure with green chip and red fluorescence powder Download PDFInfo
- Publication number
- CN203377253U CN203377253U CN201320372919.4U CN201320372919U CN203377253U CN 203377253 U CN203377253 U CN 203377253U CN 201320372919 U CN201320372919 U CN 201320372919U CN 203377253 U CN203377253 U CN 203377253U
- Authority
- CN
- China
- Prior art keywords
- cup
- chip
- fluorescence powder
- red fluorescence
- high strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a small module high strength LED package structure with a green chip and red fluorescence powder. The structure comprises a bracket and a two electrode green light chip. The bracket comprises a bowl cup and a cup wall. The bowl cup is in a flat square structure. The longitudinal section of the cup wall is trapezoid, and the cup wall is located on the edge of the bowl cup. The cup mouth of the cup wall is circular. The two electrode green light chip is arranged on the upper surface of the bowl cup. The two electrode green light chip is connected with electrodes on the bowl cup through two wires. A red fluorescent powder colloid layer is solidified around the two electrode green light chip. According to the utility model, the brightness is improved and the cost is reduced.
Description
Technical field
The utility model relates to LED encapsulation technology field, particularly relates to the little module high strength LED encapsulating structure that a kind of green chip adds red fluorescent material.
Background technology
What in existing LED encapsulation, luminescence chip adopted is the AllnGaP chip, and because the AllnGaP chip is generally single electrode, during encapsulation, positive-negative polarity can't be flexible, the emission wavelength that AllnGaP is chip itself, its emission wavelength is non-adjustable, and AllnGaP chip material is more crisp, easily damages.Adopt the LED brightness of AllnGaP chip package lower, cost is higher simultaneously.
The utility model content
Technical problem to be solved in the utility model is to provide the little module high strength LED encapsulating structure that a kind of green chip adds red fluorescent material, can improve luminosity and reduce costs.
The utility model solves the technical scheme that its technical problem adopts: provide a kind of green chip to add the little module high strength LED encapsulating structure of red fluorescent material, comprise support and bipolar electrode green glow chip, described support comprises bowl cup and a wall of cup; Described bowl cup is the positive square structure of flat; The longitudinal section of described wall of cup is trapezoidal, and is positioned at the edge of bowl cup, and the rim of a cup of described wall of cup is rounded; The upper surface of described bowl cup is equipped with described bipolar electrode green glow chip, and described bipolar electrode green glow chip is connected with the electrode on the bowl cup by two wires; Be solidified with the red fluorescence powder colloid layer around described bipolar electrode green glow chip.
Described bipolar electrode green glow chip is the InGaN chip.
Described red fluorescence powder colloid layer is stirred and is formed by red fluorescence powder and epoxy resin or silica gel.
Beneficial effect
Owing to having adopted above-mentioned technical scheme, the utility model compared with prior art, has following advantage and good effect: the utility model adopts bipolar electrode green glow chip, and when encapsulation, polarity can be carried out accommodation as required, and operability is stronger.Glow color of the present utility model can be regulated according to the concentration of red fluorescence powder, and implementation is flexible and changeable.Bipolar electrode green glow chip in the utility model can be selected the InGaN chip, and this chip material is harder, can improve the product quality reliability.
The accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of rim of a cup in the utility model;
Fig. 3 is the relative spectral figure of the utility model medium green optical chip;
Fig. 4 is the relative spectral figure of red fluorescence powder in the utility model;
Fig. 5 is the relative spectral figure of encapsulating structure of the present utility model.
Embodiment
Below in conjunction with specific embodiment, further set forth the utility model.Should be understood that these embodiment only are not used in restriction scope of the present utility model for the utility model is described.Should be understood that in addition those skilled in the art can make various changes or modifications the utility model after the content of having read the utility model instruction, these equivalent form of values fall within the application's appended claims limited range equally.
Execution mode of the present utility model relates to the little module high strength LED encapsulating structure that a kind of green chip adds red fluorescent material, as shown in Figure 1, comprises support 1 and bipolar electrode green glow chip 2, and described support 1 comprises bowl cup 11 and wall of cup 12; Described bowl cup 11 is the positive square structure of flat; The longitudinal section of described wall of cup 12 is trapezoidal, and is positioned at the edge of bowl cup 11, the rounded (see figure 2) of the rim of a cup of described wall of cup 12; The upper surface of described bowl cup 11 is equipped with described bipolar electrode green glow chip 2, and described bipolar electrode green glow chip 2 is connected with the electrode on bowl cup 11 by two wires 3; Be solidified with red fluorescence powder colloid layer 4 around described bipolar electrode green glow chip 2.Wherein, red fluorescence powder colloid layer 4 is stirred and is formed by red fluorescence powder and epoxy resin or silica gel.Because the longitudinal section of wall of cup is trapezoidal, the rim of a cup of wall of cup is rounded, thereby can strengthen reliability and applicable module fritter type products.
Wherein, described bipolar electrode green glow chip 2 is the InGaN chip.The utility model utilizes nitride red fluorescent powder (SrCa) AlSiN3:Eu/CaAlSin3:Eu to add that the 515-535nm indium nitride sows the green glow chip of (InGaN), by regulating the concentration 5% to 70% of fluorescent material, thereby inspire the LED of any wavelength between 535nm-620nm.Table 1 is the product light kilsyth basalt obtained after green glow chip and variable concentrations fluorescent powder packaging.
Green glow chip wavelength/nm | Fluorescent material concentration | Brightness/mcd |
515 | 5% | 4328 |
517.5 | 12.8% | 4269 |
520 | 20.7% | 4190 |
522.5 | 31.8% | 4113 |
525 | 42.95% | 4055 |
527.5 | 55.7% | 3994 |
530 | 70% | 3918 |
Fig. 3 is the relative spectral figure of medium green optical chip of the present invention, Fig. 4 is the relative spectral figure of red fluorescence powder in the present invention, Fig. 5 is the relative spectral figure of encapsulating structure of the present invention, as can be seen from Figure 5, by the wavelength that can send after green glow chip excitated red fluorescent powder, is the 565nm green-yellow light.
Utilize nitride red fluorescent powder (SrCa) AlSiN3:Eu/CaAlSin3:Eu to add that the 515-535nm indium nitride sows more than the brightness of the LED encapsulating structure that the green glow chip of (InGaN) obtains can reach 3900mcd, and the brightness of the LED encapsulating structure that only uses the AllnGaP chip to obtain is 2000mcd.
Manufacturing process of the present utility model is as follows:
A kind of above-mentioned green chip adds the method for packing of the little module high strength LED encapsulating structure of red fluorescent material, comprises the following steps:
(1) bipolar electrode green glow chip is placed on to the upper surface of bowl cup, and by wire, bipolar electrode green glow chip is connected with the electrode on the bowl cup.Wherein, bipolar electrode green glow chip can be the InGaN chip.
(2) preparation red fluorescence powder colloid layer, its concrete sub-step is at room temperature stirring 2-5 minute by red fluorescence powder and epoxy resin or silica gel, and rotating speed during stirring is 2000-3000 rev/min.Wherein, red fluorescence powder is (SrCa) AlSiN3:Eu/CaAlSin3:Eu, accounts for the 5%-70% of oeverall quality.By the mode stirred, can make red fluorescence powder be uniformly distributed, thereby make the luminous more even of LED encapsulating structure.
(3) the red fluorescence powder colloid layer is clicked and entered in the bowl cup of support, made red fluorescence powder colloid layer parcel green glow chip.
(4) solidify the red fluorescence powder colloid layer and complete encapsulation.
Be not difficult to find, the utility model adopts bipolar electrode green glow chip, and when encapsulation, polarity can be carried out accommodation as required, and operability is stronger.Glow color of the present utility model can be regulated according to the concentration of fluorescent material, and implementation is flexible and changeable.Bipolar electrode green glow chip in the utility model can be selected the InGaN chip, and this chip material is harder, can improve the product quality reliability.
Claims (3)
1. a green chip adds the little module high strength LED encapsulating structure of red fluorescent material, comprises support (1) and bipolar electrode green glow chip (2), it is characterized in that, described support (1) comprises bowl cup (11) and a wall of cup (12); Described bowl cup (11) is the positive square structure of flat; The longitudinal section of described wall of cup (12) is trapezoidal, and is positioned at the edge of bowl cup (11), and the rim of a cup of described wall of cup (12) is rounded; The upper surface of described bowl cup (11) is equipped with described bipolar electrode green glow chip (2), and described bipolar electrode green glow chip (2) is connected with the electrode on bowl cup (11) by two wires (3); Described bipolar electrode green glow chip (2) is solidified with red fluorescence powder colloid layer (4) on every side.
2. green chip according to claim 1 adds the little module high strength LED encapsulating structure of red fluorescent material, it is characterized in that, described bipolar electrode green glow chip (2) is the InGaN chip.
3. green chip according to claim 1 adds the little module high strength LED encapsulating structure of red fluorescent material, it is characterized in that, described red fluorescence powder colloid layer (4) is stirred and formed by red fluorescence powder and epoxy resin or silica gel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320372919.4U CN203377253U (en) | 2013-06-25 | 2013-06-25 | Small module high strength LED package structure with green chip and red fluorescence powder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320372919.4U CN203377253U (en) | 2013-06-25 | 2013-06-25 | Small module high strength LED package structure with green chip and red fluorescence powder |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203377253U true CN203377253U (en) | 2014-01-01 |
Family
ID=49839764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201320372919.4U Expired - Fee Related CN203377253U (en) | 2013-06-25 | 2013-06-25 | Small module high strength LED package structure with green chip and red fluorescence powder |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203377253U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103354258A (en) * | 2013-06-25 | 2013-10-16 | 宁波协源光电科技有限公司 | Structure and method for packaging small-module high-intensity LED formed by green chip and red phosphor |
-
2013
- 2013-06-25 CN CN201320372919.4U patent/CN203377253U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103354258A (en) * | 2013-06-25 | 2013-10-16 | 宁波协源光电科技有限公司 | Structure and method for packaging small-module high-intensity LED formed by green chip and red phosphor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104966775B (en) | White light LED and white light LED manufacturing method | |
CN103928450B (en) | Product for packaging LEDs with uniform light color and manufacturing method of product | |
CN103117353B (en) | A kind of fluorescent glue and the technique using fluorescent glue encapsulation white light LEDs | |
CN203377253U (en) | Small module high strength LED package structure with green chip and red fluorescence powder | |
CN203434190U (en) | Green chip and red fluorescence powder small module high luminous flux LED package structure | |
CN101707233A (en) | Light-emitting diode and manufacturing method thereof | |
CN203434184U (en) | Green chip and red fluorescence powder small module high refractive index LED package structure | |
CN203434189U (en) | Green chip and red fluorescence powder strip-shaped high strength LED package structure | |
CN203415613U (en) | Square type high-refractive-index LED packaging structure with red phosphor cured on green chip | |
CN203415614U (en) | Rectangular type high-light-flux LED packaging structure with red phosphor cured on green chip | |
CN203415615U (en) | Rectangular type high-refractive-index LED packaging structure with red phosphor cured on green chip | |
CN202561489U (en) | LED plant growth lamp | |
CN203377254U (en) | Strip high light flux LED package structure with green chip and red fluorescence powder | |
CN203415612U (en) | Bar type high-refractive-index LED packaging structure with red phosphor cured on green chip | |
CN209312793U (en) | A kind of adopting surface mounted LED lamp bead | |
CN201673934U (en) | Surface roughened LED packaging structure | |
CN203617333U (en) | Square-shaped high-luminous-flux LED encapsulating structure with green light chip and red phosphor | |
CN103361054A (en) | Synthesis method of red nitride fluorescent powder and LED (light-emitting diode) plant growth lamp | |
CN103579460B (en) | A kind of high-brightness white-light LED and manufacture method thereof | |
CN103354256A (en) | Structure and method for packaging rectangular high-refractive-index LED formed by green chip and red phosphor | |
CN203644774U (en) | LED bulb | |
CN103354257A (en) | Structure and method for packaging strip-shaped high-intensity LED formed by green chip and red phosphor | |
CN103354262A (en) | Structure and method for packaging strip-shaped high-luminous-flux LED formed by green chip and red phosphor | |
CN201956347U (en) | High-power LED (light-emitting diode) | |
CN103354260A (en) | Structure and method for packaging small-module high-luminous-flux LED formed by green chip and red phosphor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 315327, Ningbo, Zhejiang province Cixi City East Zhen Zhen Dong Village Patentee after: Ningbo Association of Optoelectronics Polytron Technologies Inc Address before: 315327, Ningbo, Zhejiang province Cixi City East Zhen Zhen Dong Village Patentee before: Ningbo Shining OptoElectronics Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140101 Termination date: 20210625 |